EP1K100FI484-2N - 100K ACEX-1K FPGA 333 I/O | Intel (Altera)
MPN: EP1K100FI484-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $78 | $7,800.00 |
| 250 | $71.5 | $17,875.00 |
| 500 | $65 | $32,500.00 |
Drop-in alternatives for EP1K100FI484-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1K100FI484-2
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View Datasheet →EP1K100EFI484-2
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View Datasheet →EP1K100FC484-2N
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View Datasheet →EP1K100FC484-2NGZ
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View Datasheet →EP1K100FC484-3N
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View Datasheet →EP1K100FI484-2N Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 4,992 |
| Total RAM Bits | 49,152 |
| Number of Gates | 257,000 (typical 100,000) |
| Number of Logic Array Blocks (LABs) | 624 |
| Number of I/O | 333 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Supply Voltage - Core (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| Operating Temperature | -40C to +85C (Industrial) |
| Speed Grade | -2 |
| Mounting Type | Surface Mount |
| Package / Case | 484-FBGA (FineLine BGA, 23 mm x 23 mm) |
| Supplier Device Package | 484-FBGA |
| Configuration Method | SRAM - Serial / JTAG |
| RoHS Status | non_compliant (contains lead, BGA) |
EP1K100FI484-2N 484-fbga Pin Configuration Guide
Complete pinout information for EP1K100FI484-2N (484-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FI484-2N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FI484-2N is suitable for 6 applications: Industrial Control & Automation Glue Logic, Telecommunications Interface Bridging, Low-Cost PCI Bus Controller, Video Processing & Frame Buffer Pipelines, Legacy System Upgrades & Form-Fit-Function Replacement, Embedded DSP & Arithmetic Pipelines.
Industrial Control & Automation Glue Logic
The EP1K100FI484-2N's 100K gate capacity, 333 I/Os, and industrial -40C to +85C temperature range make it well-suited for industrial PLC and motion controller glue-logic applications. Its 4,992 logic elements can implement multiple interface bridges (e.g., parallel bus to SPI, UART muxing, encoder decoding) in a single device, eliminating several discrete MSI/LSI logic parts. The 49,152 bits of embedded RAM via 12 EABs support FIFO buffers for asynchronous data transfer between motor-control and host processors. Compared with CPLDs, the EP1K100FI484-2N provides register-rich sequential logic capability, while its industrial temperature grade ensures reliable operation on factory floors exposed to wide thermal cycling.
Recommended
Telecommunications Interface Bridging
In telecom infrastructure, the EP1K100FI484-2N serves as a protocol-bridging device between legacy T1/E1 framers, HDLC controllers, and modern Ethernet MACs. Its 333 user I/Os accommodate wide parallel data buses plus multiple serial control channels, and the FastTrack continuous routing interconnect delivers predictable timing margins for synchronous telecom interfaces. The device's 12 EABs implement dual-port RAM and FIFO structures required for clock-domain crossing between TDM (T1 1.544 MHz) and packet (Ethernet 25-125 MHz) domains. Compared with discrete gate-array solutions, the FPGA's reprogrammability accelerates protocol-debug cycles and supports late-stage field upgrades without board rework.
Recommended
Low-Cost PCI Bus Controller
The EP1K100FI484-2N is a classic fit for embedded PCI bus controllers in legacy industrial PCs and add-in cards. Its 49,152 bits of embedded memory provide buffering for PCI transaction bursts, while 333 user I/Os connect to the 32-bit/33 MHz PCI bus plus local peripheral expansion. The 2.5 V core and 3.3 V/5 V-tolerant I/O cells match PCI signaling requirements directly. Compared with ASIC implementations, the FPGA's reconfigurability allows in-system PCI firmware updates and supports multiple vendor IDs without respinning silicon, critical for low-volume embedded designs.
Recommended
Video Processing & Frame Buffer Pipelines
In digital video systems, the EP1K100FI484-2N performs real-time pixel processing, color-space conversion, and frame-rate conversion between camera sensors and display controllers. Its 49 Kbits of embedded RAM implement line buffers and lookup tables for gamma correction, while 333 I/Os handle parallel digital video buses (e.g., 16-/24-bit RGB or YCbCr). The -2 speed grade provides adequate timing margin for 50-65 MHz pixel clocks typical of VGA-to-XGA resolutions. Compared with fixed-function video ASSPs, the FPGA enables custom video algorithms and protocol conversion without silicon respins, particularly valuable in broadcast and medical-imaging equipment.
Recommended
Legacy System Upgrades & Form-Fit-Function Replacement
The EP1K100FI484-2N is widely used as a form-fit-function replacement in long-lifecycle industrial, military, and aerospace systems where ACEX-1K designs cannot be redesigned. Its 484-FBGA footprint and pinout match the original ACEX-1K 100K device, allowing direct PCB drop-in to extend system service life. With industrial temperature range, 100K gates, and 333 I/Os, it preserves original system I/O mapping and timing budgets without requiring firmware changes. Compared with newer Cyclone families, the EP1K100FI484-2N maintains backward compatibility with legacy Quartus II toolchains, sparing customers the cost and risk of full system revalidation.
Recommended
Embedded DSP & Arithmetic Pipelines
The EP1K100FI484-2N's dedicated carry chain enables high-speed arithmetic operations for embedded DSP pipelines, supporting adders, counters, and comparators at hardware speed. With 4,992 logic elements, designers can implement multi-channel FIR filters, motor-control loops, or simple FFT cores without external DSP chips. The 49 Kbits of embedded RAM stage data between arithmetic stages, while 333 I/Os route to ADC/DAC peripherals. Compared with software-DSP implementations on microcontrollers, the FPGA delivers deterministic latency critical to closed-loop control, while consuming modest power from its 2.5 V core supply.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FI484-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FI484-2 | EP1K100EFI484-2 | EP1K100FC484-2N | EP1K100FC484-2NGZ | EP1K100FC484-3N | EP1K100FC484-1N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Number of Gates | 257,000 (100K typical) | 257,000 | 257,000 | 257,000 | 257,000 | 257,000 | 257,000 |
| RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Number of I/O | 333 | 333 | 333 | 333 | 333 | 333 | 333 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -3 (slower) | -1 (faster) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Series | ACEX-1K | ACEX-1K | ACEX-1K Enhanced | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
Key Differentiators
- Industrial temperature grade (-40C to +85C) (vs EP1K100FC484-2N)
- Pin-compatible migration to enhanced variant (vs EP1K100EFI484-2)
- Faster -2 speed grade available (vs EP1K100FC484-3N)
- Optimized for legacy system continuity (vs Cyclone EP1C6Q240C8N)
Design Notes
The EP1K100FI484-2N requires a stable 2.5 V VCCINT supply with tolerance of +/-5% (2.375 V to 2.625 V). Provide at least 4 to 6 decoupling capacitors (0.1 uF ceramic) distributed around the BGA, plus bulk 10 uF to 47 uF tantalum or polymer capacitors. Use a low-dropout regulator with <50 mV ripple to minimize core supply noise that could couple into PLL outputs. Power sequencing is not strictly required but VCCIO should not precede VCCINT by more than 200 ms to avoid I/O latch-up.
The 484-FBGA package has 1.0 mm ball pitch on a 23 mm x 23 mm body. Use a 4-layer or 6-layer PCB with a continuous ground plane directly beneath the BGA for return-current management. Microvia or via-in-pad technology is strongly recommended for inner balls; if standard through-vias are used, plan dog-bone fanout with 0.2 mm via pad and 0.1 mm drill to maintain clearances. Match trace lengths for high-speed bus signals (PCI, DDR) to within +/-1 mm and use 50 ohm controlled-impedance routing.
Do not operate the EP1K100FI484-2N outside its industrial temperature range (-40C to +85C) or below VCCINT minimum (2.375 V). Configuration failures often stem from incorrect MSEL pin strapping for the desired configuration mode (passive serial, active serial, or JTAG). Ensure MSEL0/MSEL1 are tied to VCCINT or GND through 1 kohm resistors per the ACEX-1K datasheet. When migrating from EP1K100FC (commercial) to EP1K100FI (industrial), validate timing closure across the wider temperature window, as delay variation over -40C to +85C may shift critical paths by 5-10%.
Place configuration EPROM (e.g., EPCS1/EPCS4) within 5 cm of the FPGA to minimize trace-induced signal integrity issues on the serial DCLK and DATA lines. Use a 4-layer stack-up with dedicated VCCINT and VCCIO power planes adjacent to the BGA to reduce DC drop. Provide dedicated ground vias at every four BGA balls to stitch the return path. Keep JTAG TMS/TCK/TDO/TDI traces short (<5 cm) and parallel to avoid skew. Differential clock inputs (if used) should be length-matched within 1 mm.
Compliance Information
EP1K100FI484-2N is a BGA package from Altera/Intel ACEX-1K family, generally considered non-RoHS compliant due to lead-containing BGA solder balls (PbSn). For RoHS-compliant designs, verify with distributor. ACEX-1K family preceded AEC-Q100 automotive grade qualification programs - this part is not automotive qualified.
