Micron Technology

M29F160FT55N3E2 - 16Mbit 55ns 5V NOR Flash | Micron | TSOP-48

MPN: M29F160FT55N3E2 ✓ Active
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5 V Vdss 1000 k Rds(on) 48-TSOP I Package NOR Flash Memory
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Drop-in alternatives for M29F160FT55N3E2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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M29F160FT55N3F2

✅ Drop-In
Micron Technology
📦 48-TSOP I
NOR Flash (Parallel, Asynchronous) · 16 Mbit (16777 kbits) · 1M x 16 / 2M x 8 · 1000 k · 16 bits · 55 ns · 5 V (operating 4.5 V) · Parallel

✓ In Stock

$4.9 / Unit

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M29F160FB55N3E2

✅ Drop-In
Micron Technology
📦 48-TSOP I
NOR Flash - Parallel, Asynchronous · 16777 kbits (16 Mbit) · 1 M x 16 / 2 M x 8 · 1000 k · 16 bits · 55 ns · 5 V · Parallel

✓ In Stock

$2.72 / Unit

View Datasheet →

M29F160FB55N3F2

✅ Drop-In
Micron Technology
📦 48-TSOP I
Parallel NOR Flash · 16777 kbits (16 Mbit) · 1 Mword x 16 bits / 2 Mbyte x 8 bits · 1000 k · 16 bits · 55 ns · 5 V · Bottom Boot Block

✓ In Stock

$5.6 / Unit

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M29F160FT55N3E2

✅ Drop-In
Micron Technology
📦 48-TSOP I
NOR Flash · 16 Mbit (1 M x 16 / 2 M x 8) · 16777 kbits · 1000 k · 16 bits · 55 ns · 5 V · Parallel

✓ In Stock

Contact for price

View Datasheet →

MBM29F160TE-55PFTN-E1

✅ Drop-In
📦 48-TSOP I
Spansion/Fujitsu equivalent: same 16 Mbit, 55 ns, 5 V top-boot parallel NOR in 48-TSOP I; command-set details should be verified

📋 Reference alternative (not in catalog)

M29F160FT55N3E2 Maximum Ratings & Electrical Characteristics

Memory Type NOR Flash
Memory Organization 16 Mbit (1 M x 16 / 2 M x 8)
Density 16777 kbits
Number of Words 1000 k
Bits per Word 16 bits
Access Time 55 ns
Supply Voltage 5 V
Interface Parallel
Boot Block Top Boot Block
Operating Temperature -40C to +125C
Temperature Grade Automotive Grade 3
Package 48-TSOP I
Mounting Type Surface Mount
Bus Width 8-bit / 16-bit selectable (BYTE# pin)
Program/Erase Embedded program/erase controller (byte/word algorithms)
Factory Erase State All bits erased to 1
RoHS Status Compliant (E suffix)

M29F160FT55N3E2 48-tsop i Pin Configuration Guide

Complete pinout information for M29F160FT55N3E2 (48-tsop i package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

48-tsop i package pinout diagram for M29F160FT55N3E2

No detailed pinout data available for M29F160FT55N3E2.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for M29F160FT55N3E2 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

M29F160FT55N3E2 is suitable for 6 applications: Automotive ECU Boot Code Storage, Industrial Embedded Controller Firmware, Telecom Line Card Code Memory, Set-Top Box and Consumer BIOS Storage, Test and Measurement Equipment Firmware, Legacy 5V System Maintenance and Repair.

🚗

Automotive ECU Boot Code Storage

The M29F160FT55N3E2 fits automotive ECU boot-code storage because its N3 grade is rated -40 C to +125 C (Automotive Grade 3) and its 55 ns access time allows direct processor fetch from reset vectors without wait states on 5 V buses. In an ECU, the top boot block holds the reset/interrupt vector table and bootloader, protected against accidental erase by the block-protection scheme, while RP# provides instant reset during cranking transients. The embedded program/erase controller enables field firmware updates over CAN or K-Line by writing command sequences on the same 16-bit parallel bus used at runtime. Unlike serial Flash, the parallel interface adds no protocol latency, preserving deterministic boot timing critical for safety-related modules. Designers should budget program/erase endurance for the planned number of OTA or service update cycles per the datasheet block specification.

🏭

Industrial Embedded Controller Firmware

Industrial PLCs, motor drives, and instrumentation frequently retain 5 V parallel buses for maximum noise immunity, and the M29F160FT55N3E2 aligns directly: single 5 V supply, 55 ns random access, and 16 Mbit capacity for application plus bootloader firmware. The parallel XIP (execute-in-place) interface lets a 16-bit microcontroller run code directly from Flash with zero protocol overhead, and the BYTE# pin allows a shared 8-bit bus for parameter storage and a 16-bit bus for code. The embedded program/erase controller performs byte/word programming and block erase autonomously, so the host CPU only issues command sequences and polls status - no firmware-level algorithm timing needed. The -40 C to +125 C range also covers unconditioned factory-floor cabinets. Decouple VCC locally and sequence RP# after VCC stabilizes to prevent temporary boot-block protection states at power-up.

🌐

Telecom Line Card Code Memory

Telecom line cards and network backplane controllers traditionally use 5 V parallel NOR Flash for boot code, and the M29F160FT55N3E2 supplies 16 Mbit at 55 ns with byte or word organization selectable via BYTE#. Its 55 ns access time sustains zero-wait-state reads on legacy telecom ASICs and 5 V microprocessors, while the top boot block isolates the bootloader from frequently updated application images. The embedded program/erase controller permits remote field upgrades across the network: the host writes standard command sequences, polls status bits, and verifies completion without external high voltage. Wide -40 C to +125 C operation covers uncoaled outdoor plant cabinets. Designers should verify bus loading, since heavily multiplexed backplanes can extend effective access time; insert wait states if capacitive load exceeds datasheet test conditions. The 48-TSOP I footprint is also shared with Alliance Memory second sources for supply security.

📺

Set-Top Box and Consumer BIOS Storage

Legacy set-top boxes, DVD players, and consumer platforms built on 5 V buses used 16 Mbit parallel NOR Flash as BIOS/firmware storage, and the M29F160FT55N3E2 matches that role exactly: 1 M x 16 organization, 55 ns access, and a single 5 V rail shared with the rest of the board. The top boot block holds the boot vector protected from erasure, while remaining blocks store application firmware that the embedded program/erase controller updates during manufacturing or service. Execute-in-place operation from the parallel bus removes the need to shadow code into scarce RAM at boot, shortening startup time. The RoHS-compliant E-suffix package satisfies consumer environmental requirements. For new consumer designs, 3 V serial NOR is generally preferred, but this part remains the correct choice when maintaining or extending existing 5 V platforms.

🔧

Test and Measurement Equipment Firmware

Bench instruments and data-acquisition systems benefit from the M29F160FT55N3E2's deterministic 55 ns parallel access for firmware storage and its -40 C to +125 C rating for portable field instruments. The 16-bit organization halves the address-cycle count compared with 8-bit Flash when paired with 16-bit DSPs or microcontrollers, and BYTE# mode lets one device serve both a 16-bit code bus and an 8-bit calibration-data bus. In-system calibration constants can be rewritten in the field using the embedded program/erase controller without removing the device, and the RP# pin gives service technicians a guaranteed hardware reset path during firmware recovery. The top boot block keeps the instrument's monitor code immune from accidental erase during calibration-block updates. Layout should keep the 48-TSOP I address/data traces short and length-matched to preserve the 55 ns timing budget across the bus.

🖥️

Legacy 5V System Maintenance and Repair

A primary ongoing use of the M29F160FT55N3E2 is sustaining engineering for installed 5 V parallel systems: avionics spares, military ground equipment, medical service stock, and industrial retrofits where redesign to 3 V serial Flash is not economically justified. Because Micron and Alliance Memory both offer the identical MPN in 48-TSOP I, repair depots can source pin-compatible replacements without PCB modification, and the Spansion MBM29F160TE-55PFTN-E1 provides a further qualified second source. The embedded program/erase controller supports bench programmers and in-circuit update jigs alike, and factory-erased (all-1) shipping state means devices can be programmed immediately upon receipt. When servicing mixed fleets, note that FT (top boot) and FB (bottom boot) variants are electrically identical but not code-compatible - always match boot block location to the original board design.

What is the M29F160FT55N3E2 memory size and organization?
The M29F160FT55N3E2 is a 16 Mbit parallel NOR Flash memory organized as 1 Mword x 16 bits (or 2 Mbyte x 8 bits when BYTE# selects byte mode). According to the Micron product page and datasheet summaries, it delivers a 55 ns access time from a single 5 V supply, with the top boot block architecture indicated by the T suffix in the part number.
What is the access time of M29F160FT55N3E2?
The access time is 55 ns. According to the Micron datasheet summary on chipdig.com, the 55 in the part number denotes the device speed grade, which supports zero-wait-state reads on many 5 V 16-bit embedded processors. This is the Auto Grade 55 ns speed option in conjunction with the Grade 3 (-40 C to +125 C) temperature rating.
What does the M29F160FT55N3E2 part number mean?
Each field in M29F160FT55N3E2 has a defined meaning. According to the Micron datasheet decoding: M29F160 = 16 Mbit device; T = top boot block (B would be bottom boot); 55 = 55 ns access time; N3 = TSOP package with Automotive Grade 3 rating to +125 C; E = RoHS-compliant package; the trailing 2 denotes packing/temp code per the ordering scheme.
Is M29F160FT55N3E2 suitable for automotive applications?
Yes. The N3E2 grade is rated from -40 C to +125 C, which the Micron datasheet identifies as Auto Grade 3, intended for automotive environments such as ECU boot-code storage. Designers targeting harsh under-hood zones should verify their specific thermal requirements, since some automotive platforms require higher grades; the same M29F family offers the necessary temperature options.
What is the difference between M29F160FT55N3E2 and M29F160FB55N3E2?
The only difference is boot block location: the FT version places the protected boot blocks at the top of the memory array, while the FB version places them at the bottom. Both are 16 Mbit, 55 ns, 5 V, 48-TSOP I, -40 C to +125 C parts with identical pinouts, making them drop-in interchangeable depending on whether your processor reset vector maps to the top or bottom of the address space.
M29F160FT55N3E2 vs MBM29F160TE-55PFTN-E1 - which should I choose?
Both are 16 Mbit, 5 V, 55 ns top-boot parallel NOR Flash in 48-TSOP I. The Micron M29F160FT55N3E2 is the current Micron-branded part (also second-sourced by Alliance Memory), while the MBM29F160TE-55PFTN-E1 is the Spansion/Fujitsu equivalent listed in Findchips comparisons. Choose the Micron part for continued Micron/Alliance supply; the Spansion part serves legacy designs already qualified on the Fujitsu command set. Verify command-set compatibility before switching.
Can M29F160FT55N3E2 replace M29F160FT55N3F2?
Yes, in most designs. The E2 and F2 suffixes denote different temperature/packing grade combinations in the M29F ordering scheme; both share the 16 Mbit density, 55 ns speed, 5 V supply, top boot block, and 48-TSOP I package with identical pinout. Confirm your required operating temperature ceiling and packing format against the datasheet ordering table before substitution, as the grade codes differ.
What is the best drop-in replacement for M29F160FT55N3E2?
The best drop-in replacement is the same MPN manufactured by Alliance Memory, Inc., which lists an identical M29F160FT55N3E2 (16 Mbit, 55 ns, 48-TSOP I) on DigiKey and Mouser as a direct second source. For bottom-boot layouts, the Micron M29F160FB55N3E2 is pin-to-pin compatible with the only difference being boot block placement. Both preserve the same PCB footprint.
Is there a cross-brand equivalent for M29F160FT55N3E2?
Yes. The Spansion (formerly Fujitsu) MBM29F160TE-55PFTN-E1 is the recognized cross-brand equivalent: 16 Mbit parallel NOR Flash, 55 ns, 5 V, top boot block, 48-TSOP I package, as shown in the Findchips part comparison. It is pin-compatible on the same footprint, though engineers should confirm command-set timing details against both datasheets during qualification.
Where to buy M29F160FT55N3E2 online?
The M29F160FT55N3E2 is listed on DigiKey under both Micron Technology and Alliance Memory, Inc. (listed as in stock and shipping same day per the DigiKey listings), and on Mouser under both Micron and Alliance Memory. XAIPART also supports this MPN via quote/order-on-request. Compare quantity pricing across distributors before ordering, as stock levels change daily.
What is the price of M29F160FT55N3E2?
Verified unit pricing for the M29F160FT55N3E2 was not available in the data captured as of 2026-09-05, so this page does not state a price rather than risk an inaccurate figure. Octopart lists the part with pricing from 2 distributors; check DigiKey, Mouser, or Octopart for live quantity pricing, or request a quote from XAIPART for volume orders.
Is M29F160FT55N3E2 in stock and what is the lead time?
According to the DigiKey listings retrieved 2026-09-05, M29F160FT55N3E2 from both Micron Technology and Alliance Memory shows buy-now, ships-today availability, indicating in-stock status at the time of retrieval. Lead times for in-stock distributor inventory are typically a few business days; for volume production orders, request quotes as factory lead times may differ.
Where to download the M29F160FT55N3E2 datasheet PDF?
The official datasheet is available from the Micron product page at micron.com under the M29F160FT55N3E2 part detail, which links downloadable datasheets for the M29F parallel NOR family. Third-party mirrors such as Octopart, Datasheets.com, and DatasheetQ also host the PDF, but always prefer the Micron-hosted document to ensure you have the latest revision.
Where can I find the M29F160FT55N3E2 pinout?
The complete 48-pin TSOP I pinout (address lines A0-A19, data lines DQ0-DQ15, CE#, OE#, WE#, RP#, BYTE#, and power pins) is defined in the Micron M29F family datasheet downloadable from the Micron product page for this MPN. Because pin numbering must match the datasheet exactly, this page defers to the manufacturer document rather than reproducing it from an unverified source.
What are the key specifications of M29F160FT55N3E2 that engineers should know?
Key specifications: 16 Mbit (1 M x 16 / 2 M x 8) parallel NOR Flash; 55 ns access time; single 5 V supply with embedded program/erase controller; top boot block architecture; 48-TSOP I surface-mount package; -40 C to +125 C automotive-grade operating range; RoHS-compliant (E suffix); RP# reset/block temporary unprotect; BYTE# 8/16-bit bus selection; factory-shipped erased to 1. These figures come from the Micron datasheet and verified distributor listings.
Does M29F160FT55N3E2 require a 12 V programming voltage?
No. The M29F family operates from a single 5 V supply for both read and program/erase operations. According to the Micron datasheet summary, an embedded program/erase controller executes byte/word programming and block-erase algorithms internally, eliminating the separate 12 V VPP supply required by older generation Flash devices and simplifying in-system programming designs.

Engineering reference data for M29F160FT55N3E2 — comparison, design guidance, and compliance information.

Selection Guide

Choose the M29F160FT55N3E2 when you need a 16 Mbit, 5 V, 55 ns parallel NOR Flash with top boot blocks and automotive -40 C to +125 C operation - typically ECU boot code, 5 V industrial controllers, telecom line cards, or legacy-platform maintenance. Choose M29F160FB55N3E2 only if your processor's reset vector is at the bottom of the address space; it is otherwise identical and pin-compatible. Choose M29F160FT55N3F2 if your temperature/packing requirement matches the F2 grade code rather than E2. Source from Alliance Memory (same MPN) when Micron-branded stock is constrained - the parts share the same datasheet specification. Consider the Spansion MBM29F160TE-55PFTN-E1 only for designs already qualified on the Fujitsu/Spansion command set. For new 3 V designs, step to the M29W or SPI NOR families instead; the 5 V parallel interface is the reason to select this part, not a limitation to design around.

Comparison with Alternatives

Parameter This Product M29F160FT55N3F2 M29F160FB55N3E2 M29F160FT55N3E2 (Alliance Memory) MBM29F160TE-55PFTN-E1
Package 48-TSOP I 48-TSOP I - same 48-TSOP I - same 48-TSOP I - same 48-TSOP I - same
Brand Micron Technology Micron Technology Micron Technology Alliance Memory Spansion
Density 16 Mbit 16 Mbit 16 Mbit 16 Mbit 16 Mbit
Access Time 55 ns 55 ns 55 ns 55 ns 55 ns
Supply Voltage 5 V 5 V 5 V 5 V 5 V
Boot Block Location Top boot Top boot Bottom boot Top boot Top boot
Operating Temperature -40C to +125C (Auto Grade 3) Grade code F2 (per ordering table) -40C to +125C (Auto Grade 3) -40C to +125C [DATA_NEEDED]
Bus Organization 1 M x 16 / 2 M x 8 (BYTE# selectable) 1 M x 16 / 2 M x 8 1 M x 16 / 2 M x 8 1 M x 16 x16 / x8
RoHS Compliance Compliant (E suffix) [DATA_NEEDED] Compliant (E suffix) [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Top boot block architecture for high reset vectors (vs M29F160FB55N3E2)
  • Dual-second-source availability (vs MBM29F160TE-55PFTN-E1)
  • Automotive Grade 3 temperature rating (vs M29F160FT55N3F2)

Design Notes

Decouple VCC with 0.1 uF ceramic capacitors placed within a few millimeters of the 48-TSOP I supply pins, supplemented by a bulk 10 uF capacitor per device. Program and erase operations draw transient currents on the 5 V rail; inadequate decoupling causes VCC droop that can corrupt programming or reset the internal state machine. Keep the address and data bus traces as short and matched as practical, since the 55 ns access time budget leaves little margin for excessive trace loading or stub reflections on heavily multiplexed buses.

Manage the RP# (Reset/Block Temporary Unprotect) pin carefully at power-up. RP# must be held low until VCC is stable, then driven high, to guarantee a clean boot state; pulling RP# high too early can leave the boot block in a temporary protection state or the device in reset. Confirm the drive source can meet the datasheet RP# rise-time requirement, and avoid leaving RP# floating - tie it to a controlled supervisor output rather than directly to VCC in noisy environments.

Match boot block location to the processor reset vector: FT (top boot) and FB (bottom boot) variants are pin-identical but store the vector table at opposite ends of the array, so swapping them silently breaks boot. Also verify the command-set sequence in your programmer against the specific datasheet revision when mixing Micron/Alliance and Spansion sources, and confirm the E2 versus F2 grade code against your required temperature ceiling before purchasing. Devices ship erased to all 1s, so blank-check is expected to pass on receipt.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Unknown
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance indicated by the E suffix in the part number per the Micron ordering information. Automotive Grade 3 temperature rating (-40 C to +125 C) is stated in the datasheet ordering decode; formal AEC-Q100 qualification status was not found in the provided data.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Micron Technology Alliance Memory M29F160FT55N3E2 M29F160FB55N3E2 MBM29F160TE-55PFTN-E1 NOR Flash parallel NOR Flash memory Flash memory non-volatile memory 48-TSOP I TSOP package surface mount RoHS Automotive Grade 3 top boot block execute-in-place embedded program/erase controller access time RP# reset pin BYTE# bus width selection automotive ECU telecom line card
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