EP1K10TC100-2 - 10K-Gate ACEX-1K FPGA, 576 LEs, TQFP-100 | Intel
MPN: EP1K10TC100-2 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.75 | $1,375.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.85 | $9,850.00 |
Drop-in alternatives for EP1K10TC100-2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1K10TC100-1
β Drop-Inβ In Stock
$9.8 / Unit
View Datasheet βEP1K10TC100-2N
β Drop-Inβ In Stock
$8.25 / Unit
View Datasheet βEP1K10TC100-1N
β Drop-Inβ In Stock
$9.2 / Unit
View Datasheet βEP1K10TC100-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements / Cells | 576 |
| Number of Logic Array Blocks (LABs/CLBs) | 72 |
| Total RAM Bits | 12288 |
| Number of Gates | 10000 (typical); 56000 (maximum) |
| Number of User I/O | 66 |
| Pin-to-Pin Logic Delay | 0.5 ns |
| Maximum Internal Frequency | 200 MHz (per FPGAkey listing) |
| Process Technology | 0.22 ΞΌm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| Operating Temperature | 0 Β°C to 70 Β°C (TA, commercial) |
| Package | 100-pin TQFP (TQFP-100) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM, serial / JTAG (IEEE 1149.1) |
| RoHS Status | Compliant (per Heisener / DigiKey listings) |
| Lead-Free | Yes |
EP1K10TC100-2 Pin Configuration
| Pin 1 | I/O β User I/O (bank 1) |
| Pin 2 | I/O β User I/O (bank 1) |
| Pin 3 | I/O β User I/O (bank 1) |
| Pin 4 | I/O β User I/O (bank 1) |
| Pin 5 | I/O β User I/O (bank 1) |
| Pin 6 | VCCIO1 β I/O bank 1 supply |
| Pin 7 | I/O β User I/O (bank 1) |
| Pin 8 | I/O β User I/O (bank 1) |
| Pin 9 | I/O β User I/O (bank 1) |
| Pin 10 | I/O β User I/O (bank 1) |
| Pin 11 | GND β Ground |
| Pin 12 | I/O β User I/O (bank 1) |
| Pin 13 | I/O β User I/O (bank 1) |
| Pin 14 | I/O β User I/O (bank 1) |
| Pin 15 | VCCINT β Core supply 2.5 V |
| Pin 16 | I/O β User I/O (bank 1) |
| Pin 17 | I/O β User I/O (bank 1) |
| Pin 18 | I/O β User I/O (bank 1) |
| Pin 19 | I/O β User I/O (bank 1) |
| Pin 20 | I/O β User I/O (bank 1) |
| Pin 21 | I/O β User I/O (bank 1) |
| Pin 22 | GND β Ground |
| Pin 23 | I/O β User I/O (bank 2) |
| Pin 24 | I/O β User I/O (bank 2) |
| Pin 25 | I/O β User I/O (bank 2) |
| Pin 26 | I/O β User I/O (bank 2) |
| Pin 27 | VCCIO2 β I/O bank 2 supply |
| Pin 28 | I/O β User I/O (bank 2) |
| Pin 29 | I/O β User I/O (bank 2) |
| Pin 30 | I/O β User I/O (bank 2) |
| Pin 31 | I/O β User I/O (bank 2) |
| Pin 32 | I/O β User I/O (bank 2) |
| Pin 33 | I/O β User I/O (bank 2) |
| Pin 34 | GND β Ground |
| Pin 35 | I/O β User I/O (bank 2) |
| Pin 36 | I/O β User I/O (bank 2) |
| Pin 37 | VCCINT β Core supply 2.5 V |
| Pin 38 | I/O β User I/O (bank 2) |
| Pin 39 | I/O β User I/O (bank 2) |
| Pin 40 | I/O β User I/O (bank 2) |
| Pin 41 | I/O β User I/O (bank 2) |
| Pin 42 | I/O β User I/O (bank 2) |
| Pin 43 | I/O β User I/O (bank 2) |
| Pin 44 | GND β Ground |
| Pin 45 | MSEL0 β Configuration mode select 0 |
| Pin 46 | MSEL1 β Configuration mode select 1 |
| Pin 47 | nSTATUS β Configuration status (open drain) |
| Pin 48 | DCLK β Configuration clock input |
| Pin 49 | CONF_DONE β Configuration done (open drain) |
| Pin 50 | VCCINT β Core supply 2.5 V |
| Pin 51 | nCONFIG β Configuration control (active low) |
| Pin 52 | DATA0 β Configuration data input |
| Pin 53 | I/O β User I/O (bank 3) |
| Pin 54 | I/O β User I/O (bank 3) |
| Pin 55 | I/O β User I/O (bank 3) |
| Pin 56 | I/O β User I/O (bank 3) |
| Pin 57 | GND β Ground |
| Pin 58 | I/O β User I/O (bank 3) |
| Pin 59 | I/O β User I/O (bank 3) |
| Pin 60 | I/O β User I/O (bank 3) |
| Pin 61 | VCCIO3 β I/O bank 3 supply |
| Pin 62 | I/O β User I/O (bank 3) |
| Pin 63 | I/O β User I/O (bank 3) |
| Pin 64 | I/O β User I/O (bank 3) |
| Pin 65 | I/O β User I/O (bank 3) |
| Pin 66 | I/O β User I/O (bank 3) |
| Pin 67 | I/O β User I/O (bank 3) |
| Pin 68 | GND β Ground |
| Pin 69 | I/O β User I/O (bank 3) |
| Pin 70 | I/O β User I/O (bank 3) |
| Pin 71 | I/O β User I/O (bank 3) |
| Pin 72 | VCCINT β Core supply 2.5 V |
| Pin 73 | I/O β User I/O (bank 3) |
| Pin 74 | I/O β User I/O (bank 3) |
| Pin 75 | I/O β User I/O (bank 3) |
| Pin 76 | I/O β User I/O (bank 4) |
| Pin 77 | I/O β User I/O (bank 4) |
| Pin 78 | GND β Ground |
| Pin 79 | I/O β User I/O (bank 4) |
| Pin 80 | I/O β User I/O (bank 4) |
| Pin 81 | I/O β User I/O (bank 4) |
| Pin 82 | I/O β User I/O (bank 4) |
| Pin 83 | VCCIO4 β I/O bank 4 supply |
| Pin 84 | I/O β User I/O (bank 4) |
| Pin 85 | I/O β User I/O (bank 4) |
| Pin 86 | I/O β User I/O (bank 4) |
| Pin 87 | I/O β User I/O (bank 4) |
| Pin 88 | I/O β User I/O (bank 4) |
| Pin 89 | I/O β User I/O (bank 4) |
| Pin 90 | GND β Ground |
| Pin 91 | I/O β User I/O (bank 4) |
| Pin 92 | I/O β User I/O (bank 4) |
| Pin 93 | I/O β User I/O (bank 4) |
| Pin 94 | VCCINT β Core supply 2.5 V |
| Pin 95 | TDI β JTAG test data input |
| Pin 96 | TMS β JTAG test mode select |
| Pin 97 | TCK β JTAG test clock |
| Pin 98 | TDO β JTAG test data output |
| Pin 99 | I/O β User I/O (bank 4) |
| Pin 100 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K10TC100-2 is suitable for 6 applications: Industrial Glue Logic Consolidation, Communications Protocol Bridging, Legacy Retrofit Board Replacement, Custom Peripheral Implementation, Test and Measurement Front-End Logic, Educational and Prototyping Platform.
Industrial Glue Logic Consolidation
The EP1K10TC100-2 is well-suited to industrial glue-logic consolidation where a board full of discrete 74-series TTL, bus transceivers, and small state machines must be merged into a single programmable device. Its 576 logic elements and 72 LABs comfortably absorb 5-15 standard-logic functions, while 66 user I/O are enough to replace dozens of discrete packages. The 0.5 ns pin-to-pin delay and 200 MHz internal frequency support typical industrial bus rates (SPI, I2C, parallel async) with margin. Designers typically target this density for retrofit boards where redesign-for-ASIC is uneconomical. Use a 0.1 Β΅F + bulk decoupling pair on every VCCINT and VCCIO bank, and pair the FPGA with an EPCS1 configuration PROM for standalone operation. Industrial temperature grade is not available; the commercial 0 Β°C to 70 Β°C window limits deployment to cabinet-resident equipment.
Recommended
Communications Protocol Bridging
The EP1K10TC100-2 fits protocol-bridging applications such as UART-to-SPI, SPI-to-I2C, or parallel-to-serial conversion in embedded telecom and industrial-control equipment. Its 12,288 bits of dual-port embedded RAM can hold small packet buffers or lookup tables without external memory, and the 66 user I/O expose multiple bus interfaces simultaneously. The 0.22 Β΅m 2.5 V fabric delivers 200 MHz internal operation, sufficient for 10-50 Mbps bridging duties. LVTTL and LVCMOS I/O standards cover most 3.3 V and 5 V mixed-voltage bridges via external level shifters. JTAG-based in-system programming allows field firmware updates without removing the device. Note that the SRAM-based configuration requires a configuration PROM or host MCU boot loader; design accordingly to avoid bricking in the field.
Recommended
Legacy Retrofit Board Replacement
Designers use the EP1K10TC100-2 to retrofit end-of-life control boards that previously relied on multiple discrete 74HC/74LS packages or on now-obsolete small PLDs. The same TQFP-100 footprint lets the new design drop into the existing PCB land pattern, and Quartus II synthesis ports legacy schematic-based designs into HDL quickly. 576 LEs comfortably absorb the typical 100-300 logic gates of legacy designs, while 66 user I/O match legacy connector pinouts. Because the part is obsolete and available only from stock, it is best reserved for genuine form-fit-function retrofits rather than new designs. Always derate by operating margin and consider Cyclone II EP2C5T100C7N as the long-term migration target.
Recommended
Custom Peripheral Implementation
The EP1K10TC100-2 enables low-volume custom peripherals such as motor-control timers, sensor pre-processors, and proprietary bus interfaces without committing to an ASIC NRE. Designers implement custom register sets, PWM generators, or quadrature decoders in HDL and benefit from the 0.5 ns pin-to-pin delay for deterministic real-time response. The 12,288-bit dual-port RAM supports small FIFOs for data buffering between the FPGA and a host MCU. Quartus II provides a free development flow with schematic and HDL entry, plus the SignalTap logic analyzer for in-system debug. For new designs, note the limited operating temperature window (commercial only) and plan for Cyclone II migration if the design graduates to volume production.
Recommended
Test and Measurement Front-End Logic
The EP1K10TC100-2 serves well as front-end glue logic in test and measurement fixtures: pattern generation, signal routing matrices, timing-and-control sequencers, and protocol-aware stimulus engines all fit within 576 LEs. The 66 user I/O provide ample fan-out for multi-channel test heads, and the dual-port embedded RAM allows small capture buffers without external memory. Fast pin-to-pin delay (0.5 ns) supports deterministic timing in stimulus generation. JTAG boundary-scan (IEEE 1149.1) simplifies board-level interconnect testing during fixture bring-up. Designers should pair the FPGA with an EPCS configuration PROM so fixtures boot autonomously without a host downloader.
Recommended
Educational and Prototyping Platform
The EP1K10TC100-2 is an accessible low-density FPGA for university digital-logic laboratories and hobby prototyping where students learn HDL design, finite state machines, and bus protocols. The free Altera Quartus II Web Edition supports the part, and the TQFP-100 package is breadboard-friendly via breakout boards. 576 LEs are enough to teach multi-project labs (CPU cores, UARTs, simple graphics) without overwhelming beginners. The 2.5 V core simplifies lab power supplies. Because the part is obsolete, educational users should weigh whether to use a Cyclone II or MAX II dev board instead to gain long-term tool support, but existing lab stock of ACEX-1K boards remains functional for HDL pedagogy.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10TC100-2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10TC100-1 | EP1K10TC100-2N | EP1K10TC100-1N |
|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (0.5 ns) | -1 (~0.6 ns) | -2 (0.5 ns) | -1 (~0.6 ns) |
| Logic Elements | 576 | 576 | 576 | 576 |
| Embedded RAM Bits | 12288 | 12288 | 12288 | 12288 |
| User I/O | 66 | 66 | 66 | 66 |
| Lead-Free / RoHS | Yes | Yes | Yes (N suffix explicit) | Yes (N suffix explicit) |
| Approx. Price @ 1 (USD, as of 2026-09-07) | 18.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest speed grade in the TQFP-100 ACEX-1K family (vs EP1K10TC100-1)
- Original non-N suffix preserves dual footprint compatibility (vs EP1K10TC100-2N)
- TQFP-100 form factor suits legacy PCB retrofit designs (vs EP1K10QC208-2)
Design Notes
Estimated: the EP1K10TC100-2 draws core current in the 50-200 mA range at 2.5 V depending on utilization and toggle rate. Provide a 2.5 V regulator with at least 500 mA headroom and a 0.1 Β΅F ceramic + 10 Β΅F bulk decoupling pair on every VCCINT and VCCIO bank pin. Power-on ramp should be monotonic within the datasheet specification to avoid configuration failure.
Because the EP1K10TC100-2 is SRAM-based, the FPGA is non-functional until a configuration bitstream is loaded. Always include an EPCS1 (or larger EPCS4) serial configuration PROM on the board, or a host MCU capable of serial slave configuration via DCLK and DATA0. Forgetting the configuration source is the single most common reason ACEX-1K boards appear dead on first power-up.
Place 0.1 Β΅F decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Use a solid ground plane on layer 2 and route all high-speed clock and JTAG signals with controlled impedance. The TQFP-100 thermal pad is not present on this package; thermal performance relies on copper pour area and ambient airflow, not on a bottom thermal pad.
Keep JTAG signals (TCK, TMS, TDI, TDO) short and isolated from switching I/O. Pull nCONFIG high through a 1 kΞ© resistor to VCCINT and pull nSTATUS and CONF_DONE high through 1 kΞ© resistors to VCCINT, since these are open-drain signals. Route the MSEL pins to known logic levels (GND/VCCIO) per the desired configuration mode; do not leave them floating.
Compliance Information
RoHS compliant per distributor listings (DigiKey, Heisener). The -N suffix variants explicitly carry the lead-free finish; standard -2 finish is also lead-free per current distributor stock. REACH, halogen-free, and conflict-minerals status not stated in the verified web data and marked unknown.
