EP1K10TC100-2NGZ - 10K-gate ACEX-1K FPGA, 100-TQFP | Intel
MPN: EP1K10TC100-2NGZ ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.8 | $17,800.00 |
Drop-in alternatives for EP1K10TC100-2NGZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K10TC100-2N
✅ Drop-In✓ In Stock
$8.25 / Unit
View Datasheet →EP1K10TC100-2
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EP1K10TC100-1N
✅ Drop-In✓ In Stock
$9.2 / Unit
View Datasheet →EP1K10TC100-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.8 / Unit
View Datasheet →EP1K10TC100-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.95 / Unit
View Datasheet →EP1K10TC100-2NGZ Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Number of Logic Elements / Cells | 576 |
| Number of LABs / CLBs | 72 |
| Total RAM Bits | 12288 |
| Number of Gates | 56000 (10,000 typical usable) |
| Number of I/O | 66 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Operating Temperature | 0 °C to 70 °C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 100-TQFP |
| Speed Grade | -2 |
| Process Technology | 0.18 µm SRAM-based LUT |
EP1K10TC100-2NGZ 100-tqfp Pin Configuration Guide
Complete pinout information for EP1K10TC100-2NGZ (100-tqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K10TC100-2NGZ.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K10TC100-2NGZ is suitable for 6 applications: Industrial Glue-Logic Controllers, Legacy Parallel-Bus Bridges (PCI / ISA), Telecommunications Interface Adapters, Instrumentation Front-End Controllers, Education and FPGA Training Platforms, Avionics and Defense Legacy Systems.
Industrial Glue-Logic Controllers
The EP1K10TC100-2NGZ fits industrial glue-logic applications where the design needs a small block of custom state machines and bus-bridging logic alongside a host microcontroller. With 576 logic elements and 12,288 bits of embedded SRAM, the device has enough fabric for 4-8 16-bit counters, simple UART/SPI bridges, or PWM generators that offload timing-critical tasks from the host CPU. The 100-TQFP footprint supports 66 user I/O pins at 0.5 mm pitch, which is hand-solderable for prototypes. Designers typically use Quartus II to compile the design and JTAG to program the SRAM-based configuration in-system. Compared with discrete 74-series logic, this FPGA reduces board area and BOM cost while keeping the logic fully reconfigurable for late-stage design changes.
Recommended
Legacy Parallel-Bus Bridges (PCI / ISA)
The EP1K10TC100-2NGZ is widely used as a legacy parallel-bus bridge between PCI and ISA buses, or between a microcontroller local bus and an external peripheral bus. Its 66 user I/O pins accommodate the address, data, and control signals of an 8-bit or 16-bit bus with margin for handshake and interrupt lines. The 12,288 bits of embedded SRAM provide small FIFO buffers for data hand-off between buses of different speeds, while the -2 speed grade supports typical PCI 33 MHz timing when registers are placed and constrained properly in Quartus II. The 100-TQFP package's 0.5 mm pitch and exposed lead frames simplify two-layer PCB designs for legacy expansion cards. Engineers verify timing closure with TimeQuest and confirm signal-integrity on shared clock nets.
Recommended
Telecommunications Interface Adapters
Telecommunications equipment designs use the EP1K10TC100-2NGZ to implement glue-logic between framer ICs, line-interface units, and backplane serial links. The 576 logic elements handle HDLC framing, CRC generation, and simple DMA state machines, while the 12,288 bits of SRAM buffer packet payloads during rate adaptation. The 66 user I/O pins support multiple SPI or LVDS interface channels, with the -2 speed grade delivering sufficient Fmax for sub-100 MHz interface logic. Industrial-grade telecom designs often pair the ACEX-1K with an external EEPROM configuration device to enable rapid field reprogramming. The 100-TQFP footprint allows standard SMT assembly lines to build legacy telecom line cards without BGA reflow equipment.
Recommended
Instrumentation Front-End Controllers
Test and measurement instruments use the EP1K10TC100-2NGZ as a front-end controller that sequences ADCs, multiplexes input channels, and aggregates data for the host DSP or microcontroller. With 576 logic elements and 12,288 bits of SRAM, the device can implement 4-16 channel input multiplexers, trigger logic, and simple digital filters alongside the host CPU. The 66 user I/O pins accommodate parallel ADC data buses and GPIO for range switching. The -2 speed grade supports ADC sample rates up to about 50 MHz when pipelined in Quartus II, while the 100-TQFP package provides mechanical stability for handheld and benchtop instruments. Engineers commonly use the on-chip SRAM as a circular buffer for pre-trigger sample storage in oscilloscope designs.
Recommended
Education and FPGA Training Platforms
Universities and FPGA training labs use the EP1K10TC100-2NGZ as a low-cost teaching platform for digital-design courses because the 100-TQFP package is hand-solderable on perfboard or two-layer PCBs, eliminating the need for BGA rework stations. With 576 logic elements, the device provides enough fabric for student labs covering counters, UARTs, VGA controllers, simple RISC cores, and FSM exercises. The 12,288 bits of SRAM support introductory memory-controller labs, and the 66 user I/O pins expose enough pins for breadboard-friendly peripherals. Quartus II's free Web Edition supports the ACEX-1K family, allowing students to compile and program without license fees. The -2 speed grade is more than adequate for sub-50 MHz educational designs.
Recommended
Avionics and Defense Legacy Systems
Long-lifecycle avionics and defense platforms retain the EP1K10TC100-2NGZ as a form-fit-function replacement for boards originally qualified with ACEX-1K silicon. The 576 logic elements support mission-critical interface logic for navigation, communication, and sensor subsystems, while the 12,288 bits of SRAM buffer avionic data buses. The 66 user I/O pins accommodate ARINC 429, MIL-STD-1553, and discrete avionics I/O at 0.5 mm pitch. Defense programs with multi-decade support windows often stockpile -2 speed grade parts at last-time-buy, and the 100-TQFP package simplifies through-hole rework on legacy backplanes. The -2 speed grade provides deterministic timing closure for safety-critical state machines.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10TC100-2NGZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10TC100-2N | EP1K10TC100-2 | EP1K10TC100-1N | EP1K10TC100-1 | EP1K10TC100-3N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Speed Grade | -2 | -2 (same) | -2 (same) | -1 (slower) | -1 (slower) | -3 (faster) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Embedded SRAM (bits) | 12288 | 12288 | 12288 | 12288 | 12288 | 12288 |
| User I/O | 66 | 66 | 66 | 66 | 66 | 66 |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Operating Temperature | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-speed drop-in alternative with no PCB changes required (vs EP1K10TC100-2N)
- Faster speed grade available for timing-critical designs (vs EP1K10TC100-3N)
- Slower speed grade available for cost-sensitive or power-limited designs (vs EP1K10TC100-1N)
Design Notes
Estimated: When migrating between ACEX-1K speed grades (-1 vs -2 vs -3) on the same 100-TQFP footprint, the -2 grade's Fmax is approximately 15-25 percent higher than the -1 grade and 15-25 percent lower than the -3 grade. Always re-run TimeQuest timing analysis in Quartus II after substituting a different speed grade, because placement and routing are timing-driven and the slower part may fail timing closure. The 66 user I/O budget is shared across all I/O banks, so plan bank assignments carefully when mixing 2.5 V and 3.3 V interface standards.
Decouple VCCINT (2.5 V core) and VCCIO (I/O bank reference) with at least one 0.1 µF ceramic capacitor per supply pin, placed within 3 mm of the package lead. Add a bulk 10 µF tantalum or ceramic capacitor near the device for transient suppression during configuration. The ACEX-1K draws significant inrush current during SRAM configuration (typically 50-150 mA peak), so verify that the host 2.5 V regulator can supply this transient without sagging below the 2.375 V minimum. Use a separate analog ground island if the design mixes sensitive analog circuitry.
The 100-TQFP package has 0.5 mm pitch leads with a typical land length of 1.5 mm, requiring standard SMT reflow profiles (peak 245-260 °C for lead-free, 215-220 °C for SnPb). Keep all signal traces at least 0.2 mm from the package outline to avoid solder bridging, and use a ground pour under the device for thermal dissipation and EMI suppression. JTAG signals (TCK, TMS, TDI, TDO) should be routed with 4-8 mil traces and protected with 10 kΩ pull-ups on TMS and TDI to prevent spurious configuration during power-up.
Differential pairs (LVDS, RSDS) on the EP1K10TC100-2NGZ should be length-matched within 1 mm and routed on a single signal layer with a continuous ground reference plane below. Avoid routing high-speed signals across split power planes or package voids, because return-path discontinuities will degrade signal integrity and increase EMI. Keep clock signals away from I/O edges by at least 3x the trace-to-trace spacing, and place series termination resistors within 5 mm of the FPGA output pin for source-terminated clocks above 50 MHz.
Compliance Information
Lifecycle status is Obsolete as of 2026-09-07. RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data and are marked [DATA_NEEDED] in the specs array. AEC-Q100 is not applicable because this is a commercial-grade FPGA without automotive qualification.
