M1AFS600-2FGG484 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
MPN: M1AFS600-2FGG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $249 | $249.00 |
| 10 | $226 | $2,260.00 |
| 100 | $205 | $20,500.00 |
| 500 | $189 | $94,500.00 |
| 1,000 | $175 | $175,000.00 |
Drop-in alternatives for M1AFS600-2FGG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS600-FGG484I
✅ Drop-In✓ In Stock
$128.4 / Unit
View Datasheet →M1AFS600-FG484K
✅ Drop-In✓ In Stock
$108.5 / Unit
View Datasheet →M1AFS600-1FGG484I
✅ Drop-In✓ In Stock
$430 / Unit
View Datasheet →M1AFS600-FG484
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →M1AFS600-2FG484
✅ Drop-In✓ In Stock
$141.9 / Unit
View Datasheet →M7AFS600-2FGG484
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →M1AFS600-2FGG484 Maximum Ratings & Electrical Characteristics
| Family | Fusion (M1 variant with ARM Cortex-M1) |
| System Gates | 600000 |
| Logic Cells | 13824 |
| User I/O | 172 |
| Embedded Processor | ARM Cortex-M1 hard core |
| Programmable Technology | Flash-based (non-volatile) |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Speed Grade | -2 |
| Package | 484-ball FBGA (FGG484), 23x23x2.44 mm |
| Mounting Type | Surface Mount |
| Analog Features | Configurable analog blocks (mixed-signal FPGA) |
| On-chip Flash Memory | Large flash memory blocks integrated |
| Clock Management | Integrated clock generation and management circuitry |
| RoHS Status | Compliant (per Newark: RoHS Compliant: Yes) |
| Packaging | Tray |
M1AFS600-2FGG484 484-ball fbga (fgg484), 23x23x2.44 mm Pin Configuration Guide
Complete pinout information for M1AFS600-2FGG484 (484-ball fbga (fgg484), 23x23x2.44 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS600-2FGG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS600-2FGG484 is suitable for 6 applications: Embedded Processor Subsystems, Industrial Automation and Control, Mixed-Signal Sensor Aggregation, Secure Single-Chip Systems, Interface Bridging and Glue Logic Consolidation, Portable and Space-Constrained Instruments.
Embedded Processor Subsystems
The ARM Cortex-M1 hard core inside the M1AFS600-2FGG484 lets one 484-FBGA chip replace an MCU-plus-FPGA two-chip solution, cutting BOM cost and board area. The 13,824 logic cells implement custom peripherals (SPI, UART, CAN-style bridges) around the processor while on-chip flash blocks store firmware, removing external NOR flash. Because configuration is flash-based, the system is ready within microseconds of power-up - important in applications with fast-restart requirements. Designers should budget the Cortex-M1 clock from the Fusion on-chip clock generation circuitry and verify timing at the -2 speed grade in Libero SoC.
Recommended
Industrial Automation and Control
In factory automation nodes, the Fusion fabric's deterministic flash-based logic handles I/O scanning, sequencing, and interface bridging while the Cortex-M1 core runs protocol stacks. The 172 user I/Os at 1.5V core operation with bank-selectable I/O standards connect sensors, actuators, and field buses; configurable analog blocks monitor supply voltages and board temperatures without external supervision ICs. Non-volatile configuration means an industrial line restarts instantly after power dips, avoiding SRAM-FPGA reconfiguration delays. Place the device on a 6-layer PCB with separate analog plane to preserve the on-chip analog sensing accuracy specified in the Fusion datasheet.
Recommended
Mixed-Signal Sensor Aggregation
Fusion's monolithic configurable analog plus digital fabric makes this part a single-chip front-end aggregator: analog channels monitor multi-rail voltages, while 600K gates of flash logic timestamp, filter, and packetize readings. Compared with a discrete ADC-plus-FPGA chain, the M1AFS600-2FGG484 removes analog-to-digital interface design and one power domain. The 130nm flash process gives low static power in always-on monitoring roles. A key performance consideration is analog reference decoupling - follow Microchip's Fusion analog application guidance and keep sensing traces short from connector to the FGG484 balls to limit error injection.
Recommended
Secure Single-Chip Systems
Flash-based FPGAs store their bitstream on-chip, eliminating the external configuration readback attack surface of SRAM FPGAs. For equipment where firmware IP protection matters - industrial instruments, network appliances, licensed medical devices - the M1AFS600-2FGG484 provides single-chip logic plus Cortex-M1 execution with no configuration flash to clone. The 484-FBGA package further obscures trace-level reverse engineering relative to fine-pitch QFP alternatives. Designers should enable Fusion's available flash-security features in Libero SoC and control JTAG access at the board level, since the programming port remains the primary access path.
Recommended
Interface Bridging and Glue Logic Consolidation
Legacy boards often carry several ASSPs, buffers, and CPLDs. The M1AFS600-2FGG484 consolidates such glue logic into 600K gates with 172 I/Os, letting one part bridge memory buses, legacy parallel interfaces, and serial links. Because the fabric is flash-based, bridge firmware is fixed at production with no load-time risk, and the -2 speed grade supports moderate-speed parallel bus timing. Migration from smaller Fusion devices (e.g., M1AFS250) is straightforward since the toolchain and design libraries are shared, though the 484-ball footprint change requires a new PCB - plan the footprint when first taping out.
Recommended
Portable and Space-Constrained Instruments
The 23x23x2.44 mm FGG484 package and monolithic integration of analog, flash, clock management, and the Cortex-M1 core suit handheld and benchtop instruments where board area and power matter. Flash-based operation removes configuration power-up draw and external memory, and the 130nm process holds static power low for battery-assisted designs. The 0.5mm-pitch BGA is manufacturable with standard SMT reflow. Thermal design is easy at these densities: estimated power for typical mixed-signal Fusion workloads remains in the sub-watt range, so copper pours under the package usually suffice - verify with Libero power estimation for your utilization.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS600-2FGG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS600-FGG484I | M1AFS600-FG484K | M1AFS600-1FGG484I | M1AFS600-2FG484 | AFS600-2FGG484 |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 23x23x2.44 mm | 484-FBGA (FGG484) - same | 484-FBGA (FG484) - same footprint | 484-FBGA (FGG484) - same | 484-FBGA (FG484) - same footprint | 484-FBGA (FGG484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Microsemi) |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Logic Cells | 13,824 | 13,824 | 13,824 | 13,824 | 13,824 | 13,824 |
| User I/O | 172 | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | -2 | Standard (-1 class) | [DATA_NEEDED] | -1 | -2 | -2 |
| ARM Cortex-M1 Hard Core | Yes | Yes | Yes | Yes | Yes | No |
| Temperature Orientation | [DATA_NEEDED: Operating Temperature] | Industrial (I suffix) | K-grade screening | Industrial (I suffix) | Commercial orientation | [DATA_NEEDED] |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Embedded ARM Cortex-M1 hard processor (vs AFS600-2FGG484)
- Faster -2 speed grade in the same footprint (vs M1AFS600-1FGG484I)
- Non-volatile flash configuration (instant-on) (vs SRAM-based competitor FPGAs)
- Monolithic mixed-signal integration (vs M1AFS600-FGG484I)
Design Notes
The FGG484 is a 23x23 mm, 0.5 mm-pitch, 2.44 mm-tall FBGA. Plan a 6-layer or higher stackup with via-in-pad or dog-bone fanout; 0.5 mm pitch BGA escape is typically feasible with 0.15 mm drill and 0.10-0.12 mm trace/space on outer layers. Dedicate at least one solid plane to the 1.5V core rail and separate I/O bank planes where bank voltages differ. Because the part is flash-based with no configuration flash, no boot-time routing or config-flash footprint is needed - simplifying layer count versus an equivalent SRAM FPGA build.
Power the 1.5V core with a dedicated regulator and observe the Fusion power-up sequencing requirements from the manufacturer datasheet before applying I/O bank voltages. Estimated: static power on 130nm flash Fusion at moderate utilization is typically well under 1 W, but dynamic power scales with toggle rate - run Microchip Libero SoC power estimation with your actual utilization and I/O standards before selecting the regulator. Provide bulk and 0.1 uF decoupling per Fusion power-supply guidance, and measure real current on first prototypes rather than relying on estimates.
Two frequent mistakes with this part: (1) substituting a different speed grade (e.g., M1AFS600-1FGG484I for the -2) without re-running timing closure in Libero SoC - timing that met -2 constraints can fail at -1; (2) assuming AFS600 (non-M1) parts are code-compatible - the AFS600-2FGG484 lacks the Cortex-M1 hard core, so M1 designs need a soft processor. Also confirm the Libero SoC release you use still supports the Fusion family before tool upgrades, and control JTAG access on production boards to preserve the flash configuration security advantage.
Compliance Information
Newark listing states RoHS Compliant: Yes for this part. REACH, halogen, lead-free and conflict-minerals status not stated in reviewed distributor listings as of 2026-09-02; consult Microchip's environmental documentation.
