EP1K10TC100-2NGZ - 10K-gate ACEX-1K FPGA, 100-TQFP | Intel
Référence : EP1K10TC100-2NGZ ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2 210,00 |
| 500 | $19.75 | $9 875,00 |
| 1 000 | $17.8 | $17 800,00 |
EP1K10TC100-2NGZ Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement custom digital logic, state machines, datapaths, and interface bridges after PCB fabrication. FPGAs occupy the broad hierarchy of programmable logic devices (PLD) -> CPLD/FPGA -> programmable logic -> digital semiconductor. The ACEX-1K series, introduced by Altera (later acquired by Intel), targets cost-sensitive glue-logic, bus-bridging, and low-density state-machine applications where ASIC NRE is unjustified.
Key features of the EP1K10TC100-2NGZ include 72 logic array blocks (LABs), 12,288 bits of embedded SRAM distributed across the fabric, support for Altera's Quartus II design suite, in-system programmability via JTAG, and a commercial 0 °C to 70 °C operating temperature range. The 100-TQFP footprint allows hand-solderable prototyping on standard 0.5 mm-pitch land patterns, eliminating the need for BGA reflow equipment in small-volume builds.
Typical applications include industrial control interfaces, legacy parallel-bus bridges (PCI, ISA), telecommunications glue logic, instrumentation front-end controllers, and education platforms where TQFP packages simplify lab rework. The EP1K10TC100-2NGZ is pin-compatible with other 100-TQFP ACEX-1K members, letting designers migrate between speed grades (-2 vs -3) and density options (10K vs 30K) without re-spinning the PCB.
When designing with this device, verify that your Quartus II tool version still supports the ACEX-1K device family, and budget for legacy support contracts or migration to Cyclone-series devices for new designs. Always confirm the supply-voltage tolerance against the host 2.5 V rail, and respect the 66-user-I/O limit when assigning pin functions.
This page synthesizes distributor stock data, drop-in pin-compatible ACEX-1K alternatives, and Quartus II design considerations not consolidated in a single manufacturer datasheet, giving procurement and FPGA engineers a one-stop reference for sourcing and replacing this legacy Intel/Altera part.
Alternatives de remplacement direct pour EP1K10TC100-2NGZ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K10TC100-2NGZ (même facteur de forme et même empreinte) — différant par Process Technology, Speed Grade, Operating Temperature, Package, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K10TC100-2N
✅ Remplacement direct✓ En stock
$8.25 / unité
Voir la fiche technique →EP1K10TC100-2
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EP1K10TC100-1N
✅ Remplacement direct✓ En stock
$9.2 / unité
Voir la fiche technique →EP1K10TC100-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.8 / unité
Voir la fiche technique →EP1K10TC100-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.95 / unité
Voir la fiche technique →EP1K10TC100-2NGZ Valeurs maximales et caractéristiques électriques
| Series | ACEX-1K |
| Number of Logic Elements / Cells | 576 |
| Number of LABs / CLBs | 72 |
| Total RAM Bits | 12288 |
| Number of Gates | 56000 (10,000 typical usable) |
| Number of I/O | 66 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Température de fonctionnement | 0 °C to 70 °C (TA) |
| Type de montage | Surface Mount |
| Boîtier / Format | 100-TQFP |
| Speed Grade | -2 |
| Process Technology | 0.18 µm SRAM-based LUT |
Guide de configuration des broches du EP1K10TC100-2NGZ 100-tqfp
Configuration des broches du EP1K10TC100-2NGZ (boîtier 100-tqfp). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1K10TC100-2NGZ.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1K10TC100-2NGZ convient pour 6 applications: Industrial Glue-Logic Controllers, Legacy Parallel-Bus Bridges (PCI / ISA), Telecommunications Interface Adapters, Instrumentation Front-End Controllers, Education and FPGA Training Platforms, Avionics and Defense Legacy Systems.
Industrial Glue-Logic Controllers
The EP1K10TC100-2NGZ fits industrial glue-logic applications where the design needs a small block of custom state machines and bus-bridging logic alongside a host microcontroller. With 576 logic elements and 12,288 bits of embedded SRAM, the device has enough fabric for 4-8 16-bit counters, simple UART/SPI bridges, or PWM generators that offload timing-critical tasks from the host CPU. The 100-TQFP footprint supports 66 user I/O pins at 0.5 mm pitch, which is hand-solderable for prototypes. Designers typically use Quartus II to compile the design and JTAG to program the SRAM-based configuration in-system. Compared with discrete 74-series logic, this FPGA reduces board area and BOM cost while keeping the logic fully reconfigurable for late-stage design changes.
Recommandé
Legacy Parallel-Bus Bridges (PCI / ISA)
The EP1K10TC100-2NGZ is widely used as a legacy parallel-bus bridge between PCI and ISA buses, or between a microcontroller local bus and an external peripheral bus. Its 66 user I/O pins accommodate the address, data, and control signals of an 8-bit or 16-bit bus with margin for handshake and interrupt lines. The 12,288 bits of embedded SRAM provide small FIFO buffers for data hand-off between buses of different speeds, while the -2 speed grade supports typical PCI 33 MHz timing when registers are placed and constrained properly in Quartus II. The 100-TQFP package's 0.5 mm pitch and exposed lead frames simplify two-layer PCB designs for legacy expansion cards. Engineers verify timing closure with TimeQuest and confirm signal-integrity on shared clock nets.
Recommandé
Telecommunications Interface Adapters
Telecommunications equipment designs use the EP1K10TC100-2NGZ to implement glue-logic between framer ICs, line-interface units, and backplane serial links. The 576 logic elements handle HDLC framing, CRC generation, and simple DMA state machines, while the 12,288 bits of SRAM buffer packet payloads during rate adaptation. The 66 user I/O pins support multiple SPI or LVDS interface channels, with the -2 speed grade delivering sufficient Fmax for sub-100 MHz interface logic. Industrial-grade telecom designs often pair the ACEX-1K with an external EEPROM configuration device to enable rapid field reprogramming. The 100-TQFP footprint allows standard SMT assembly lines to build legacy telecom line cards without BGA reflow equipment.
Recommandé
Instrumentation Front-End Controllers
Test and measurement instruments use the EP1K10TC100-2NGZ as a front-end controller that sequences ADCs, multiplexes input channels, and aggregates data for the host DSP or microcontroller. With 576 logic elements and 12,288 bits of SRAM, the device can implement 4-16 channel input multiplexers, trigger logic, and simple digital filters alongside the host CPU. The 66 user I/O pins accommodate parallel ADC data buses and GPIO for range switching. The -2 speed grade supports ADC sample rates up to about 50 MHz when pipelined in Quartus II, while the 100-TQFP package provides mechanical stability for handheld and benchtop instruments. Engineers commonly use the on-chip SRAM as a circular buffer for pre-trigger sample storage in oscilloscope designs.
Recommandé
Education and FPGA Training Platforms
Universities and FPGA training labs use the EP1K10TC100-2NGZ as a low-cost teaching platform for digital-design courses because the 100-TQFP package is hand-solderable on perfboard or two-layer PCBs, eliminating the need for BGA rework stations. With 576 logic elements, the device provides enough fabric for student labs covering counters, UARTs, VGA controllers, simple RISC cores, and FSM exercises. The 12,288 bits of SRAM support introductory memory-controller labs, and the 66 user I/O pins expose enough pins for breadboard-friendly peripherals. Quartus II's free Web Edition supports the ACEX-1K family, allowing students to compile and program without license fees. The -2 speed grade is more than adequate for sub-50 MHz educational designs.
Recommandé
Avionics and Defense Legacy Systems
Long-lifecycle avionics and defense platforms retain the EP1K10TC100-2NGZ as a form-fit-function replacement for boards originally qualified with ACEX-1K silicon. The 576 logic elements support mission-critical interface logic for navigation, communication, and sensor subsystems, while the 12,288 bits of SRAM buffer avionic data buses. The 66 user I/O pins accommodate ARINC 429, MIL-STD-1553, and discrete avionics I/O at 0.5 mm pitch. Defense programs with multi-decade support windows often stockpile -2 speed grade parts at last-time-buy, and the 100-TQFP package simplifies through-hole rework on legacy backplanes. The -2 speed grade provides deterministic timing closure for safety-critical state machines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K10TC100-2NGZ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K10TC100-2N | EP1K10TC100-2 | EP1K10TC100-1N | EP1K10TC100-1 | EP1K10TC100-3N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Speed Grade | -2 | -2 (same) | -2 (same) | -1 (slower) | -1 (slower) | -3 (faster) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Embedded SRAM (bits) | 12288 | 12288 | 12288 | 12288 | 12288 | 12288 |
| User I/O | 66 | 66 | 66 | 66 | 66 | 66 |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Operating Temperature | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Same-speed drop-in alternative with no PCB changes required (vs EP1K10TC100-2N)
- Faster speed grade available for timing-critical designs (vs EP1K10TC100-3N)
- Slower speed grade available for cost-sensitive or power-limited designs (vs EP1K10TC100-1N)
Notes de conception
Estimated: When migrating between ACEX-1K speed grades (-1 vs -2 vs -3) on the same 100-TQFP footprint, the -2 grade's Fmax is approximately 15-25 percent higher than the -1 grade and 15-25 percent lower than the -3 grade. Always re-run TimeQuest timing analysis in Quartus II after substituting a different speed grade, because placement and routing are timing-driven and the slower part may fail timing closure. The 66 user I/O budget is shared across all I/O banks, so plan bank assignments carefully when mixing 2.5 V and 3.3 V interface standards.
Decouple VCCINT (2.5 V core) and VCCIO (I/O bank reference) with at least one 0.1 µF ceramic capacitor per supply pin, placed within 3 mm of the package lead. Add a bulk 10 µF tantalum or ceramic capacitor near the device for transient suppression during configuration. The ACEX-1K draws significant inrush current during SRAM configuration (typically 50-150 mA peak), so verify that the host 2.5 V regulator can supply this transient without sagging below the 2.375 V minimum. Use a separate analog ground island if the design mixes sensitive analog circuitry.
The 100-TQFP package has 0.5 mm pitch leads with a typical land length of 1.5 mm, requiring standard SMT reflow profiles (peak 245-260 °C for lead-free, 215-220 °C for SnPb). Keep all signal traces at least 0.2 mm from the package outline to avoid solder bridging, and use a ground pour under the device for thermal dissipation and EMI suppression. JTAG signals (TCK, TMS, TDI, TDO) should be routed with 4-8 mil traces and protected with 10 kΩ pull-ups on TMS and TDI to prevent spurious configuration during power-up.
Differential pairs (LVDS, RSDS) on the EP1K10TC100-2NGZ should be length-matched within 1 mm and routed on a single signal layer with a continuous ground reference plane below. Avoid routing high-speed signals across split power planes or package voids, because return-path discontinuities will degrade signal integrity and increase EMI. Keep clock signals away from I/O edges by at least 3x the trace-to-trace spacing, and place series termination resistors within 5 mm of the FPGA output pin for source-terminated clocks above 50 MHz.
Informations de conformité
Lifecycle status is Obsolete as of 2026-09-07. RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data and are marked [DATA_NEEDED] in the specs array. AEC-Q100 is not applicable because this is a commercial-grade FPGA without automotive qualification.
