EPM570F256I5 - 570-LE MAX II CPLD, 256-BGA, Industrial | Intel / Altera
MPN: EPM570F256I5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $19.85 | $198.50 |
| 100 | $16.4 | $1,640.00 |
| 500 | $14.1 | $7,050.00 |
| 1,000 | $12.6 | $12,600.00 |
Drop-in alternatives for EPM570F256I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570F256I5N
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPM570F256C5N
✅ Drop-In✓ In Stock
$17.03 / Unit
View Datasheet →EPM570F256C4N
✅ Drop-In✓ In Stock
$26.85 / Unit
View Datasheet →EPM570F256C3N
✅ Drop-In✓ In Stock
$13.75 / Unit
View Datasheet →EPM570F256I5 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements (LE) | 570 |
| Maximum User I/O Pins | 160 |
| User Flash Memory (UFM) | 8 Kbits |
| Package Type | 256-ball FineLine BGA (FBGA-256) |
| Operating Temperature | -40C to +85C (industrial) |
| Supply Voltage - Core | 3.3 V (also operates at 3.3V per part description) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI |
| MultiVolt I/O | 1.5V / 1.8V / 2.5V / 3.3V |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| In-System Programmability | Yes |
| Non-volatile Configuration | Yes (on-chip flash) |
| Pin-to-Pin Logic Delay (typ) | 5 ns to 7 ns |
| Mounting Type | Surface Mount |
| Width | 17 mm (per Partstack) |
| Speed Grade | I5 |
EPM570F256I5 256-ball fineline bga (fbga-256) Pin Configuration Guide
Complete pinout information for EPM570F256I5 (256-ball fineline bga (fbga-256) package) with 160 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570F256I5.
Refer to the datasheet for full pin configuration.
Estimated pin count: 160 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570F256I5 is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Power-Up Sequencing and Supervisory Logic, Glue-Logic Replacement for Discrete 74-Series Logic, FPGA/Microcontroller Configuration Control, Protocol Translation (UART/SPI/I2C Bridging), LED Display and Lighting Control.
Industrial I/O Expansion and Bus Bridging
The EPM570F256I5's 160 user I/O pins and 570 logic elements make it ideal for I/O expansion and bus bridging in industrial PLCs, sensor hubs, and motor-control boards. Its non-volatile instant-on configuration eliminates firmware load delay at power-up, while the MultiVolt I/O supports 1.5V/1.8V/2.5V/3.3V interoperability with legacy 5V peripherals via level shifting. Deterministic pin-to-pin delays (5-7 ns typical) guarantee bus-timing margins for SPI, I2C, UART, and parallel-bus glue logic. Industrial-grade -40C to +85C operation handles factory floor temperature swings without thermal derating.
Recommended
Power-Up Sequencing and Supervisory Logic
The MAX II CPLD excels at power-up sequencing in multi-rail systems, where its instant-on non-volatile configuration enables precise timing of voltage-rail enable signals without microcontroller boot delay. The 8 Kbits of user flash memory can store default rail-enable sequencing patterns and watchdog timer parameters that survive power cycles. With 5-7 ns typical propagation delay and industrial temperature operation, the EPM570F256I5 provides reliable supervisory logic in telecom infrastructure, server motherboards, and industrial controllers where deterministic start-up behavior is mission-critical.
Recommended
Glue-Logic Replacement for Discrete 74-Series Logic
The EPM570F256I5 can replace 30-50 packages of discrete 74-series TTL/CMOS glue logic with a single 256-BGA device, dramatically simplifying PCB layout, reducing BOM cost, and eliminating trace-length matching issues. Quartus synthesis accepts VHDL/Verilog netlist translations of legacy 74-series designs and the JTAG-based ISP allows in-field design revisions. Industrial-temp grade makes it ideal for replacing discrete logic in factory automation equipment where 74-series parts are obsolete or being phased out.
Recommended
FPGA/Microcontroller Configuration Control
Use the EPM570F256I5 as a companion configuration controller for FPGAs (e.g. Cyclone, Stratix) or microcontrollers in multi-chip systems. The CPLD's instant-on behavior and dedicated JTAG chain support allow it to manage FPP/PS configuration modes, hold configuration lines stable during FPGA boot, and perform multi-device programming in parallel via JTAG. The UFM block can store backup bitstreams or golden configuration images for fail-safe recovery in safety-critical industrial applications.
Recommended
Protocol Translation (UART/SPI/I2C Bridging)
The 570 LEs in the EPM570F256I5 comfortably handle custom protocol bridges between UART, SPI, I2C, parallel-bus, CAN, and LIN interfaces at industrial bus speeds. MultiVolt I/O allows direct connection to 1.8V microcontrollers and 5V legacy peripherals without external level shifters. The CPLD's deterministic timing and industrial temperature range make it ideal for protocol translation in industrial sensor networks, automotive body electronics, and embedded gateways.
Recommended
LED Display and Lighting Control
With 160 user I/Os, the EPM570F256I5 can drive large LED matrix displays, RGB lighting strips, and industrial signage panels via direct multiplexing or PWM dimming. The UFM block stores lighting presets and animation sequences without external memory. Industrial-temp operation enables outdoor signage and architectural lighting installations where temperature swings would compromise discrete-logic designs.
Recommended
Recommended Products Summary
Engineering reference data for EPM570F256I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256I5N | EPM570F256C5N | EPM570F256C4N | EPM570F256C3N |
|---|---|---|---|---|---|
| Package | FBGA-256 (17 mm, 1.0 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 570 LE | 570 LE | 570 LE | 570 LE | 570 LE |
| Maximum User I/Os | 160 | 160 | 160 | 160 | 160 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C |
| Speed Grade | I5 | I5 (same) | C5 | C4 (faster) | C3 (fastest) |
| Lead-Free / RoHS | No (Pb-bearing) | Yes (-N suffix) | Yes | Yes | Yes |
| UFM (User Flash) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Approx Unit Price (USD, qty 100) | 16.40 | 16.40 (same) | 12.50-14.50 | 16.00-18.50 | [DATA_NEEDED] |
Key Differentiators
- Same-family lead-free RoHS variant available with identical pinout (vs EPM570F256I5N)
- Industrial temperature grade (-40C to +85C) vs commercial (vs EPM570F256C5N)
- Same 256-BGA footprint across all speed grades enables PCB reuse (vs EPM570F256C4N / EPM570F256C3N)
Design Notes
The EPM570F256I5 requires a clean 3.3V core supply (VCCINT) and a separate VCCIO bank supply per I/O bank. Per the MAX II datasheet, place a 0.1 uF decoupling capacitor within 5 mm of every VCC pin and add 10 uF bulk capacitance per power rail. Avoid sharing VCCIO between widely spaced banks; noisy I/O banks can inject noise into the logic-array supply. Estimated: at 50% I/O toggle rate, supply current is approximately 50-100 mA per VCCIO bank; reference the DC characteristics table in the datasheet for exact ICCINT figures.
The FBGA-256 package has a 1.0 mm ball pitch and 17 mm body, requiring 4-6 layer PCB with microvia or via-in-pad technology. Escape routing is constrained: maximum two signal tracks between adjacent balls in a single layer. Use Intel's recommended BGA breakout pattern (per the MAX II Handbook pinout file) and length-match clock, JTAG, and high-speed I/O within 50 mil. Thermal pad is not present on MAX II FBGA - the device is low enough power that 1 oz copper pours are adequate.
Group JTAG signals (TMS, TCK, TDO, TDI) on a dedicated 10-pin 0.05-inch header with 4.7 kohm pull-ups on TMS and TDI; keep JTAG trace length below 100 mm to avoid signal-integrity issues during in-system programming. Isolate analog and digital grounds at the connector level but join them at a single ground point beneath the CPLD to prevent ground loops. If using PLL outputs, route clock traces on the inner PCB layer with a continuous ground reference on the layer above.
Do not assume C5 and I5 variants are interchangeable: the EPM570F256C5N is commercial temp grade and will fail cold-start below 0C in industrial designs. Also note that MAX II is on Intel's NRND list - for new designs, migrate to MAX V (5M570Z) or MAX 10 (10M02) families. Watch out for MSL3 moisture sensitivity on FBGA packages; bake at 125C for 24 hours before assembly if the floor-life has been exceeded.
Compliance Information
Original EPM570F256I5 (no -N suffix) is Pb-bearing. For RoHS-compliant designs use EPM570F256I5N. AEC-Q100 not qualified - this is industrial-temp, not automotive-qualified.
