EP1AGX60DF780I6N - Arria GX FPGA, 60K LE, 3.125Gbps Transceivers
MPN: EP1AGX60DF780I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $240 | $24,000.00 |
| 500 | $218 | $109,000.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1AGX60DF780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX60DF780C6N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP1AGX60DF780C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX60DF780I6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX50DF780I6N
✅ Drop-In✓ In Stock
$255 / Unit
View Datasheet →EP1AGX50DF780I6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$295 / Unit
View Datasheet →EP1AGX60DF780I6N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 60,100 |
| Logic Array Blocks (LABs) | 3005 |
| Embedded Memory | 2,528,640 bits |
| Maximum User I/O | 350 |
| Transceivers | 3.125 Gbps (per Arria GX datasheet family spec) |
| Operating Temperature | -40C to +100C (industrial, I-grade) |
| Speed Grade | 6 |
| Package | 780-pin FBGA (FineLine BGA) |
| PLL Count | 4 (per Arria GX family datasheet) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / Pb-Free | Yes (suffix 'N') |
| RoHS Status | Compliant (per distributor listings) |
EP1AGX60DF780I6N 780-pin fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX60DF780I6N (780-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX60DF780I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60DF780I6N is suitable for 6 applications: PCI Express Gen1 Endpoint Card, Serial RapidIO Bridge / Switch, XAUI / 10 Gigabit Backplane Aggregation, Industrial Video Capture / Processing, Telecom Line Card / DSP Front-End, Aerospace / Defense Signal Processing.
PCI Express Gen1 Endpoint Card
The EP1AGX60DF780I6N fits PCI Express Gen1 endpoint designs with 60,100 logic elements that comfortably host a Gen1 x4 or x8 protocol stack plus user application logic. Its 3.125 Gbps transceivers natively support PCIe Gen1 PMA signalling without external PHYs, reducing BOM cost and board area. Industrial temperature grade (I6N) allows deployment in factory-floor controllers and outdoor telecom equipment where commercial-grade parts would thermally derate. The 780-FBGA package supports the required transceiver channel count and 350 user I/O for legacy parallel peripheral bridging. Designers should use Altera's PCIe Compiler IP within Quartus II 9.0+ for hard IP integration.
Recommended
Serial RapidIO Bridge / Switch
The EP1AGX60DF780I6N's 3.125 Gbps transceivers provide native RapidIO physical-layer support, and 60,100 logic elements accommodate the RapidIO logical-layer controller plus packet-routing fabric for small switch configurations. Industrial temperature grade enables deployment in telecom base stations, military radios, and signal-processing chassis where -40C cold-start is mandatory. The 780-FBGA package offers ample transceiver channels for 4-lane x4 RapidIO links with margin for redundant paths. Compared to a discrete ASSP+FPGA partition, the integrated transceiver approach saves 30-50% board area in space-constrained VPX and ATCA blades.
Recommended
XAUI / 10 Gigabit Backplane Aggregation
For 10 Gigabit Ethernet backplane aggregation, the EP1AGX60DF780I6N provides four XAUI lanes via its 3.125 Gbps transceivers running in the 4x XAUI configuration, plus sufficient logic to implement a Layer-2 aggregator, MAC, and basic L3 lookup. The 780-FBGA package supports the required high-speed serial channel count while providing 350 user I/O for parallel system interfaces. Designers should follow AN-503 for XAUI PMA configuration and use pre-emphasis/de-emphasis settings calibrated to the backplane loss budget. Industrial temperature grade supports outdoor telecom cabinets.
Recommended
Industrial Video Capture / Processing
The EP1AGX60DF780I6N's 60,100 LE and 2,528,640 bits of embedded memory make it a strong fit for multi-channel industrial video capture and processing applications such as machine-vision frame grabbers, broadcast-quality SDI routers, and medical imaging pre-processors. The transceivers support SDI (Serial Digital Interface) at 270/1.485/2.97 Gbps through external SDI-over-transceiver IP. Industrial temperature rating enables deployment in factory-floor machine-vision systems and outdoor broadcast OB vans. The 780-FBGA package exposes sufficient LVDS pairs for parallel camera interfaces.
Recommended
Telecom Line Card / DSP Front-End
For telecom line cards, the EP1AGX60DF780I6N pairs transceivers for CPRI (Common Public Radio Interface) or OBSAI backhaul with sufficient logic density for baseband DSP pre-processing, framing, and timing distribution. The 18x18 multipliers (per Arria GX family) handle small FFT cores and channel filters, while the embedded M-RAM blocks provide buffer storage for symbol-level data. Industrial temperature grade qualifies the part for outdoor remote-radio-head (RRH) enclosures. Designers should use Altera's CPRI MegaCore for hard IP acceleration of the CPRI link layer.
Recommended
Aerospace / Defense Signal Processing
For aerospace and defense applications requiring industrial temperature grade and high logic density, the EP1AGX60DF780I6N serves as a transceiver-rich signal-processing engine for radar front-end digitisation, electronic-warfare channelisation, and software-defined radio (SDR) baseband blocks. The 780-FBGA package supports ruggedised board variants with underfill. Designers should pair the FPGA with appropriate ruggedisation processes (conformal coating, underfill) per IPC-A-610 Class 3. Note that full MIL-spec screening requires sourcing from authorised channels with extended-test flow.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60DF780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX60DF780C6N | EP1AGX60DF780C7 | EP1AGX60DF780I6 | EP1AGX50DF780I6N | EP1AGX50DF780I6 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,100 | 60,100 | 60,100 | 60,100 | 50,000 | 50,000 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 6 | 6 | 7 (faster) | 6 | 6 | 6 |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,421,888 bits | 2,421,888 bits |
| Pb-Free / RoHS | Yes (N suffix) | Yes (N suffix) | [DATA_NEEDED] | No (non-Pb-free) | Yes (N suffix) | No (non-Pb-free) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature grade with full logic density (vs EP1AGX60DF780C6N)
- Higher logic density in the same 780-FBGA footprint (vs EP1AGX50DF780I6N)
- Pb-free / RoHS compliant for global market access (vs EP1AGX60DF780I6 (non-Pb-free variant))
Design Notes
The EP1AGX60DF780I6N requires multiple isolated supply rails: VCCINT (core), VCCIO (I/O banks), VCCA_PLL (PLL analog), VCCA_TX and VCCA_RX (transceiver analog), VCCH (transceiver auxiliary). Each rail requires its own decoupling network per the Arria GX datasheet pin-connection guidelines, with bulk capacitors within 50 mils of each BGA power pin. Estimate total power at approximately 8-12 W for a 60%-utilised design at 500 MHz; transceivers add another 1-2 W per active channel. Use a 6+ layer PCB with dedicated power planes.
The 780-FBGA package has a 1.0 mm ball pitch requiring 0.5 mm-diameter via-in-pad microvias for breakout routing. Per Altera AN-487, stack-up should be at least 6 layers with transceiver traces routed on stripline layers referenced to unbroken ground planes. Differential pair matching target is 100 ohm ±10% with intra-pair length matching to 1 ps and inter-pair matching to 5 ps for XAUI/PCIe compliance. Maintain at least 25 mil keep-out from BGA perimeter for via fan-out clearance.
Transceiver channels at 3.125 Gbps require pre-emphasis and equalisation configured per Altera AN-503 to compensate for backplane and connector losses. For PCIe Gen1, de-emphasis of -3.5 dB is typically required. For XAUI, adaptive equalisation handles backplane loss up to 12 dB at 1.5625 GHz. Always perform post-layout signal-integrity simulation with the Hspice or Quartus SI tool before committing to fabrication. Cost-of-PCB-rework after assembly of a 780-FBGA device is typically 5-10x the original PCB fab cost.
Three frequent design mistakes: (1) omitting transceiver auxiliary power filtering, causing PLL lock failures; (2) using commercial-grade parts in outdoor enclosures, leading to cold-start failures below 0C; (3) attempting bitstream migration between Quartus II major versions without regenerating IP cores. Always verify your Quartus version's device support matrix before starting a port, and always specify the I-grade (industrial) part for any deployment where ambient temperature can fall below 0C.
Compliance Information
RoHS compliant per Pb-free suffix 'N' convention. AEC-Q100 not applicable (FPGA, not automotive-grade IC). REACH and halogen-free status not stated in distributor listings; refer to Intel PSG material declaration for confirmation.
