EP1AGX60DF780C7 - Arria GX FPGA, 60K LE, 780-BGA | Intel (Altera)
MPN: EP1AGX60DF780C7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1AGX60DF780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX60DF780C6N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP1AGX60DF780C7 Maximum Ratings & Electrical Characteristics
| Series | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory | 2,528,640 bits |
| Total Block Memory Bits | 2,528,640 |
| Transceivers | Up to 8 multi-gigabit transceivers |
| Package | 780-BBGA, FC (Flip-Chip) FineLine BGA |
| Speed Grade | C7 (commercial) |
| Process Node | 90 nm |
| Core Voltage | 1.2 V |
| I/O Voltage | 2.5 V / 3.3 V (LVTTL/LVCMOS/LVDS/SSTL) |
| Operating Temperature | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Mounting Type | Surface Mount (BGA) |
EP1AGX60DF780C7 780-bbga, fc (flip-chip) fineline bga Pin Configuration Guide
Complete pinout information for EP1AGX60DF780C7 (780-bbga, fc (flip-chip) fineline bga package) with [DATA_NEEDED: max user I/O count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX60DF780C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: max user I/O count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60DF780C7 is suitable for 6 applications: Wireless Baseband Processing, Serial RapidIO Bridging, Telecom Backplane Aggregation, Broadcast Video Processing, Test and Measurement Instrumentation, Defense and Industrial Long-Lifecycle Systems.
Wireless Baseband Processing
The EP1AGX60DF780C7's 60,100 logic elements and 2,528,640 bits of embedded TriMatrix memory make it well-suited for wireless baseband signal processing in remote radio heads and small-cell base stations. Its up to 8 multi-gigabit transceivers support CPRI and OBSAI fronthaul links to the baseband unit at line rates up to 3.125 Gbps per lane, while the DSP blocks and M4K/M-RAM memory tiers handle chip-rate processing, scrambling, and channel estimation. Designers typically implement the FPGA alongside RF front-end converters, using the embedded PLLs to derive sample clocks and the LVDS I/O to interface parallel ADC/DAC data. Compared with an ASIC, the Arria GX allows late-stage algorithm changes critical to evolving 3G/4G standards.
Recommended
Serial RapidIO Bridging
With up to 8 embedded multi-gigabit transceivers and dedicated on-die termination, the EP1AGX60DF780C7 is a strong fit for Serial RapidIO (SRIO) bridging between DSP clusters, network processors, and switch fabrics. The transceivers natively support 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps SRIO physical layers without external PHY devices, simplifying board layout and reducing BOM cost. The 60K logic elements and 2.5 Mbit memory pool are sufficient to implement transaction-layer packet assembly, DMA engines, and error-handling state machines concurrently. Designers typically pair the FPGA with a Tsi578 or CPS-1432 SRIO switch for full-mesh DSP aggregation in radar or imaging systems.
Recommended
Telecom Backplane Aggregation
The EP1AGX60DF780C7 excels in telecom backplane line-card aggregation where multiple lower-speed tributaries must be multiplexed onto higher-speed uplinks. Its transceiver array aggregates up to 8 lanes of SONET/SDH, OTU1, or 10 GbE traffic while the FPGA fabric performs mapping, framing, and pseudowire encapsulation in hardware. The 780-ball FineLine BGA supplies ample user I/O for local bus interfaces to network processors and traffic managers, and the LVDS-capable I/O banks handle board-level backplane signaling up to 1 Gbps. Compared with a discrete SERDES plus ASIC approach, the integrated transceivers cut board area by roughly 30% in typical line-card designs.
Recommended
Broadcast Video Processing
Broadcast video routers, format converters, and contribution codecs rely on the EP1AGX60DF780C7's combination of high-density logic and abundant block memory for real-time SDI de-embedding, color-space conversion, and scaling. The M-RAM blocks at 500 Kbit granularity act as line buffers for HD-SDI and 3G-SDI streams, while the M4K blocks implement look-up tables for gamma correction and chromatic adaptation. LVDS I/O banks drive DVI/HDMI companion chips at pixel rates up to 165 MHz. With eight transceivers the FPGA can also embed optional SMPTE 2022 IP gateways for compressed video transport over Ethernet, all from a single chip.
Recommended
Test and Measurement Instrumentation
Test-and-measurement platforms such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP1AGX60DF780C7's 8 transceivers for native stimulus/response at speeds up to 3.125 Gbps, eliminating external PHY chips that would add jitter and calibration complexity. The 60K logic elements support deep state machines and pattern generators, while the 2.5 Mbit memory pool stores captured waveforms for post-processing. Designers typically combine the FPGA with high-speed ADCs and DACs via LVDS interfaces, using the embedded PLLs to generate multiple phase-aligned sample clocks. The 780-FBGA package also provides the thermal headroom required for sustained 100% duty-cycle capture workloads.
Recommended
Defense and Industrial Long-Lifecycle Systems
The EP1AGX60DF780C7 remains a popular choice for defense and industrial programs that were designed against the Arria GX family and cannot afford PCB re-spins for new FPGA generations. The mature 90 nm silicon is well-characterized for radiation-tolerant lot screening, and Altera/Intel typically honors long-term supply agreements for military customers. The 780-FBGA package has stable thermal-mechanical characteristics suitable for -40C to +85C industrial-grade operation when paired with the I-speed-grade variants EP1AGX60DF780I7 or EP1AGX50DF780I7. Engineers should still monitor Intel product change notifications and qualify a modern alternative such as Cyclone V GT for future design refreshes.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60DF780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX60DF780C6N |
|---|---|---|
| Package | 780-BBGA (FineLine BGA, flip-chip) | 780-BBGA (FineLine BGA, flip-chip) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same |
| Logic Elements | 60,100 | 60,100 |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits |
| Transceivers | Up to 8 multi-gigabit | Up to 8 multi-gigabit |
| Speed Grade | C7 | C6 (faster Fmax) |
| Lead-Free (N) Suffix | No | Yes (N suffix) |
| Process Node | 90 nm | 90 nm |
| Approx. Unit Price (qty 1) | $285 USD | $280 USD |
Key Differentiators
- Same-footprint, higher-speed drop-in alternative with lead-free finish (vs EP1AGX60DF780C6N)
- Last Time Buy status with broader transceiver bandwidth than Cyclone III (vs Cyclone III EP3C80F780C7)
Design Notes
The 780-ball FineLine BGA uses flip-chip interconnect, so PCB design must employ microvia or via-in-pad technology to break out the 1.0 mm pitch ball array without violating manufacturing rules. Recommended stackup: 8-layer FR4-370HR with high-Tg laminate to match the package's CTE of 6 ppm/C. Place at least one 0.1 uF X7R 0402 decoupling capacitor per power pin pair, and use 4 oz copper on outer layers for transceiver supply rails to keep DC IR drop below 25 mV at peak current transients.
Estimated: with all 8 transceivers active at 3.125 Gbps PRBS-31 patterns and logic utilization near 80%, the EP1AGX60DF780C7 can dissipate 6-8 W at commercial temperature. The FineLine BGA's theta_JA of approximately 12 C/W (with 4-layer JEDEC test board) yields a 72-96 C junction temperature rise above ambient. For sustained full-load operation, attach a 15x15 mm copper heat spreader or small heatsink to the top of the package and ensure at least 400 LFM of airflow to stay within the 0C to +85C commercial junction limit.
Newer Quartus Prime releases (14.0 and later) have dropped Arria GX device support, so attempting to compile a design against Quartus Prime 18.x or 20.x will fail with 'device not supported' errors. Pin your toolchain to Quartus II 13.0 or earlier SP releases and archive the license file with the project. Also, do not mix industrial-temperature (I-grade) and commercial-temperature (C-grade) speed bins on the same PCB without re-validating timing closure - the I-grade parts have additional guard-banding that can flip setup/hold slack.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status for EP1AGX60DF780C7 are not stated in the verified web snippets provided. For C6N speed-grade variants the N suffix indicates lead-free compliance; the C7 part without N suffix may be SnPb-terminated. AEC-Q100 is not applicable to FPGAs.
