EP1K100FI4842 - 100K Gate ACEX-1K FPGA 484-BGA | Intel / Altera
MPN: EP1K100FI4842 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.9 | $29,450.00 |
| 1,000 | $54.3 | $54,300.00 |
Drop-in alternatives for EP1K100FI4842 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100FI484-2
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1K100FC484-2
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EP1K100FI484-2N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP1K100EFI484-2
✅ Drop-In✓ In Stock
$67.5 / Unit
View Datasheet →EP1K100FC4842N
✅ Drop-In✓ In Stock
$49.8 / Unit
View Datasheet →EP1K100FI4842 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| System Gates | 100,000 |
| Total RAM Bits | 49,152 |
| Number of LABs | 624 |
| Number of EABs | 6 |
| User I/O Pins | 333 |
| Package | 484-FBGA (FineLine BGA) |
| Core Voltage | 2.5 V |
| I/O Standards | MultiVolt (2.5V / 3.3V / 5.0V) |
| Process Technology | 0.18 um CMOS SRAM |
| Internal Performance | up to 250 MHz |
| Configuration Method | Passive Serial / Byte-Wide Parallel via JTAG |
| JTAG Boundary Scan | IEEE 1149.1 compliant |
| RoHS Status | Compliant |
| Operating Temperature | -40C to +85C (Industrial) |
EP1K100FI4842 484-fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1K100FI4842 (484-fbga (fineline bga) package) with 333 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FI4842.
Refer to the datasheet for full pin configuration.
Estimated pin count: 333 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FI4842 is suitable for 6 applications: Telecom Line Card Interface Bridging, Industrial Protocol Bridge (Modbus / Profibus / CAN), Glue Logic Consolidation on Embedded Boards, Digital Signal Processing Front-End Preprocessing, PCI Bridge and Local Bus Extender, Legacy Reorder / Refurbishment Replacement.
Telecom Line Card Interface Bridging
The EP1K100FI4842's 333 user I/Os and 100K gates make it ideal for telecom line card interface bridging between TDM buses, HDLC controllers, and backplane serial links. Its MultiVolt I/O banks (2.5V / 3.3V / 5.0V) connect directly to legacy telecom ASICs without level shifters. The 6 EABs totaling 49,152 RAM bits are typically partitioned into small FIFOs and elastic buffers for protocol conversion. At 250 MHz internal performance, the device comfortably handles T1/E1 framers and channelized STS-1 grooming in a single device. Compared to a discrete CPLD bank, this FPGA reduces board area by approximately 60 percent while adding reprogrammability for late-stage protocol changes.
Recommended
Industrial Protocol Bridge (Modbus / Profibus / CAN)
With 4,992 logic elements and 333 I/Os, the EP1K100FI4842 implements multi-protocol industrial bridges between Modbus RTU, Profibus, DeviceNet, and CANopen networks in a single chip. The 6 embedded array blocks provide 49,152 bits of dual-port RAM for protocol message buffering without external SRAM. Industrial temperature grade (-40C to +85C) operation enables deployment in factory floor cabinets and outdoor control enclosures. The JTAG 1149.1 boundary-scan interface simplifies board-level testing and in-field firmware upgrades. Designers can re-target the device across product variants (4-port vs 8-port bridges) by changing only the bitstream, reducing hardware SKUs.
Recommended
Glue Logic Consolidation on Embedded Boards
The EP1K100FI4842 replaces 8-15 discrete 74-series logic packages, address decoders, and bus arbiters on embedded CPU boards. Its 333 user I/Os interface directly to PCI, ISA, VME, and proprietary local buses at 2.5V/3.3V/5.0V levels. Approximately 100K gates handle address decode tables, wait-state generators, interrupt controllers, and DMA engines that traditionally consumed much board area. Quartus II design entry with schematic and VHDL/Verilog HDL reduces time-to-prototype versus discrete designs. Footprint-compatible migration to Cyclone IV E EP4CE115F484 is possible with PCB layout reuse for next-generation designs.
Recommended
Digital Signal Processing Front-End Preprocessing
The EP1K100FI4842's 250 MHz internal performance and 49,152 embedded RAM bits support pre-processing stages for DSP front-ends including FIR filtering, sample-rate conversion, and channel multiplexing. The 6 EABs implement dual-port RAM structures for sample buffering between ADC data streams and downstream DSP processors such as the TMS320C6x family. The 333 user I/Os accept parallel ADC/DAC buses and source-synchronous LVDS signaling at rates up to 250 MHz. MultiVolt I/O banks mix 5V analog front-end logic with 3.3V DSP buses on the same die, eliminating external level-translator ICs and their propagation delay.
Recommended
PCI Bridge and Local Bus Extender
The EP1K100FI4842 implements 32-bit / 33 MHz PCI target/initiator bridges connecting legacy ISA or proprietary buses to PCI backplanes in industrial PCs and medical instruments. The 333 I/O count accommodates the full 32-bit PCI bus (AD[31:0], C/BE[3:0], FRAME, IRDY, TRDY, etc.) plus arbitration, interrupt, and local-bus signals in a single device. Quartus II PCI MegaCore function generates compliant 33 MHz PCI interface logic, eliminating months of manual state-machine development. Industrial temperature grade and 2.5V/3.3V/5.0V MultiVolt I/O suit medical and instrumentation PCI cards deployed in mixed-voltage system backplanes.
Recommended
Legacy Reorder / Refurbishment Replacement
The EP1K100FI4842 continues to ship in long-lifecycle programs such as avionics, military communications, and industrial automation installed bases. With the original ACEX-1K family obsolete, XAIPART brokers maintain traceable inventory with documentation (CoC, ESD test reports) suitable for aviation DO-254 and industrial functional-safety audits. The 484-FBGA package and 2.5V core enable direct PCB-level drop-in for boards originally shipped between 2000 and 2010. For retrofit upgrades, designers migrate the bitstream to Cyclone IV E in the same 484-FBGA footprint, preserving the mechanical layout while gaining 5-10x logic density.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FI4842 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FI484-2 | EP1K100FC484-2 | EP1K100FI484-2N | EP1K100EFI484-2 | EP1K100FC4842N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/Os | 333 | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial Enhanced) | 0C to +70C (Commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS / Lead-Free | Compliant | Compliant | Compliant | Compliant (N suffix) | Compliant | Compliant (N suffix) |
Key Differentiators
- Industrial temperature grade in the same 484-FBGA footprint (vs EP1K100FC484-2)
- Lead-free / RoHS compliant industrial variant for reflow assembly (vs EP1K100FI484-2N)
- Full 333 I/O count enables single-chip PCI bridge implementation (vs EP1K100FI256-2)
Design Notes
Estimated: at 2.5V core with all 100K gates switching at 100 MHz, the EP1K100FI4842 draws approximately 0.4-0.6 A from VCCINT. Provide at least four 0.1 uF decoupling capacitors near each VCCINT ball cluster, plus one 10 uF bulk capacitor per VCCIO bank. VCCIO banks (VCCIO_1 through VCCIO_8) may operate at 2.5V, 3.3V, or 5.0V independently, but unused banks must still be powered to a valid level to prevent I/O latch-up.
The 484-FBGA package has theta_JA of approximately 18 C/W with a standard 4-layer JEDEC PCB. Estimated: at 1.5W worst-case dissipation, junction temperature rise above ambient is approximately 27C, which is within industrial limits for environments up to +58C ambient. For sealed enclosures or higher ambient, attach a small heatsink to the package top or use thermal vias beneath the BGA die-attach paddle.
Route all 333 user I/O signals on inner layers to escape the dense BGA fan-out. Use 0.1 mm trace-and-space on inner layers and micro-via-in-pad if the PCB fabricator supports it. Place the EPC2 or EPC8 configuration EPROM within 50 mm of the dedicated nCONFIG, DCLK, DATA0, and nCEO pins to minimize configuration-clock skew and reflection.
Do not apply VCCIO voltage before VCCINT during power-up - this can trigger I/O latch-up and permanent damage. Sequence VCCINT first, then VCCIO within 100 ms. After configuration, ensure the CONF_DONE pin transitions high within the EPC-specified timeout; otherwise the device enters an undefined state and pulls all I/Os to tri-state. Verify JTAG chain integrity before in-system programming.
Compliance Information
RoHS compliant per Altera / Intel product declaration. AEC-Q100 not applicable (FPGA in non-automotive primary market). Halogen-free per JEDEC JS709B reference. Conflict-mineral reporting compliant per SEC Form SD filings.
