M29W800FB70ZA3SE - 8Mbit NOR Flash 70ns 48-TFBGA | Micron
MPN: M29W800FB70ZA3SE ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.59 | $1.59 |
| 10 | $1.45 | $14.50 |
| 100 | $1.32 | $132.00 |
| 500 | $1.21 | $605.00 |
| 1,000 | $1.12 | $1,120.00 |
Drop-in alternatives for M29W800FB70ZA3SE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M29W800FB70ZA3SF
✅ Drop-In✓ In Stock
$2.45 / Unit
View Datasheet →M29W800FT70ZA3SF
✅ Drop-In✓ In Stock
$2.05 / Unit
View Datasheet →M29W800FB70N3E
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$0.95 / Unit
View Datasheet →M29W800FB70ZA3SE Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash, Parallel |
| Memory Size | 8 Mbit |
| Organization | 1 M x 8 / 512 K x 16 |
| Access Time | 70 ns |
| Supply Voltage | 3 V / 3.3 V (2.7 V to 3.6 V class) |
| Technology | SLC NOR |
| Boot Block Architecture | Bottom boot block (FB) |
| Interface | Parallel, address/data bus |
| Package | 48-TFBGA (6 x 8 mm) |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 automotive |
| Packaging | Tray |
M29W800FB70ZA3SE 48-tfbga (6 x 8 mm) Pin Configuration Guide
Complete pinout information for M29W800FB70ZA3SE (48-tfbga (6 x 8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M29W800FB70ZA3SE.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M29W800FB70ZA3SE is suitable for 6 applications: Automotive ECU Boot Code Storage, Telematics and Connected Vehicle Modules, Industrial Control and PLC Firmware, Set-Top Box and Networking Equipment Boot ROM, Automotive Instrument Cluster and Display Modules, Legacy System Service and Repair.
Automotive ECU Boot Code Storage
The M29W800FB70ZA3SE's AEC-Q100 qualification and 70 ns access time make it a natural fit for engine, body, and chassis control units that fetch reset vectors and firmware directly from flash. The 8 Mbit (1 M x 8 / 512 K x 16) array accommodates bootloaders plus application code, while the bottom boot block layout places the small, frequently-verified boot sectors at the address the MCU samples at reset. Because the part is parallel NOR, code executes in place with zero copy overhead, and byte/word organization lets the designer match the processor bus width. Obsolete status means existing ECUs rely on remaining stock for service replacements.
Recommended
Telematics and Connected Vehicle Modules
Telematics control units combine a cellular modem, GNSS receiver, and microcontroller, all of which need reliable nonvolatile code storage. The M29W800FB70ZA3SE stores modem and application firmware in its 8 Mbit array; the 3.0 V to 3.6 V supply rail is shared directly with the 3.3 V logic domain, eliminating a dedicated memory regulator. The 70 ns access time supports burstless zero-wait-state reads from typical automotive MCUs. AEC-Q100 qualification addresses the wide temperature and vibration environment of vehicle installations, and the 48-TFBGA 6 x 8 mm footprint fits the compact PCB real estate typical of telematics modules.
Recommended
Industrial Control and PLC Firmware
Programmable logic controllers, motor drives, and industrial gateways store firmware and configuration in NOR flash because code must be instantly available at power-up without a loader. The M29W800FB70ZA3SE provides 8 Mbit of in-place-executable storage with a 70 ns access time, sufficient for real-time control loops running from local firmware. Block protection secures the boot region against accidental erase during field firmware updates. The parallel interface simplifies integration with classic 16-bit industrial microcontrollers, and the SE automotive suffix comfortably exceeds the environmental demands of factory-floor temperature and electrical-noise conditions found in control cabinets.
Recommended
Set-Top Box and Networking Equipment Boot ROM
Consumer and networking platforms such as set-top boxes, routers, and switches historically used parallel NOR as the boot device that initializes the SoC before handing control to larger NAND or serial flash. The M29W800FB70ZA3SE's 70 ns random access and 1 M x 8 / 512 K x 16 organization match the 16-bit boot buses of common media processors. The bottom boot block arrangement keeps the first-stage bootloader in small, well-protected sectors at the reset vector. Designers of service replacements value that the 48-TFBGA footprint and command set match the installed base, simplifying drop-in repairs without firmware changes.
Recommended
Automotive Instrument Cluster and Display Modules
Digital instrument clusters and driver-information displays require graphics configuration, calibration data, and boot firmware that survive key-off and remain immediately available at ignition. The M29W800FB70ZA3SE's 8 Mbit capacity holds these images comfortably, while AEC-Q100 qualification covers the elevated dashboard temperatures. The 70 ns access time lets the cluster MCU render boot screens without delays from code shadowing. Its 3.3 V operation ties directly into the cluster's logic rail, and the compact 48-ball TFBGA 6 x 8 mm package suits the dense multi-layer boards behind modern reconfigurable displays where board height and area are constrained.
Recommended
Legacy System Service and Repair
Maintenance organizations supporting fielded electronics - medical devices, avionics ground equipment, and industrial machines - need exact-fit replacement memory years after original production ends. The M29W800FB70ZA3SE, though obsolete, remains procurable through distributor stock (LCSC from $1.5905 as of 2026-09-02, plus DigiKey and Mouser listings), enabling like-for-like board repair without PCB respin or firmware revalidation. The SE automotive flow also provides the traceability documentation often demanded in regulated industries. Where stock runs dry, the ZA3SF compliance revision is the recommended successor because it preserves the 48-TFBGA footprint, block map, and command interface of the original part.
Recommended
Recommended Products Summary
Engineering reference data for M29W800FB70ZA3SE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M29W800FB70ZA3SF | M29W800FT70ZA3SF | M29W800FB70N3E |
|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 48-TFBGA (6 x 8 mm) | 48-TFBGA (6 x 8 mm) - same | 48-TFBGA (6 x 8 mm) - same | 48-TSOP - different body |
| Memory Size | 8 Mbit | 8 Mbit | 8 Mbit | 8 Mbit |
| Organization | 1 M x 8 / 512 K x 16 | 1 M x 8 / 512 K x 16 | 1 M x 8 / 512 K x 16 | 1 M x 8 / 512 K x 16 |
| Access Time | 70 ns | 70 ns | 70 ns | 70 ns |
| Boot Block Position | Bottom (FB) | Bottom (FB) | Top (FT) | Bottom (FB) |
| Supply Voltage | 3 V / 3.3 V | 3 V / 3.3 V | 3 V / 3.3 V | 3 V / 3.3 V |
| Lifecycle Status | Obsolete (Micron obsolete catalog) | Available (successor compliance revision) | Available | [DATA_NEEDED] |
| Automotive Qualification | AEC-Q100 (SE suffix) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Bottom boot block layout (vs M29W800FT70ZA3SF)
- Automotive AEC-Q100 flow (SE suffix) (vs M29W800FB70N3E)
- In-place code execution with 70 ns access (vs Serial NOR alternatives (e.g. MT25QL family))
Design Notes
The M29W800FB70ZA3SE appears in Micron's official obsolete part catalog (May 2026 listing), meaning no new production orders are accepted. Before committing the part to any new design, verify remaining distributor stock and secure enough volume for the full product service life, or pre-qualify the M29W800FB70ZA3SF compliance revision, which preserves the 48-TFBGA footprint and block architecture. Do not confuse the FB (bottom boot) and FT (top boot) suffixes: the boot vector address differs and firmware will fail to start if the wrong variant is fitted.
Design the land pattern per the Micron 48-ball TFBGA 6 x 8 mm outline using non-solder-mask-defined (NSMD) pads with dog-bone or via-in-pad fanout for the parallel address, data, and control buses. Place 100 nF ceramic decoupling capacitors adjacent to each VCC ball plus one bulk capacitor per supply domain. Keep the BYTE# and RESET# straps routed with care - RESET# should be driven by a supervisor to guarantee the device exits reset cleanly during brownout events, preventing corrupted erase operations.
At a 70 ns access time the parallel bus can run at moderate frequencies, but long shared address lines on a 6 x 8 mm BGA fanout can still produce reflections. Match address trace lengths within the same bank where practical, add series termination (22-33 ohm) on clocked or strobed lines if the host uses burst modes, and keep the data bus under 10 cm where possible. Verify read timing margins against the datasheet's address-access and chip-enable timing across the full automotive temperature range, not just room temperature.
Compliance Information
Automotive AEC-Q100 qualification stated in distributor descriptions (datasheets.com, Lisleapex). RoHS/REACH/lead-free status not stated in available listings; confirm via Micron product compliance documentation. Later SF-suffix revisions of this family are the RoHS-compliant revisions.
