M58BW32FB5T3F - 32Mbit 3.3V NOR Flash, 55ns | Micron
MPN: M58BW32FB5T3F ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.25 | $82.50 |
| 100 | $7.4 | $740.00 |
| 500 | $6.75 | $3,375.00 |
| 1,000 | $6.2 | $6,200.00 |
Drop-in alternatives for M58BW32FB5T3F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M58BW16FB5T3F
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
M58BW32FB5T3F Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash |
| Interface | Parallel |
| Memory Size | 32 Mbit |
| Organization | 1M x 32 |
| Supply Voltage | 3.3 V |
| Access Time | 55 ns |
| Package | 80-PQFP (14x20 mm) |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 (automotive) |
| Packaging | Tape & Reel (TR) |
| Read Mode | Asynchronous and burst read |
| Architecture | Boot block |
| Family | M58BW32F 16Mb/32Mb 3.3V parallel NOR Flash |
M58BW32FB5T3F 80-pqfp (14x20 mm) Pin Configuration Guide
Complete pinout information for M58BW32FB5T3F (80-pqfp (14x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M58BW32FB5T3F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M58BW32FB5T3F is suitable for 6 applications: Automotive Telematics & Infotainment Boot Storage, Industrial PLC and Control Module Firmware, Networking Equipment Configuration Storage, Powertrain and Body Control Modules, Test and Measurement Instrumentation, Legacy System Continuation and Repair.
Automotive Telematics & Infotainment Boot Storage
The M58BW32FB5T3F fits automotive telematics and infotainment modules because it is AEC-Q100 qualified, operates from the ubiquitous 3.3V rail, and provides 32Mbit (1M x 32) of nonvolatile storage for boot code, application firmware, and calibration tables. Its 55 ns access time and burst-read mode let the head-unit processor fetch code directly from flash (XIP) without lengthy wait states or a shadow-RAM copy, shortening cold-start time. The boot-block architecture protects reset and exception vectors so that a failed firmware update cannot brick the unit. Designers should place the device on a short, controlled-impedance bus near the host CPU and implement dual-bank update schemes within the 32Mbit array to guarantee recovery paths.
Recommended
Industrial PLC and Control Module Firmware
Industrial programmable-logic and motor-control modules need firmware that survives power loss and hostile electrical environments, which is exactly the role of the M58BW32FB5T3F. The 3.3V single supply integrates cleanly with typical industrial 3.3V logic domains, and the 55 ns parallel access time allows deterministic code fetch without cache-miss penalties in safety-relevant control loops. The 1M x 32 organization matches 32-bit industrial MCUs and DSPs without bus-width conversion logic. Engineers typically reserve the small boot blocks for the bootloader and the larger uniform blocks for application images and parameter logs; the block-protection feature guards calibration data against accidental erase during field firmware updates.
Recommended
Networking Equipment Configuration Storage
Routers, switches, and industrial Ethernet gateways store bootloader, OS image, and configuration files in parallel NOR Flash, and the M58BW32FB5T3F provides 32Mbit of such storage on a 32-bit bus. The burst interface supports clocked reads for network processors that fetch code at speed, while the asynchronous mode serves simpler management controllers. With a 55 ns access time, even asynchronous code execution avoids inserted wait states on many embedded CPUs. Network designs benefit from the boot-block layout: the protected bottom blocks hold the recovery bootloader used after a failed image upgrade, improving field serviceability. Decoupling of at least 0.1 uF per power pin is recommended given the burst clock switching activity.
Recommended
Powertrain and Body Control Modules
Under-hood electronic control units demand AEC-Q100 qualified memory, and the M58BW32FB5T3F addresses this with its automotive ordering suffix and 32Mbit capacity for ECU firmware plus calibration datasets. The 3.3V operation matches modern MCU I/O rails, and the 55 ns access time supports code execution directly from flash at ignition start without a RAM shadowing phase, reducing start-up latency in powertrain applications. The boot-block protection scheme ensures the bootloader used for in-field reprogramming (flashing via K-line/CAN) is never corrupted. Designers must respect the datasheet erase/program endurance limits when scheduling calibration writes and verify the specific temperature grade for the mounting location.
Recommended
Test and Measurement Instrumentation
Bench instruments and data-acquisition systems use parallel NOR Flash to hold FPGA configuration images, calibration constants, and instrument firmware, and the M58BW32FB5T3F serves this role with a 1M x 32-bit array on a single 3.3V supply. The 55 ns access time and burst-read capability suit both slow maintenance reads by a management MCU and fast boot fetches by the instrument's main processor. The boot-block architecture separates the immutable bootloader from frequently updated application firmware, so firmware field updates never endanger the recovery path. The 80-pin PQFP (14x20 mm) surface-mount package provides robust mechanical attachment for bench equipment subject to vibration during transport.
Recommended
Legacy System Continuation and Repair
Many long-lifecycle systems - avionics test sets, medical diagnostics, and legacy automotive ECUs - were designed around the M58BW32F burst NOR family and still require identical devices for repair and small-volume production. The M58BW32FB5T3F continues to serve this continuation market because it preserves the original 80-pin PQFP footprint, the 1M x 32 organization, and the family command set, allowing a direct replacement on existing PCBs with no redesign. Maintenance engineers should verify board revision compatibility with the 3F ordering suffix (temperature grade), and confirm that firmware using burst mode matches the speed grade implied by the 55 ns access time before substitution.
Recommended
Recommended Products Summary
Engineering reference data for M58BW32FB5T3F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M58BW16FB5T3F | M58BW16FB4ZA3F |
|---|---|---|---|
| Package | 80-PQFP (14x20 mm) | 80-PQFP (14x20 mm) - same family | [DATA_NEEDED] |
| Brand | Micron Technology | Micron Technology | Micron Technology |
| Density | 32 Mbit | 16 Mbit | 16 Mbit |
| Organization | 1M x 32 | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Access Time | 55 ns | [DATA_NEEDED] | [DATA_NEEDED] |
| Automotive Grade (AEC-Q100) | Yes | Yes (3F automotive suffix) | Yes (3F automotive suffix) |
| Burst Read Support | Yes | Yes (same family) | Yes (same family) |
Key Differentiators
- Double the firmware capacity versus 16Mbit family members (vs M58BW16FB5T3F)
- Automotive AEC-Q100 qualification with burst read (vs M58BW16FB4ZA3F)
- 55 ns access time supports wait-state-free XIP (vs M58BW16FB5T3F)
Design Notes
The 80-pin PQFP (14x20 mm) package has fine pitch leads; use a 0.5 mm-pitch-compatible land pattern per the manufacturer datasheet and inspect solder joints with X-ray or AOI given the gull-wing leads. Route the 32-bit data bus with matched lengths where the burst interface is clocked at high frequency, and place 0.1 uF decoupling capacitors at each VCC pin within 2 mm of the package. Avoid routing high-speed burst clock traces parallel to data lines for more than a few centimeters to limit crosstalk.
Boot-block NOR devices are frequently damaged in firmware-update schemes when erase operations overlap the protected bootloader sectors. Implement software interlocks so that application update code can never issue an erase command targeting the boot blocks, and verify the block-protection fuses at production. Also ensure burst configuration pins are set to a valid state at power-up; leaving them floating can cause undefined read behavior during the initial code fetch.
The device operates from a single 3.3 V rail, but program and erase operations draw higher transient currents than reads. Size the local power decoupling (at least 10 uF bulk plus 0.1 uF ceramic per supply pin) so that rail droop during block erase does not disturb neighboring 3.3 V logic on the same regulator. Estimated: with typical erase currents of tens of milliamps per datasheet figures, a 10 uF local reservoir limits droop to well under 100 mV for the erase duration.
Compliance Information
AEC-Q100 automotive qualification stated in distributor specifications (datasheets.com, updated 19-APR-2024). RoHS/REACH/lead-free status not explicitly stated in verified web data; confirm via official Micron product page.
