M1AFS600-1FG484K - Fusion FPGA 600K Gates 172 I/O | Microchip
料号： M1AFS600-1FG484K ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $332.52 | $332.52 |
| 10 | $316.5 | $3,165.00 |
| 100 | $299.27 | $29,927.00 |
| 500 | $286 | $143,000.00 |
| 1,000 | $273.52 | $273,520.00 |
M1AFS600-1FG484K 概述
A Fusion mixed-signal FPGA is a flash-based programmable logic device that integrates configurable analog blocks, large flash memory, clock generation and management circuitry, and high-performance programmable fabric in a single monolithic chip. Within the power-management hierarchy, it spans programmable logic -> FPGA -> mixed-signal SoC, and the M1 prefix specifically denotes Fusion devices equipped with the ARM Cortex-M1 processor for embedded control.
Key features include 110,592 bits of flash-based fabric capacity (as listed by distributors), 172 available I/O, and the on-chip ARM Cortex-M1 for single-chip embedded designs. Flash-based configuration makes the device inherently secure and instant-on, removing the need for an external configuration PROM. The monolithic integration of analog peripherals, clock circuitry (CCC) and logic reduces board count, BOM cost, and design complexity relative to a discrete FPGA-plus-analog solution.
The device is fabricated on 130nm flash-based CMOS technology and operates from a 1.5V core supply. Fabric speed grades (-1 in this part) determine maximum fabric performance; the M1AFS600 series is specified up to the hundreds of MHz range in system applications. The FG484 ball-grid package provides high I/O density and good signal integrity for wide buses and memory interfaces.
Typical applications include industrial automation and motor control, secure embedded systems leveraging the Cortex-M1, space-constrained mixed-signal instrumentation, and power monitoring where Fusion's configurable analog blocks replace external ADCs and comparators.
Design consideration: this K-graded ordering code is listed by distributors as containing lead and RoHS non-compliant, so it is suitable for designs exempt from RoHS or for repair/legacy programs; choose the FGG484 (green) variant for RoHS-compliant new designs.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： M1AFS600-1FG484K ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M1AFS600-1FG484K （相同外形与封装尺寸） ——差异在于 Package, System Gates, Family, Processor Core, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
M1AFS600-1FGG484K
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →M1AFS600-1FG484I
✅ 直接替换✓ 有现货
$425 / 个
查看数据手册 →M1AFS600-FG484K
✅ 直接替换✓ 有现货
$108.5 / 个
查看数据手册 →M1AFS600-2FG484
✅ 直接替换✓ 有现货
$141.9 / 个
查看数据手册 →M1AFS600-2FGG484
✅ 直接替换✓ 有现货
$175 / 个
查看数据手册 →AFS600-1FG484K
✅ 直接替换📋 参考替代料（不在目录中）
M1AFS600-1FG484K 最大额定值与电气特性
| Logic Technology | Flash-based FPGA (Fusion), 130 nm CMOS |
| System Gates | 600 K |
| Fabric Capacity (bits, distributor listed) | 110592 |
| User I/O | 172 |
| Processor Core | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| 封装 | 484-Ball FBGA (FG484) |
| 安装类型 | Surface Mount |
| Configuration | Flash-based, instant-on (no external configuration device) |
| Integrated Analog | Configurable analog blocks (Fusion mixed-signal architecture) |
| Clock Management | Integrated clock generation and management (CCC) |
| Embedded Memory | Large flash memory blocks |
| RoHS 状态 | RoHS Non-Compliant (contains lead, per distributor listing) |
| Lead-Free Status | Contains Lead |
M1AFS600-1FG484K 484-ball fbga (fg484) 引脚配置指南
M1AFS600-1FG484K（484-ball fbga (fg484) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M1AFS600-1FG484K.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M1AFS600-1FG484K 适用于 6 应用s: Industrial Automation and Motor Control, Secure Embedded Systems, Mixed-Signal Instrumentation, Power Monitoring and Sequencing, Legacy System Repair and Sustainment, Communications and Interface Bridging.
Industrial Automation and Motor Control
The M1AFS600-1FG484K fits industrial motor control because its 600K-gate flash fabric generates multi-channel PWM while the integrated ARM Cortex-M1 runs the control loop, eliminating a separate MCU. Fusion's configurable analog blocks support current and voltage sense conditioning on-chip, and integrated clock generation simplifies drive-timing synchronization across the 172 available I/O. Instant-on flash configuration means the drive is active within milliseconds of power application - important for safety interlocks. Placed as the main controller, it replaces FPGA-plus-MCU-plus-PGA discrete chains, cutting BOM count; the trade-off is that the -1 speed grade bounds maximum fabric clock rate, which should be verified against your PWM resolution targets in Libero timing analysis.
推荐
Secure Embedded Systems
Flash-based Fusion FPGAs are inherently suited to secure embedded designs: configuration data lives in nonvolatile on-chip flash, so there is no bitstream to intercept at power-up, unlike SRAM FPGAs that load from external PROMs. The M1AFS600-1FG484K adds an ARM Cortex-M1 processor, letting security-critical firmware and programmable logic coexist in one 484-ball FBGA with 172 I/O. Monolithic integration reduces the physical attack surface and board routing of secrets. Use it for secure industrial controllers and equipment authentication where IP protection matters. Note that this K variant is leaded; for products shipping under RoHS, substitute the pin-identical M1AFS600-1FGG484K green variant without any layout or firmware changes.
推荐
Mixed-Signal Instrumentation
Bench and embedded instrumentation benefit directly from Fusion's monolithic integration of configurable analog, large flash memory blocks, and clock management alongside 600K gates of programmable logic. The M1AFS600-1FG484K implements acquisition sequencers, trigger logic, and interface bridges in fabric while the Cortex-M1 handles protocol and user-facing control, and on-chip analog blocks monitor supply and signal levels without external ADCs for supervisory functions. The 172 I/O support wide parallel data paths to front-end converters, and the FG484 BGA's short ball vias aid signal integrity on high-speed buses. Distributor listings confirm 110592 fabric bits and 1.5V core operation on 130nm flash CMOS, a proven low-power process for portable instruments.
推荐
Power Monitoring and Sequencing
Fusion's original design intent includes power management: the M1AFS600-1FG484K's configurable analog block monitors multiple voltage and temperature channels on-chip, and the fabric implements custom sequencing and brown-out logic with microsecond-scale response - faster than a software-only supervisor. With 600K gates and 172 I/O, one chip can both supervise rails and gate downstream enable signals, while the ARM Cortex-M1 logs events and communicates over UART/I2C/SPI. Flash-based instant-on operation means monitoring begins immediately at power-up, before an external MCU could boot. Design consideration: this FG484K ordering code contains lead, so RoHS-regulated power products should use the identical green M1AFS600-1FGG484K instead.
推荐
Legacy System Repair and Sustainment
Because Microsemi Fusion devices have shipped since the mid-2000s, many defense, aerospace-adjacent, and industrial platforms still depend on them. The M1AFS600-1FG484K, and leaded-compatible alternatives such as AFS600-1FG484K, serve sustainment programs where the original design was qualified against leaded assembly and RoHS exemption applies. Drop-in same-footprint variants (M1AFS600-1FG484I for industrial temperature, M1AFS600-2FG484 for faster fabric) allow repair depots to adapt to available stock without PCB rework. Distributor channels including DigiKey, Mouser, LCSC, and Octopart-listed brokers currently show active inventory (as of 2026-09-02), which is essential for end-of-life-adjacent sourcing; verify date codes on broker stock.
推荐
Communications and Interface Bridging
The M1AFS600-1FG484K works well as a protocol bridge: 172 I/O accommodates parallel legacy buses alongside serial interfaces implemented in fabric (UART, SPI, I2C, and higher-speed links within -1 speed-grade limits), while the ARM Cortex-M1 runs protocol stacks. Integrated clock generation and management circuitry provide the multiple synchronized domains typical of networking line cards and industrial gateways without external PLL chips, reducing jitter sources. Flash fabric retains the bridge configuration across power cycles, enabling fast bring-up in redundant systems. For designs pushing timing closure at -1, the pin-compatible M1AFS600-2FG484 offers faster fabric on the identical 484-ball footprint, making speed-grade upgrades a pure ordering-code change.
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推荐产品汇总
工程参考数据： M1AFS600-1FG484K ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1AFS600-1FGG484K | M1AFS600-1FG484I | M1AFS600-2FG484 | AFS600-1FG484K |
|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FG484) | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 600 K | 600 K | 600 K | 600 K | 600 K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | -1 |
| ARM Cortex-M1 Processor | Yes (M1 prefix) | Yes | Yes | Yes | Not designated (non-M1 Fusion) |
关键差异点
- Integrated ARM Cortex-M1 processor （对比 AFS600-1FG484K)
- Monolithic mixed-signal integration （对比 M1AFS600-2FG484)
- Flash-based instant-on security （对比 SRAM FPGAs (other vendors))
- Pin-identical RoHS upgrade path （对比 M1AFS600-1FGG484K)
设计说明
The FG484K ordering code is listed by distributors as containing lead (RoHS Non-Compliant). If your product ships into RoHS-regulated markets, order M1AFS600-1FGG484K instead - it is the identical die and 484-ball footprint with lead-free balls, so no PCB or firmware change is needed. Mixing leaded and lead-free BGA assemblies also affects reflow profile and long-term solder-joint reliability, so standardize on one metallurgy per build. Confirm compliance requirements at BOM creation, not at contract manufacture.
The 484-ball FBGA requires a controlled land pattern and solder-mask-defined or non-SMD pads per the Fusion family datasheet package section. Fan out with via-in-pad or dog-bone escape on 0.8 mm-class ball pitch, and verify your fabricator's minimum drill capability before routing the 172 user I/O. Because flash-based Fusion needs no external configuration PROM, reserve board area previously allocated for a config flash for decoupling instead. Follow the manufacturer datasheet ball map exactly - power, ground, JTAG, and clock balls are fixed and must not be repurposed.
The Fusion fabric operates from a 1.5 V core supply (per distributor specifications), with separate I/O bank supplies defined in the family datasheet. Estimated: total power depends on toggling rates and I/O loading, so use Microchip's Libero power calculator with your actual design rather than rule-of-thumb numbers, then size regulators with margin. Sequence supplies per the datasheet power-up requirements, and place bulk plus 0.1 uF ceramic decoupling at each supply ball group. Verify the operating temperature range of the K grade against your worst-case ambient before finalizing thermal design.
合规信息
Distributor listings (DigChip, DigiKey) state Contains Lead and RoHS Non-Compliant for the FG484K ordering code. Use M1AFS600-1FGG484K for RoHS-compliant applications. REACH, halogen-free, and conflict-minerals status not stated in provided data.