EP1C20F400C7N - Cyclone FPGA 20K LE 400-FBGA | Altera
MPN: EP1C20F400C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $92.17 | $92.17 |
| 10 | $87.5 | $875.00 |
| 100 | $78.4 | $7,840.00 |
| 500 | $71.2 | $35,600.00 |
| 1,000 | $65.8 | $65,800.00 |
Drop-in alternatives for EP1C20F400C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1C20F400C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements (LE) | 20,060 |
| Logic Array Blocks (LABs) | 2,006 |
| Embedded Memory (bits) | 294,912 (288 Kbits, M4K blocks) |
| User I/O Count | 301 |
| Embedded 18x18 Multipliers | 52 |
| PLLs | 4 |
| Process Technology | 130 nm CMOS (SRAM-based) |
| Core Voltage | 1.5 V |
| Speed Grade | -7 (commercial, ~405 MHz internal) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Package | 400-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount |
| Configuration Interface | Active Serial (AS) / Passive Serial (PS) / JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS (via 8 I/O banks) |
| External Memory Support | DDR SDRAM, QDR SRAM, FCRAM |
| RoHS Status | Compliant (per Altera product page) |
EP1C20F400C7N Pin Configuration
| Pin 1 | I/O Bank 1 — User I/O (per datasheet ball map) |
| Pin 50 | VCCINT — Core supply 1.5 V |
| Pin 100 | GND — Ground |
| Pin 150 | I/O Bank 2 — User I/O (per datasheet ball map) |
| Pin 200 | VCCIO1 — I/O bank 1 reference voltage |
| Pin 250 | I/O Bank 3 — User I/O (per datasheet ball map) |
| Pin 300 | I/O Bank 4 — User I/O (per datasheet ball map) |
| Pin 350 | I/O Bank 5 — User I/O (per datasheet ball map) |
| Pin 380 | TCK — JTAG test clock |
| Pin 382 | TDO — JTAG test data out |
| Pin 384 | TMS — JTAG test mode select |
| Pin 386 | TDI — JTAG test data in |
| Pin 388 | nCONFIG — Configuration control (active low) |
| Pin 390 | nSTATUS — Configuration status (active low) |
| Pin 392 | CONF_DONE — Configuration done indicator |
| Pin 394 | CLK0 — Primary clock input |
| Pin 396 | CLK1 — Secondary clock input |
| Pin 397 | DCLK — Configuration clock |
| Pin 398 | DATA0 — Configuration data input |
| Pin 400 | GND — Ground (corner ball) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C20F400C7N is suitable for 6 applications: Industrial Motor Control Logic, Video Processing and Image Preprocessing, Legacy Telecom Line Card Glue Logic, Educational FPGA Development Platforms, Software Defined Radio Front-End Controller, Glue Logic Replacement on Legacy Boards.
Industrial Motor Control Logic
The EP1C20F400C7N's 20,060 logic elements and 52 embedded 18×18 multipliers make it well-suited for industrial motor control loops where multiple PID controllers must run in parallel. Its 301 user I/Os comfortably accommodate 3-phase PWM outputs, encoder feedback (QEP), and fieldbus interfaces like CAN or RS-485 transceivers. The four on-chip PLLs generate the high-resolution PWM carrier frequencies (typically 10-20 kHz for variable-frequency drives) while maintaining deterministic phase relationships across multiple axes. Placed on a control board between the gate-driver stage and the HMI processor, it replaces discrete 74-series glue logic that previously occupied a full backplane. Designers should note that commercial temperature grade limits operation to 0-85 °C; for cabinet-mounted drives exceeding this range, the EP1C20F400I7N industrial variant should be specified instead.
Recommended
Video Processing and Image Preprocessing
With 288 Kbits of M4K memory and 301 I/Os, the EP1C20F400C7N is a strong fit for mid-resolution video preprocessing tasks such as Bayer demosaicing, color space conversion, or basic edge detection at 720p line rates. The 52 embedded 18×18 multipliers handle real-time convolution kernels (3×3 and 5×5 Sobel/gaussian) without consuming general-purpose logic. The device's eight I/O banks simplify interfacing to parallel CMOS image sensors and BT.656 video DACs simultaneously. Typical designs place the FPGA between the image sensor's parallel output and an external DDR SDRAM frame buffer, where the FPGA performs line-rate processing at 27-74 MHz pixel clocks. For full HD pipelines, designers should evaluate the larger EP1C25 or migrate to Cyclone IV GX devices with dedicated SERDES.
Recommended
Legacy Telecom Line Card Glue Logic
Telecom line cards built in the 2000s deployed the EP1C20F400C7N to bridge between TDM backplanes and DSP clusters, replacing racks of TTL glue with a single reprogrammable device. Its 301 I/Os interface to multiple E1/T1 framers and HDB3 line codecs, while the M4K memory blocks implement elastic FIFOs and channel-associated signalling decoders. PLLs derive 2.048 MHz and 8.192 MHz master clocks from a single backplane reference with sub-bit jitter. The Cyclone-I family remains in service for these long-life installations (typically 15-20 year deployment cycles) because the alternative - a board respin to Cyclone IV - requires re-qualification under NEBS Level 3. This is a primary reason stock of the EP1C20F400C7N persists in the distribution channel despite NRND status.
Recommended
Educational FPGA Development Platforms
The EP1C20F400C7N's 20,060 logic elements provide enough headroom for university-level digital-design coursework, including custom CPU implementations, peripheral controllers, and small RISC-V cores. The 400-ball BGA on a development board exposes all 301 user I/Os through 0.1-inch headers, making it breadboard-friendly for student labs. Altera's free Quartus II Web Edition (legacy v13.0sp1) supports the device without a paid license, which lowers the barrier for teaching institutions. The 52 hardware multipliers allow experiments with single-cycle MAC instructions, FFT implementations, and basic DSP filter design. Universities maintaining existing labs will continue sourcing this part until curriculum migration to Cyclone IV or V boards completes.
Recommended
Software Defined Radio Front-End Controller
The EP1C20F400C7N serves as a digital front-end controller in low-cost SDR designs, performing channelization, decimation, and I/Q routing between an ADC and a host processor. Its 52 embedded multipliers implement polyphase filterbanks and CIC decimators efficiently, while the 301 user I/Os accommodate parallel LVDS ADC interfaces and DDR memory buses. The four PLLs generate independent sample clocks for ADC, DAC, and FPGA fabric, allowing flexible frequency planning across HF to L-band designs. The device's 1.5 V core keeps total board power under 1.5 W typical, which matters for portable SDR dongles. Higher-end SDR work (10+ MSPS, multiple antennas) typically migrates to Cyclone IV or Cyclone V with their higher multiplier counts and SERDES transceivers.
Recommended
Glue Logic Replacement on Legacy Boards
When redesigning legacy boards with dozens of 74-series logic packages, designers often consolidate the discrete logic into a single EP1C20F400C7N, freeing PCB area and reducing assembly cost. The device's 20,060 logic elements can absorb several hundred 74HC/74LVT functions, while its 301 user I/Os interface to address/data buses, control signals, and status LEDs without buffering. The on-chip PLLs generate timing relationships that previously required multiple crystal oscillators, and the SRAM-based configuration allows in-field firmware updates over JTAG without board rework. This application is common in industrial test equipment, medical instrument control boards, and aerospace subsystems where the original discrete-logic design predates modern FPGAs but cannot be fully respun due to qualification cost.
Recommended
Recommended Products Summary
Engineering reference data for EP1C20F400C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C20F400C8N | EP1C20F400C6N | EP1C20F400C7 | EP1C20F400C6 | EP1C20F400I7N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 400-FBGA | 400-FBGA - same | 400-FBGA - same | 400-FBGA - same | 400-FBGA - same | 400-FBGA - same |
| Speed Grade | -7 | -8 (faster) | -6 (slower) | -7 (same, legacy suffix) | -6 (legacy suffix) | -7 (industrial temp) |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 |
| Embedded Memory (bits) | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 |
| User I/O Count | 301 | 301 | 301 | 301 | 301 | 301 |
| Embedded Multipliers | 52 | 52 | 52 | 52 | 52 | 52 |
| Temperature Grade | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Balanced logic, memory, and DSP density at low cost (vs EP1C12Q240C8N (smaller Cyclone-I variant))
- 301 user I/O maximizes external memory and parallel bus connectivity (vs EP1C20F324C7N (smaller 324-ball package))
- Industrial temperature variant shares the exact same footprint (vs EP1C20F400C7N (commercial grade this part))
Design Notes
The EP1C20F400C7N requires three supply rails: VCCINT (1.5 V core), VCCIO (3.3 V/2.5 V/1.8 V per bank), and a 3.3 V auxiliary rail for configuration and JTAG. Estimated: with all 20,060 LEs active at 50% toggle rate at 100 MHz, core current consumption reaches approximately 0.8-1.2 A. Place at least four 100 µF bulk capacitors plus 0.1 µF + 10 µF ceramic decoupling per VCCINT pin pair; reference Altera AN 224 (Power Management for Cyclone Devices) for the recommended π-filter topology on each rail. Power sequencing must hold VCCIO before VCCINT if 3.3 V I/O and 1.5 V core are turned on by separate regulators.
In the 400-ball FineLine BGA package, the thermal resistance θJA is approximately 18 °C/W on a JEDEC 4-layer test board with minimal copper. Estimated: at 1.5 W typical dissipation, junction temperature rises 27 °C above ambient (1.5 W × 18 °C/W). For designs operating above 70 °C ambient or with >2 W dissipation, add thermal vias under the center BGA balls and increase inner-plane copper pour area. The package does not have an exposed thermal pad; cooling relies on PCB copper spreading to the board edges.
Route all eight I/O bank VCCIO pins with star topology from a common regulator; do not daisy-chain bank supplies. Match length on DDR SDRAM DQS-to-DQ traces within ±25 mil for the EP1C20F400C7N's external memory interface to meet the 200 ps setup/hold window. Use 50 Ω controlled-impedance microstrip on CLK0/CLK1 inputs with a 4.7 kΩ pull-down to prevent floating-clock false-config. Reference Altera AN 276 (Cyclone Device Design Guidelines) for via-in-pad recommendations on the 0.8 mm pitch BGA.
Common pitfalls when designing with the EP1C20F400C7N: (1) omitting the 25 Ω series resistor on JTAG TCK, causing signal-integrity failures on long debug cables; (2) forgetting the external 10 kΩ pull-up on nCONFIG and nSTATUS - both are open-drain and require external bias; (3) using 3.3 V LVCMOS into a bank configured for 1.8 V VCCIO, which can damage the I/O cells; (4) selecting EPCS1 configuration flash for bitstreams >1 Mbit - the EP1C20 typically requires EPCS4 or larger; (5) leaving the CRC error-detection feature disabled, missing bitstream corruption in safety-critical applications.
Compliance Information
RoHS compliance per Altera product page; the 'N' suffix in EP1C20F400C7N denotes Pb-free / lead-free assembly. REACH compliance assumed compliant per Intel/Altera conflict minerals statement. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part. Halogen-free status not stated in the available data.
