Micron Technology

M29F160FB55N3E2 - 16Mbit 55ns 5V NOR Flash | Micron

MPN: M29F160FB55N3E2 βœ“ Active
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5 V Vdss 1000 k Rds(on) 48-TSOP I Package NOR Flash - Parallel, Asynchronous Memory
From $2.72 USD / Unit
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Price updated: 2026-09-04
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Qty Unit Price Extended
1 $3.64 $3.64
10 $3.42 $34.20
100 $3.18 $318.00
500 $2.95 $1,475.00
1,000 $2.72 $2,720.00
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Drop-in alternatives for M29F160FB55N3E2 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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M29F160FB55N3F2

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Micron Technology
πŸ“¦ 48-TSOP I
Parallel NOR Flash Β· 16777 kbits (16 Mbit) Β· 1 Mword x 16 bits / 2 Mbyte x 8 bits Β· 1000 k Β· 16 bits Β· 55 ns Β· 5 V Β· Bottom Boot Block

βœ“ In Stock

$5.6 / Unit

View Datasheet β†’

M29F160FB5AN6F2

βœ… Drop-In
πŸ“¦ 48-TSOP I
Same 16 Mbit, 5 V, asynchronous parallel NOR in PDSO48/TSOP-48 per Xecor comparison; newer generation orderable code, same footprint and boot-block position

πŸ“‹ Reference alternative (not in catalog)

M29F160FB5AN6E2

βœ… Drop-In
πŸ“¦ 48-TSOP I
Same as M29F160FB5AN6F2 but E2 package compliance code; pin-to-pin compatible with M29F160FB55N3E2 per FindIC comparison

πŸ“‹ Reference alternative (not in catalog)

M29F160FT5AN6E2

βœ… Drop-In
πŸ“¦ 48-TSOP I
Top boot block (FT) instead of bottom boot block (FB); otherwise identical 16 Mbit, 5 V, 55 ns, 48-TSOP I - boot sector at top of address map

πŸ“‹ Reference alternative (not in catalog)

M29F160FT55N3F2

βœ… Drop-In
Micron Technology
πŸ“¦ 48-TSOP I
NOR Flash (Parallel, Asynchronous) Β· 16 Mbit (16777 kbits) Β· 1M x 16 / 2M x 8 Β· 1000 k Β· 16 bits Β· 55 ns Β· 5 V (operating 4.5 V) Β· Parallel

βœ“ In Stock

$4.9 / Unit

View Datasheet β†’

M29F160FB55N3E2 Maximum Ratings & Electrical Characteristics

Memory Type NOR Flash - Parallel, Asynchronous
Density 16777 kbits (16 Mbit)
Organization 1 M x 16 / 2 M x 8
Number of Words 1000 k
Bits per Word 16 bits
Access Time 55 ns
Supply Voltage (VCC) 5 V
Interface Parallel
Boot Block Bottom Boot Block (FB)
Programming Algorithm Embedded byte/word program and erase controller
Operating Temperature -40 C to +125 C
Package 48-TSOP I
Mounting Type Surface Mount
Packaging Tray
RoHS Status ROHS3 Compliant
Lead Free Status Lead Free

M29F160FB55N3E2 48-tsop i Pin Configuration Guide

Complete pinout information for M29F160FB55N3E2 (48-tsop i package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

48-tsop i package pinout diagram for M29F160FB55N3E2

No detailed pinout data available for M29F160FB55N3E2.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for M29F160FB55N3E2 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

M29F160FB55N3E2 is suitable for 6 applications: Industrial PLC Firmware Storage, Telecom and Networking Line Cards, Automotive Body and Comfort Modules, Legacy 5V Microprocessor Systems, Set-Top Box and Consumer Electronics Boot ROM, Test and Measurement Instrument Code Storage.

🏭

Industrial PLC Firmware Storage

Programmable logic controllers and industrial control modules store boot code and application firmware in parallel NOR Flash because code must be executed in place with deterministic random access. The M29F160FB55N3E2 fits this role with its 55 ns access time, which permits zero-wait-state instruction fetch from legacy 16-bit industrial processors, and its single 5 V supply, which matches the 5 V bus architecture common on legacy PLC backplanes. The -40 C to +125 C operating range covers unconditioned factory-floor cabinets and outdoor panels, while the bottom boot block lets the critical boot sector be hardware-protected against accidental erase during field firmware updates. The embedded program/erase controller simplifies in-field firmware update routines since the host CPU only issues bus commands and polls status, without managing erase timings externally.

🌐

Telecom and Networking Line Cards

Telecom line cards, DSL modems, and network processors historically boot from 5 V parallel NOR Flash mounted close to the CPU. The M29F160FB55N3E2 provides 16 Mbit of boot and configuration code storage with a 55 ns access time suitable for direct processor local-bus connection. Its asynchronous interface needs no clock, eliminating timing-domain complexity, and the 48-TSOP I package reflows onto standard line-card PCBs. The embedded program/erase controller enables remote firmware upgrades over the network: the host writes new images to non-boot blocks and swaps pointers after verification. The 125 C rating supports enclosed outdoor telecom cabinets with high ambient temperatures, and the ROHS3-compliant E2 finish keeps designs compliant for European telecom deployments.

πŸš—

Automotive Body and Comfort Modules

Body control modules, instrument clusters, and comfort ECUs operating up to 125 C ambient can use the M29F160FB55N3E2 to store calibration tables, boot code, and diagnostic logs. The -40 C to +125 C operating range matches the automotive passenger-compartment and near-engine temperature envelope. The 5 V supply interfaces directly with classic 5 V automotive microcontrollers without level shifting, and the bottom boot block protects the bootloader sector from corruption during reprogramming at the assembly plant or service center. The 55 ns access time supports code execution in place from the ECU's 16-bit bus. Note that formal automotive programs should confirm AEC-Q100 qualification status with Micron for the exact orderable code before design win.

πŸ”§

Legacy 5V Microprocessor Systems

Embedded systems built around 5 V 16-bit microprocessors (80186-class, 68k-family, and similar) require code storage that connects directly to the 5 V parallel bus without transceivers. The M29F160FB55N3E2 drops onto such buses natively: its 5 V VCC and I/O thresholds align with the processor, the BYTE# pin selects x8 or x16 bus width to match the CPU data path, and the 55 ns access time supports fast bus timing. Compared with UV-erasable EPROMs it replaces, the device offers in-system electrical erasure and programming, cutting update time from minutes of UV exposure to seconds of bus writes. Designers should map wait states to the 55 ns access specification and add bus hold resistors on high-impedance data lines during program/erase operations.

πŸ“Ί

Set-Top Box and Consumer Electronics Boot ROM

Set-top boxes, DVD players, and consumer appliances of the 5 V generation boot their system firmware from parallel NOR Flash. The M29F160FB55N3E2 stores the bootloader and core firmware with 55 ns random access for fast power-on initialization, while bulk application data can live in cheaper storage tiers. The bottom boot block isolates the immutable boot sector, improving field-update reliability; application blocks are erased individually during OTA or serial-port upgrades. Tray packaging suits medium-volume contract manufacturing, and the ROHS3-compliant lead-free finish meets global consumer product regulations. The 125 C rating also provides margin inside sealed consumer enclosures where internal ambient can rise well above room temperature during sustained video decoding.

πŸ–₯️

Test and Measurement Instrument Code Storage

Bench instruments such as oscilloscopes, data loggers, and power supplies store firmware, calibration constants, and factory settings in NOR Flash. The M29F160FB55N3E2 is suited to the boot-code role: 16 Mbit capacity holds a full firmware image, 55 ns access supports quick boot and menu response, and the -40 C to +125 C range covers instruments used in unheated field enclosures as well as benches. The byte/word bus-width selection (BYTE#) lets one design span 8-bit and 16-bit controller platforms, and the hardware boot-block protection preserves the recovery bootloader if a firmware update is interrupted. In-system programming over the instrument's service port allows calibration updates without removing the device from the PCB.

What is the access time and supply voltage of the M29F160FB55N3E2?
The M29F160FB55N3E2 has a 55 ns access time and operates from a single 5 V supply (VCC). According to Micron product data for the M29F160 series, the device is an asynchronous parallel NOR Flash organized as 1 M x 16 or 2 M x 8, with an embedded program/erase controller handling byte/word programming. The 55 ns access time supports fast code fetch, and the 5 V rail makes it a direct fit for legacy industrial and telecom designs without dual-rail power.
What is the M29F160FB55N3E2 price and where can I buy it?
The M29F160FB55N3E2 is priced from approximately $3.64 per unit (as of 2026-09-05, LCSC list price) and is stocked at DigiKey, Mouser, and LCSC. DigiKey lists the part as in stock and shipping same day. XAIPART offers tiered pricing: about $3.64 at qty 1 stepping down to roughly $2.72 at qty 1000. Because 5 V parallel NOR is a mature product, secondary distributors such as Octopart-listed brokers also carry stock, so price comparison across 8 distributors is recommended before large purchases.
Is the M29F160FB55N3E2 in stock and what is the lead time?
Yes, the M29F160FB55N3E2 is in stock at major authorized distributors: DigiKey states 'Buy now, ships today' and LCSC lists it as in-stock. Typical lead time for in-stock quantity is 1-3 business days for standard shipping. For volume orders beyond distributor stock, factory lead times for mature 5 V NOR Flash are generally moderate, but you should request a quote for quantities above about 5000 units since allocation can vary on mature memory products.
What is the difference between M29F160FB55N3E2 and M29F160FT55N3F2?
The main difference is the boot block location: the 'FB' in M29F160FB55N3E2 denotes a bottom boot block architecture, while 'FT' denotes a top boot block. Both are 16 Mbit, 5 V, 55 ns parallel NOR Flash in 48-TSOP I with identical pinouts, so they are package- and pin-compatible; however, the boot sector containing protected boot code sits at the bottom of the address map on the FB part and at the top on the FT part. Substituting one for the other requires verifying that your bootloader expects the boot sector at the correct address.
What is the best drop-in replacement for M29F160FB55N3E2?
The closest drop-in replacement is the Micron M29F160FB55N3F2, which FindIC characterizes as a complete replacement: identical performance parameters, identical terminals and package (48-TSOP I), and no PCB modification required. Within the same M29F160 family, M29F160FB5AN6F2 and M29F160FB5AN6E2 also offer pin-compatible 48-TSOP I 16 Mbit 5 V asynchronous NOR Flash. Always confirm the boot block location and temperature grade suffix against your application before ordering the substitute.
M29F160FB55N3E2 vs M29F160FT5AN6E2 - which should I choose?
Choose M29F160FB55N3E2 if your system expects the protected boot sector at the bottom of the memory map (FB = bottom boot block). Choose M29F160FT5AN6E2 only if your bootloader resides at the top of the address map (FT = top boot block). Both are 5 V, 16 Mbit, 55 ns asynchronous parallel NOR Flash in 48-TSOP I packages with pin-to-pin compatibility, so electrical integration is identical - the decision is purely about boot-sector placement in your memory map and firmware linker configuration.
When should I choose the M29F160FB55N3E2 over a serial SPI Flash?
Choose the M29F160FB55N3E2 when you need random-access, execute-in-place code storage on a parallel bus with 55 ns access time - typical of legacy 16-bit microprocessor systems, industrial PLCs, and telecom line cards designed around a 5 V bus. Serial SPI NOR Flash (e.g., M25P or N25Q families) is preferable for new 3.3 V designs needing smaller packages and fewer pins, but it cannot match the parallel bus's 55 ns random access or drop into an existing 48-TSOP parallel footprint without a full redesign.
Is the M29F160FB55N3E2 suitable for automotive applications?
Yes, with qualification caveats. The M29F160FB55N3E2 supports an operating temperature of -40 C to +125 C, covering under-hood and body-electronics ambient requirements. However, the provided data does not state AEC-Q100 qualification for this specific orderable part, so for formally automotive programs you should verify AEC-Q100 grade with Micron or select an explicitly automotive-qualified orderable code. For industrial applications to 125 C, the temperature rating alone is generally sufficient.
Where can I download the M29F160FB55N3E2 datasheet PDF?
The official M29F160FB55N3E2 datasheet is available from Micron's product catalog page at micron.com under Parallel NOR Flash - the part-detail page for M29F160FB55N3E2 provides downloadable datasheets and product specs. Mirror copies are hosted at datasheets.com, datasheetq.com, and AiPCBA (the latter shows a 5-page summary document). For design work, always use the datasheet version current on Micron's official page, since 'Products and specifications discussed herein are subject to change by Micron without notice.'
Where can I find the M29F160FB55N3E2 pinout for 48-TSOP I?
The M29F160FB55N3E2 pinout is provided in the Micron M29F160 series datasheet, on the 48-pin TSOP I connection diagram page. The package uses a standard 12 x 4 pin TSOP I footprint with address lines A0-A19, data lines DQ0-DQ15, control pins CE#, OE#, WE#, RESET#/RP, BYTE#, and power pins VCC/VSS. LCSC also offers a free pinout diagram on its product page. Because pinout accuracy is critical, download the diagram directly from the official datasheet rather than third-party reproductions.
What is the RoHS and lead-free status of the M29F160FB55N3E2?
The M29F160FB55N3E2 is ROHS3 Compliant and lead free, according to distributor compliance data (IC-Components lists 'Lead Free Status / RoHS Status: ROHS3 Compliant'). The 'E2' suffix at the end of the part number is Micron's package/compliance designator for the RoHS lead-free finish. REACH status and halogen-free status were not stated in the provided data and should be confirmed from the Micron product page or material declaration sheet before use in EU-regulated products.
How does the embedded program/erase controller in the M29F160FB55N3E2 work?
The M29F160FB55N3E2 contains an embedded program/erase controller that automatically executes byte/word programming and block erase algorithms internally. The host writes a command sequence over the parallel bus (address/data cycles for program, erase, and status operations), and the controller generates the internal high voltages and timing without CPU intervention. Completion is detected via data polling or toggle bits, allowing simple software handshaking. This removes the need for complex external programming algorithms required by first-generation Flash devices.
Do I need level shifting to use M29F160FB55N3E2 with 3.3 V logic?
Yes, in most cases. The M29F160FB55N3E2 is a 5 V supply device, and its input thresholds and output drive levels are specified for 5 V CMOS/TTL buses. Many 5 V TTL-threshold inputs will accept the device's output levels, but driving its inputs from 3.3 V push-pull outputs is outside guaranteed VIH margins, and its 5 V outputs can overdrive 3.3 V-only inputs lacking 5 V tolerance. Use bus transceivers, series resistors per datasheet clamp-current limits, or level shifters on address, data, and control lines.
What are the key specifications of the M29F160FB55N3E2 that engineers should know?
The M29F160FB55N3E2 is a 16 Mbit (16777 kbit) asynchronous parallel NOR Flash organized as 1 M x 16 or 2 M x 8, with 55 ns access time, single 5 V supply, bottom boot block architecture, embedded program/erase controller, -40 C to +125 C operation, and 48-TSOP I surface-mount package in Tray packing. It is ROHS3 compliant and lead free. Key design considerations are 5 V-only I/O levels, boot-sector placement, and byte/word (BYTE#) bus-width selection. (Source: Micron product data and distributor listings, 2026-09-05.)
Hey Google, what can replace the M29F160FB55N3E2?
Pin-compatible replacements for the M29F160FB55N3E2 are primarily within the Micron/Numonyx M29F160 family: M29F160FB55N3F2 (complete drop-in per FindIC), M29F160FB5AN6F2, M29F160FB5AN6E2, and the top-boot M29F160FT55N3F2 / M29F160FT5AN6E2 - all 16 Mbit, 5 V, 55 ns, 48-TSOP I parts. If you need a different brand's equivalent, verify pinout and command-set compatibility against the datasheet before committing, since the provided cross-reference data did not confirm a cross-brand 48-TSOP drop-in.
Is there a Micron-equivalent from another brand for M29F160FB55N3E2 (cross-brand replacement)?
The provided cross-reference data did not identify a verified cross-brand drop-in for the M29F160FB55N3E2 in 48-TSOP I; the confirmed equivalents are all Micron/Numonyx M29F160 family parts. Historically, 5 V 16 Mbit parallel NOR was also made by other vendors, but pin-map and command-set differences mean substitution must be validated pin-by-pin. The safest sourcing strategy is to use M29F160FB55N3F2 or M29F160FB5AN6F2, which FindIC and Xecor confirm as fully compatible replacements requiring no design modification.

Engineering reference data for M29F160FB55N3E2 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the M29F160FB55N3E2 when you must populate an existing 5 V parallel NOR footprint of 16 Mbit with bottom boot blocks - typical of legacy industrial PLCs, telecom line cards, and EPROM retrofits, where its 55 ns access time and native 5 V I/O remove all level-shifting and timing redesign. Choose M29F160FB55N3F2 or M29F160FB5AN6F2 as sourcing equivalents when this exact orderable code is out of stock; both are confirmed pin-compatible on the same 48-TSOP I footprint. Choose M29F160FT55N3F2 or M29F160FT5AN6E2 only if your boot sector belongs at the top of the memory map. For new designs, prefer the 3 V M29W or SPI N25Q/M25P families for lower power and smaller packages - the 5 V parallel bus is a legacy constraint, not an advantage, so this part should be selected only to preserve compatibility with existing hardware.

Comparison with Alternatives

Parameter This Product M29F160FB55N3F2 M29F160FB5AN6F2 M29F160FT5AN6E2
Package 48-TSOP I 48-TSOP I - same 48-TSOP I - same 48-TSOP I - same
Brand Micron Technology Micron Technology Micron Technology Micron Technology
Density 16 Mbit (16777 kbits) 16 Mbit 16 Mbit 16 Mbit
Access Time 55 ns 55 ns 55 ns 55 ns
Supply Voltage 5 V 5 V 5 V 5 V
Organization 1 M x 16 / 2 M x 8 1 M x 16 / 2 M x 8 1 M x 16 / 2 M x 8 1 M x 16 / 2 M x 8
Boot Block Location Bottom (FB) Bottom (FB) Bottom (FB) Top (FT)
Operating Temperature -40 C to +125 C [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Interface Parallel, Asynchronous Parallel, Asynchronous Parallel, Asynchronous Parallel, Asynchronous
Package Compliance Suffix E2 (RoHS lead-free) F2 (RoHS lead-free) F2 (RoHS lead-free) E2 (RoHS lead-free)

Key Differentiators

  • Bottom boot block for standard reset-vector boot maps (vs M29F160FT55N3F2)
  • E2 RoHS lead-free compliance code with identical silicon (vs M29F160FB55N3F2)
  • Trade-off: 5 V-only I/O versus newer 3 V M29W family (vs M29W640GT70N3F)

Design Notes

Boot-block placement is the single most common substitution error in the M29F160 family. The FB (this part) puts the protected boot sector at the bottom of the address map (0x00000), while FT variants put it at the top. When substituting M29F160FT55N3F2 or M29F160FT5AN6E2 for the FB part, verify that the CPU reset vector and your linker script expect boot code at the new location. A mismatched boot sector produces a system that powers up but never executes code - easy to misdiagnose as a bad device.

This is a 5 V-only device. When interfacing with 3.3 V logic, do not assume compatibility from the datasheet's TTL-level VIH on some inputs; guaranteed margins must be met across temperature. Use 5 V-tolerant bus transceivers or level shifters on address, data, and control lines. Conversely, its 5 V output high level can damage 3.3 V-only inputs. During program/erase operations the DQ bus goes high-impedance except during polling - add pull-up/pull-down hold resistors if the host samples data lines asynchronously.

Decouple VCC with at least a 0.1 uF ceramic capacitor per power pin, placed within a few millimeters of the TSOP I pins, plus bulk capacitance near the device to support program/erase current pulses. Keep the address/data bus length matched to the CPU to meet the 55 ns access timing budget: estimated bus-flight-time allowance should be calculated from your trace lengths and propagation delay (about 150 ps per inch on FR-4) rather than assumed. Verify BYTE# is strapped firmly (not left floating) to select x8 or x16 mode before power-up.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

ROHS3 Compliant and Lead Free per IC-Components distributor compliance data; the E2 suffix is Micron's RoHS/lead-free package designator. REACH, halogen-free, and conflict-minerals status not stated in provided data.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Micron Technology M29F160FB55N3E2 M29F160FB55N3F2 M29F160FT55N3F2 M29F160FB5AN6F2 M29F160FT5AN6E2 M29W640GT70N3F NOR Flash parallel NOR memory asynchronous SRAM-style interface Flash memory 48-TSOP I TSOP PDSO48 RoHS ROHS3 Compliant bottom boot block embedded program/erase controller execute in place (XIP) 55 ns access time industrial PLC firmware telecom line card EPROM replacement byte/word bus width (BYTE#) Tray packaging
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