M29F400FB55N3F2 - 4Mbit 55ns NOR Flash 48-TSOP | Micron
MPN: M29F400FB55N3F2 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.8 | $4.80 |
| 10 | $4.32 | $43.20 |
| 100 | $3.85 | $385.00 |
| 500 | $3.48 | $1,740.00 |
| 1,000 | $3.15 | $3,150.00 |
| 1,500 | $2.95 | $4,425.00 |
Drop-in alternatives for M29F400FB55N3F2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
M29F400FB55N3E2
β Drop-Inπ Reference alternative (not in catalog)
M29F400FB5AN6F2
β Drop-Inπ Reference alternative (not in catalog)
M29F400FB5AN6E2
β Drop-Inπ Reference alternative (not in catalog)
M29F200FB55N3F2
β Drop-Inβ In Stock
$4.2 / Unit
View Datasheet βM29F200FT55N3F2
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View Datasheet βM29F400FB55N3F2 Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash |
| Density | 4 Mbit (4194 kbit) |
| Organization | 256K x 16 / 512K x 8 |
| Access Time | 55 ns |
| Supply Voltage | 5 V |
| Interface | Parallel |
| Boot Block | Bottom boot block |
| Operating Temperature | -40C to +125C |
| Program/Erase Controller | Embedded byte/word program algorithms |
| Package | 48-TSOP I |
| Mounting Type | Surface Mount |
| Standard Package Quantity | 1500 units (Tape & Reel) |
| RoHS Status | Compliant (lead-free build per F2 suffix) |
M29F400FB55N3F2 1500 units (tape & reel) Pin Configuration Guide
Complete pinout information for M29F400FB55N3F2 (1500 units (tape & reel) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M29F400FB55N3F2.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M29F400FB55N3F2 is suitable for 6 applications: Industrial Controller Boot Firmware, Telecom Line Card Code Storage, Set-Top Box and Consumer Electronics Boot ROM, Automotive-Adjacent Diagnostics and Test Equipment, Embedded Networking Equipment (Routers/Switches), Legacy 5 V System Maintenance and Repair.
Industrial Controller Boot Firmware
The M29F400FB55N3F2 stores boot code and firmware in industrial PLCs, motor drives, and factory automation controllers. Its 55 ns access time permits execute-in-place (XIP) operation directly from Flash on 5 V microprocessor buses without shadowing code into RAM, reducing startup latency and RAM requirements. The -40C to +125C operating range covers uncooled control cabinets and outdoor installations. The bottom boot block places small sectors at the bottom of the array where reset vectors live, so a bootloader update does not require erasing the full 4 Mbit array - a typical block erase takes seconds, versus full-array erase. The embedded program/erase controller manages programming autonomously, so the host MCU simply issues commands and polls ready/busy.
Recommended
Telecom Line Card Code Storage
Legacy telecom and network line cards commonly run 5 V I/O logic, making the M29F400FB55N3F2's single 5 V supply and 55 ns parallel bus a natural match for boot and firmware storage. The 256K x 16 organization provides 16-bit words matching the data path of classic network processors and DSPs, while BYTE mode offers 8-bit compatibility for mixed designs. The extended -40C to +125C rating meets central-office and outdoor-plant temperature requirements. Designers typically connect the ready/busy output to an interrupt or poll it after command writes; per the datasheet, the embedded algorithm removes the need for software-programmed programming loops, shortening firmware-update downtime during field upgrades.
Recommended
Set-Top Box and Consumer Electronics Boot ROM
In set-top boxes, DVD players, and other consumer AV hardware built on 5 V-era silicon, the M29F400FB55N3F2 provides 4 Mbit of boot and OS-loader storage with bottom boot blocks aligned to the reset vector map. The 55 ns access time supports direct execution during early boot before the main code is copied to DRAM, and the embedded program/erase controller enables in-field firmware updates over the network. The 48-TSOP I package fits standard surface-mount assembly, and the RoHS-compliant F2 build satisfies consumer environmental regulations. For cost-sensitive revisions where the code image fits 2 Mbit, the pin-compatible M29F200FB55N3F2 offers a direct density-down path on the same PCB footprint.
Recommended
Automotive-Adjacent Diagnostics and Test Equipment
Bench and portable test instruments - diagnostic scanners, dataloggers, and calibration tools - benefit from the M29F400FB55N3F2's combination of non-volatile code storage and fast random access. The 55 ns access time keeps instrument firmware responsive without wait states on 5 V embedded CPU buses, while the -40C to +125C temperature rating survives vehicle-bay and field conditions. Parameter tables and calibration constants can reside in the uniform main blocks while the boot code occupies the small bottom sectors, isolating update domains. The BYTE pin lets the same design serve 8-bit legacy buses, and the hardware reset/power-down input (RP) protects data integrity during brown-out events when combined with a supervisor.
Recommended
Embedded Networking Equipment (Routers/Switches)
Compact routers, managed switches, and industrial Ethernet gear frequently store their bootloader and firmware image in parallel NOR Flash for dependable, addressable boot execution. The M29F400FB55N3F2's 4 Mbit array holds a U-Boot-class loader plus a compressed OS kernel for these platforms, and its 5 V, 55 ns parallel interface matches the many embedded CPUs still designed around 5 V memory buses. The embedded program/erase controller allows the running system to rewrite firmware safely using command-set writes and ready/busy polling, supporting dual-image update schemes within the uniform main blocks. RoHS-compliant lead-free construction keeps the part acceptable for equipment sold under current environmental directives.
Recommended
Legacy 5 V System Maintenance and Repair
Maintenance of installed-base equipment - older medical devices, avionics test rigs, and 1990s-era industrial machines - often requires exact-form-factor 5 V NOR Flash replacement. The M29F400FB55N3F2, supplied through Alliance Memory as a continuation of the Micron M29F400F family, refreshes the supply of this end-of-era part with RoHS-compliant lead-free construction while preserving the 55 ns speed, 4 Mbit density, and bottom boot block layout of the original design. Engineers replacing failed devices can program the part in a socket programmer using the standard command set, then solder it onto the existing PCB with no redesign. Drop-in family alternatives M29F400FB55N3E2 and the 5AN6 generation keep second sources available.
Recommended
Recommended Products Summary
Engineering reference data for M29F400FB55N3F2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M29F400FB55N3E2 | M29F400FB5AN6F2 | M29F400FB5AN6E2 | M29F200FB55N3F2 | M29F200FT55N3F2 |
|---|---|---|---|---|---|---|
| Package | 48-TSOP I | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same |
| Brand | Micron Technology (Alliance Memory, Inc. supply) | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 4 Mbit | 4 Mbit | 4 Mbit | 4 Mbit | 2 Mbit | 2 Mbit |
| Access Time | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Boot Block Position | Bottom | Bottom | Bottom | Bottom | Bottom | Top |
| Operating Temperature | -40C to +125C | -40C to +125C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Drop-in Replacement Status | Reference part | Complete replace (FindIC) | Same-family equivalent | Same-family equivalent | Density-down only (2 Mbit) | Density-down + top boot |
Key Differentiators
- Full 4 Mbit density on the legacy 48-TSOP footprint (vs M29F200FB55N3F2)
- Bottom boot blocks match low-address reset vectors (vs M29F200FT55N3F2)
- Active production continuation of a legacy family (vs M29F400FB55N3E2)
Design Notes
Verify boot block orientation before release. The 'FB' suffix means bottom boot blocks; an FT (top boot) part is pin-identical but places small sectors at the opposite end of the address map. Firmware that erases blocks by index will corrupt a bootloader if the block allocation table of the wrong variant is used. Likewise, confirm that upper address lines are not asserted if substituting the 2 Mbit M29F200 parts on the same footprint.
Decouple VCC with at least 0.1 uF ceramic plus a bulk 10 uF capacitor close to the package, and keep the parallel address/data bus stubs short to preserve the 55 ns access timing margin. Consult the manufacturer datasheet for the exact program/erase supply requirements and the RP (reset/power-down) pin handling; tying RP high is required for normal operation, and a supervisor IC driving RP low during brown-out prevents spurious writes.
Estimated: program and erase operations draw peak currents above the read-mode level, so size the 5 V rail for worst-case erase current rather than standby current; exact figures should be taken from the manufacturer datasheet (not reproduced in this page's verified data). During in-field firmware updates, avoid erasing the block containing the executing bootloader - schedule updates via a resident update routine in the small bottom boot sectors.
Compliance Information
F2 suffix denotes the lead-free, RoHS-compliant build per family naming convention. REACH, halogen-free, and conflict-minerals declarations should be requested from Micron/Alliance Memory compliance documentation.
