ISO7741DBQR - 100Mbps 4-Ch Digital Isolator SSOP-16 | TI
MPN: ISO7741DBQR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.45 | $3.45 |
| 10 | $3.05 | $30.50 |
| 100 | $2.55 | $255.00 |
| 500 | $2.18 | $1,090.00 |
| 1,000 | $1.85 | $1,850.00 |
ISO7741DBQR Overview
What is a digital isolator? A digital isolator is a semiconductor device that transfers logic-level signals across a galvanic isolation barrier using capacitive or magnetic coupling instead of optocouplers, enabling robust high-speed data transfer while protecting low-voltage circuitry from high-voltage transients. Within the broader product taxonomy, digital isolators sit inside Interface ICs -> Isolation ICs -> Signal Conditioning -> Power Management & Interface. The ISO774x family adopts TI's silicon-dioxide (SiO2) capacitive coupling, which provides stronger CMTI and longer service life than LED-based optocouplers.
Key features include reinforced insulation per VDE / CSA / TUV / CQC, an operating temperature range of -55°C to +125°C, low power consumption of approximately 1.5 mA per channel at 10 Mbps, and a default-low output state that drives a known logic level if input power is lost. The device is rated MSL-2 (260°C, 1 year) and is RoHS/REACH compliant, supporting lead-free assembly on standard SMT lines.
The ISO7741DBQR uses a differential capacitive coupling architecture with on-chip encoding/decoding, achieving 100 Mbps NRZ signaling while maintaining < 4 mW per channel. Each channel incorporates a refresh generator that continuously updates the output state, ensuring valid logic levels are preserved even after long periods without input transitions.
Typical applications include industrial fieldbus isolation (RS-485, CAN, Profibus), motor-drive gate-driver signal isolation, solar inverter communication links, isolated SPI between a microcontroller and an ADC, and medical equipment patient-isolation barriers. The wide temperature range and reinforced insulation rating also support factory automation, programmable logic controllers (PLC), and battery management systems.
When designing with this device, ensure that decoupling capacitors are placed within 2 mm of the VCC1 and VCC2 pins and that the isolation barrier creepage/clearance on the PCB meets the end-equipment standard (e.g., 8 mm for reinforced 250 Vrms). Avoid routing any signal or plane under the device body between pins 1-8 and pins 9-16 to preserve the isolation barrier.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (TI ISO7740/ISO7742 plus cross-brand ADuM141E, Si8641, MAX14431 equivalents), and practical design notes that are not found in the manufacturer datasheet alone.
Drop-in alternatives for ISO7741DBQR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ISO7741DBQR (same form factor and footprint) — differing in Package, Channel Configuration, Number of Channels, Common-Mode Transient Immunity (CMTI), MSL Level.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ISO7741FDBQR
✅ Drop-In✓ In Stock
$0.98 / Unit
View Datasheet →ISO7740DBQR
✅ Drop-In📋 Reference alternative (not in catalog)
ISO7742DBQR
✅ Drop-In✓ In Stock
$2.1 / Unit
View Datasheet →ISO7741DBQRQ1
✅ Drop-In📋 Reference alternative (not in catalog)
ADuM141E1ARWZ
✅ Drop-In📋 Reference alternative (not in catalog)
Si8641BB-B-IS1
✅ Drop-In📋 Reference alternative (not in catalog)
MAX14431EAWE+
✅ Drop-In📋 Reference alternative (not in catalog)
ISO7741DBQR Specifications
| Isolation Type | Digital Isolator (Capacitive Coupling) |
| Number of Channels | 4 |
| Channel Configuration | 3 Forward / 1 Reverse |
| Data Rate (max) | 100 Mbps |
| Isolation Rating | 3000 Vrms (per UL 1577) |
| CMTI (min) | 85 kV/µs |
| Propagation Delay (typ) | 10.7 ns |
| Propagation Delay (max) | 16 ns |
| Supply Voltage Range | 2.25 V to 5.5 V (both sides) |
| Operating Temperature | -55°C to +125°C |
| Default Output State | Low (default-high variant: ISO7741F) |
| Package | 16-pin SSOP (DBQ), 0.154" body width |
| Insulation Type | Reinforced (per VDE/CSA/TUV/CQC) |
| MSL Level | MSL-2 (260°C, 1 year) |
| RoHS / REACH | Compliant |
ISO7741DBQR Pin Configuration
| Pin 1 | VDD1 — Power supply, side 1 (2.25 V to 5.5 V) |
| Pin 2 | IN1 — Input, channel 1 (default-LOW) |
| Pin 3 | GND1 — Ground, side 1 |
| Pin 4 | IN2 — Input, channel 2 (default-LOW) |
| Pin 5 | GND1 — Ground, side 1 |
| Pin 6 | IN3 — Input, channel 3 (default-LOW) |
| Pin 7 | GND1 — Ground, side 1 |
| Pin 8 | NC — Not connected (per datasheet) |
| Pin 9 | GND2 — Ground, side 2 |
| Pin 10 | OUT1 — Output, channel 1 (default-LOW) |
| Pin 11 | GND2 — Ground, side 2 |
| Pin 12 | OUT2 — Output, channel 2 (default-LOW) |
| Pin 13 | GND2 — Ground, side 2 |
| Pin 14 | OUT3 — Output, channel 3 (default-LOW) |
| Pin 15 | GND2 — Ground, side 2 |
| Pin 16 | VDD2 — Power supply, side 2 (2.25 V to 5.5 V) |
Typical Applications
ISO7741DBQR is suitable for 7 applications: Industrial RS-485 / CAN Bus Isolation, Motor Drive Gate-Driver Signal Isolation, Isolated SPI Between MCU and ADC, Solar Inverter Communication Link, Medical Equipment Patient Isolation, PLC Digital I/O Module Isolation, Battery Management System (BMS) Communication.
Industrial RS-485 / CAN Bus Isolation
Why ISO7741DBQR fits this application: The 3 forward / 1 reverse channel count of the ISO7741DBQR maps directly to the signal direction of an isolated RS-485 or CAN transceiver, where TXD/RXD flow one way and a control signal flows back. Its 100 Mbps data rate easily covers 10 Mbps CAN-FD and 50 Mbps RS-485, while the 85 kV/µs minimum CMTI prevents data corruption from fast dv/dt events on motor cables. How it is used + performance consideration: The IC is placed between the MCU and the isolated RS-485 transceiver (e.g., TI ISO3082 or MAX3485); VCC1 is supplied from the 3.3 V MCU rail and VCC2 from the isolated 3.3 V rail on the bus side. Designers must allocate 8 mm PCB creepage under the device to maintain reinforced insulation per IEC 61800-5-1 for 600 V motor-bus systems, and add TVS protection on the bus side for surge immunity to IEC 61000-4-5.
Recommended
Motor Drive Gate-Driver Signal Isolation
Why ISO7741DBQR fits this application: Reinforced 3000 Vrms isolation and 85 kV/µs CMTI make the ISO7741DBQR well-suited for isolating low-voltage MCU PWM/timing signals feeding gate-driver ICs that switch 600 V / 1200 V IGBT or SiC MOSFETs in industrial inverters. The 10.7 ns typical propagation delay preserves tight dead-time budgets in 50 kHz PWM switching. How it is used + performance consideration: Place the device near the gate-driver board edge with VCC1 supplied from the MCU rail and VCC2 from the floating high-side supply (typically a bootstrap or isolated DC-DC). Decouple each VCC pin with 100 nF + 10 µF ceramics within 2 mm of the IC. Trade-off: the SSOP-16 (DBQ) package is rated for 3000 Vrms in TI's datasheet, so for 5 kVrms reinforced systems the ISO7741DWR in SOIC-16-W is preferred.
Recommended
Isolated SPI Between MCU and ADC
Why ISO7741DBQR fits this application: The 3 forward / 1 reverse channel count of the ISO7741DBQR is a perfect fit for 4-wire SPI (SCK, MOSI, CS forward + MISO reverse), enabling a microcontroller to safely read a precision ADC across a galvanic barrier used for high-voltage sensing. The 100 Mbps data rate supports SCK frequencies up to 50 MHz, suitable for most 16- and 18-bit SAR ADCs used in power-quality metering. How it is used + performance consideration: Connect VCC1 to the MCU 3.3 V rail and VCC2 to an isolated supply derived from the high-voltage side via a small isolated DC-DC (e.g., TI ISOW7841 or DCR010505). Trade-off: ensure the isolator propagation delay (16 ns max) plus the ADC conversion delay fits within the SPI timing budget; a 2.5 ns channel-to-channel skew preserves clock-to-data alignment in synchronous-sampling ADC chains.
Recommended
Solar Inverter Communication Link
Why ISO7741DBQR fits this application: Reinforced 3000 Vrms isolation and a -55°C to +125°C operating range make the ISO7741DBQR suitable for the DC-link-to-grid barrier inside residential and commercial string solar inverters. The 85 kV/µs CMTI keeps data lines intact during the fast-switching edges of the inverter's IGBT bridge. How it is used + performance consideration: Used to isolate Modbus RTU or CAN communication between the inverter's power-conversion MCU (low-voltage side) and the grid-monitoring modem (high-voltage side). Each channel typically operates at 1 Mbps, well within the device's 100 Mbps envelope. Trade-off: for high-altitude (>2000 m) installations where creepage must be increased, migrate to the wider-body ISO7741DWR (SOIC-16-W) for its 8 mm minimum internal clearance.
Recommended
Medical Equipment Patient Isolation
Why ISO7741DBQR fits this application: The ISO7741DBQR's reinforced insulation per VDE / CSA / TUV / CQC, combined with its low 1.5 mA-per-channel quiescent current, makes it a candidate for patient-connected medical devices that must meet IEC 60601-1 isolation requirements between the patient-applied part and the host electronics. The 100 Mbps data rate supports high-resolution imaging data links. How it is used + performance consideration: Place the device between patient-applied sensor front-ends (ECG, SpO2, EEG) and the host MCU/DSP. Designers must verify the end-equipment creepage/clearance (typically 8 mm for 250 V mains-reinforced patient isolation) and add a separate isolated DC-DC supply. Trade-off: for 5 kVrms patient-isolation applications that require MOOP/MOPP, the wider-body ISO7741DWR variant is preferred for its higher isolation voltage rating.
Recommended
PLC Digital I/O Module Isolation
Why ISO7741DBQR fits this application: The 4-channel 3/1 configuration of the ISO7741DBQR maps cleanly to a typical 24 V industrial digital-input module where three inputs report to the PLC backplane and one output drives an indicator LED. Its 100 Mbps capability is over-spec for 100 kHz PLC scan rates but provides margin for future high-speed fieldbus migration (IO-Link, EtherCAT). How it is used + performance consideration: VCC1 is supplied from the PLC backplane 5 V and VCC2 from the field-side 24 V through a small buck regulator. Add 100 nF + 10 µF decoupling on each supply pin. Trade-off: for IEC 61131-2 type-3 24 V inputs that require ±35 V transient protection, add external TVS (e.g., SMAJ33CA) on the field side and a current-limiting resistor on each input pin.
Recommended
Battery Management System (BMS) Communication
Why ISO7741DBQR fits this application: High-voltage battery stacks (400 V or 800 V EV traction packs) require reinforced isolation between individual cell-monitoring MCUs and the master BMS controller; the ISO7741DBQR's 3000 Vrms rating and 85 kV/µs CMTI prevent data corruption during fast switching of the high-voltage DC-DC converter. Its 16-pin SSOP (DBQ) package is footprint-compatible with the ISO7741FDBQR variant for design flexibility. How it is used + performance consideration: Used to isolate SPI or CAN communication between a battery-monitoring MCU (e.g., TI BQ79631-Q1) and the master BMS MCU. Trade-off: for automotive AEC-Q100 qualification, choose the ISO7741DBQRQ1 variant; for very high CMTI (>100 kV/µs) environments with SiC switching, validate timing margins with the 16 ns maximum propagation delay figure.
Recommended
Recommended Products Summary
Engineering reference data for ISO7741DBQR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ISO7741FDBQR | ISO7740DBQR | ISO7742DBQR | ISO7741DBQRQ1 | ADuM141E1ARWZ | Si8641BB-B-IS1 |
|---|---|---|---|---|---|---|---|
| Package | SSOP-16 (DBQ) | SSOP-16 (DBQ) - same | SSOP-16 (DBQ) - same | SSOP-16 (DBQ) - same | SSOP-16 (DBQ) - same | SOIC-16-W - different footprint | QSOP-16 - different footprint |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Analog Devices | Silicon Labs |
| Number of Channels | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Channel Direction | 3 forward / 1 reverse | 3 forward / 1 reverse | 4 forward / 0 reverse | 2 forward / 2 reverse | 3 forward / 1 reverse | 3 forward / 1 reverse | 3 forward / 1 reverse |
| Data Rate (max) | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 25 Mbps | 150 Mbps |
| Isolation Rating (UL 1577) | 3000 Vrms | 3000 Vrms | 3000 Vrms | 3000 Vrms | 3000 Vrms | 5000 Vrms | 2500 Vrms |
| CMTI (min) | 85 kV/µs | 85 kV/µs | 85 kV/µs | 85 kV/µs | 85 kV/µs | 25 kV/µs | 50 kV/µs |
| Propagation Delay (max) | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns | 32 ns | 10 ns |
| Default Output State | Low | High | Low | Low | Low | Low | Low |
| Automotive Grade (AEC-Q100) | No | No | No | No | Yes | No | No |
Key Differentiators
- 3 forward / 1 reverse channel direction (vs ISO7740DBQR (4/0))
- Reinforced 3000 Vrms isolation in narrow-body SSOP-16 (vs ADuM141E1ARWZ (SOIC-16-W))
- 85 kV/µs minimum CMTI (vs ADuM141E1ARWZ (25 kV/µs))
Design Notes
Maintain at least 8 mm of PCB creepage between the VCC1 side (pins 1-8) and the VCC2 side (pins 9-16) to preserve the reinforced 3000 Vrms insulation rating. Do NOT route any signal trace, via, or ground plane under the device body between the two pin groups - this would compromise the isolation barrier. For higher-altitude (>2000 m) or 5 kVrms applications, migrate to the wider-body ISO7741DWR in SOIC-16-W which provides additional internal clearance.
Place a 100 nF X7R ceramic decoupling capacitor within 2 mm of each VCC pin (pin 1 and pin 16), plus a bulk 10 µF X7R ceramic in parallel for switching-load transients. Each supply domain (VDD1 and VDD2) must be sourced from a separate isolated supply to maintain the galvanic isolation barrier - using a common supply on both sides violates the isolation requirement. Estimated: 1 µA typical quiescent current per channel at 1 Mbps, scaling to ~5 mA per channel at 100 Mbps.
Do not connect VCC1 and VCC2 to the same supply rail - this shorts the isolation barrier and defeats the purpose of the device. The exposed thermal pad on the SSOP-16 (DBQ) package is internally floating and should be left open or tied to GND1 on the PCB. Verify the input signal edges meet the datasheet minimum pulse-width specification (typically 5 ns at 100 Mbps); sub-spec pulse widths may cause output glitching. For default-LOW variants like ISO7741DBQR, the output holds LOW if input power is lost - if you need a HIGH default, use ISO7741FDBQR instead.
Series-terminate each channel output (typically 33 Ω to 50 Ω) when driving long PCB traces (>50 mm) or cables, because the output driver has a fast edge rate (~2 ns) that can cause ringing on unterminated lines. Keep the input and output traces on each side of the isolation barrier as short as possible and avoid running them parallel to the high-voltage side traces to minimize coupling. Channel-to-channel propagation delay skew is typically 2 ns, well within SPI timing budgets at SCK frequencies up to 50 MHz.
Compliance Information
RoHS compliant per TI product page. MSL-2 (260°C, 1 year). For AEC-Q100 automotive qualification, use the ISO7741DBQRQ1 variant. UL 1577 / VDE / CSA / TUV / CQC reinforced insulation certifications per ISO774x family datasheet.
