M29W800FB70ZA3SE - 8Mbit NOR Flash 70ns 48-TFBGA | Micron
Teilenummer: M29W800FB70ZA3SE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.59 | $1,59 |
| 10 | $1.45 | $14,50 |
| 100 | $1.32 | $132,00 |
| 500 | $1.21 | $605,00 |
| 1.000 | $1.12 | $1.120,00 |
M29W800FB70ZA3SE Übersicht
Parallel NOR flash is a nonvolatile memory technology in which address and data lines are wired directly to memory arrays, allowing a CPU to execute code in place (XIP) without copying to RAM. Within the memory hierarchy, NOR flash sits alongside DRAM and SRAM as a primary code-storage medium, and it forms a subcategory of the broader flash memory family that also includes NAND flash. Parallel NOR remains favored for boot code and firmware storage where deterministic random access time matters more than raw density.
Key features of the M29W800FB70ZA3SE include the 70 ns address-to-data access time, byte (x8) and word (x16) selectable organization, block-protected architecture, and an automotive-grade temperature and quality flow per AEC-Q100. The FB suffix denotes the bottom boot-block architecture, and the 70 suffix denotes the 70 ns speed grade. Micron designed this family for reliable in-system reprogramming via standard command-set interfaces.
Architecturally, the device organizes 8 Mbits into asymmetric boot blocks, with a common flash interface for device identification and status polling. Program and erase operations are command-driven with status register feedback, allowing simple software drivers and standard flash file systems to manage the memory.
Typical applications include automotive ECU boot-code storage, telematics and body-control modules, industrial control firmware, and set-top-box or networking equipment boot ROM replacement. The 70 ns access time supports zero-wait-state execution from slow embedded processors.
A key design consideration is that this exact part is listed in Micron's obsolete part catalog, so new designs should verify long-term supply or plan a migration path to a current-generation NOR family.
This page synthesizes distributor pricing, drop-in alternatives, pinout availability, and lifecycle status not found in a single manufacturer or distributor source.
Drop-in-Alternativen für M29W800FB70ZA3SE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M29W800FB70ZA3SE (gleiche Bauform und Footprint) – abweichend in Package, Density, Interface, Memory Type, Organization.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M29W800FB70ZA3SF
✅ Drop-In✓ Auf Lager
$2.45 / Stück
Datenblatt ansehen →M29W800FT70ZA3SF
✅ Drop-In✓ Auf Lager
$2.05 / Stück
Datenblatt ansehen →M29W800FB70N3E
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.95 / Stück
Datenblatt ansehen →M29W800FB70ZA3SE Grenzwerte & elektrische Eigenschaften
| Speichertyp | NOR Flash, Parallel |
| Speichergröße | 8 Mbit |
| Speicherorganisation | 1 M x 8 / 512 K x 16 |
| Access Time | 70 ns |
| Versorgungsspannung | 3 V / 3.3 V (2.7 V to 3.6 V class) |
| Technology | SLC NOR |
| Boot Block Architecture | Bottom boot block (FB) |
| Schnittstelle | Parallel, address/data bus |
| Gehäuse | 48-TFBGA (6 x 8 mm) |
| Montageart | Surface Mount |
| Qualification | AEC-Q100 automotive |
| Packaging | Tray |
M29W800FB70ZA3SE 48-tfbga (6 x 8 mm) Pinbelegungsleitfaden
Pinbelegung für M29W800FB70ZA3SE (48-tfbga (6 x 8 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M29W800FB70ZA3SE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M29W800FB70ZA3SE ist geeignet für 6 Anwendungs: Automotive ECU Boot Code Storage, Telematics and Connected Vehicle Modules, Industrial Control and PLC Firmware, Set-Top Box and Networking Equipment Boot ROM, Automotive Instrument Cluster and Display Modules, Legacy System Service and Repair.
Automotive ECU Boot Code Storage
The M29W800FB70ZA3SE's AEC-Q100 qualification and 70 ns access time make it a natural fit for engine, body, and chassis control units that fetch reset vectors and firmware directly from flash. The 8 Mbit (1 M x 8 / 512 K x 16) array accommodates bootloaders plus application code, while the bottom boot block layout places the small, frequently-verified boot sectors at the address the MCU samples at reset. Because the part is parallel NOR, code executes in place with zero copy overhead, and byte/word organization lets the designer match the processor bus width. Obsolete status means existing ECUs rely on remaining stock for service replacements.
Empfohlen
Telematics and Connected Vehicle Modules
Telematics control units combine a cellular modem, GNSS receiver, and microcontroller, all of which need reliable nonvolatile code storage. The M29W800FB70ZA3SE stores modem and application firmware in its 8 Mbit array; the 3.0 V to 3.6 V supply rail is shared directly with the 3.3 V logic domain, eliminating a dedicated memory regulator. The 70 ns access time supports burstless zero-wait-state reads from typical automotive MCUs. AEC-Q100 qualification addresses the wide temperature and vibration environment of vehicle installations, and the 48-TFBGA 6 x 8 mm footprint fits the compact PCB real estate typical of telematics modules.
Empfohlen
Industrial Control and PLC Firmware
Programmable logic controllers, motor drives, and industrial gateways store firmware and configuration in NOR flash because code must be instantly available at power-up without a loader. The M29W800FB70ZA3SE provides 8 Mbit of in-place-executable storage with a 70 ns access time, sufficient for real-time control loops running from local firmware. Block protection secures the boot region against accidental erase during field firmware updates. The parallel interface simplifies integration with classic 16-bit industrial microcontrollers, and the SE automotive suffix comfortably exceeds the environmental demands of factory-floor temperature and electrical-noise conditions found in control cabinets.
Empfohlen
Set-Top Box and Networking Equipment Boot ROM
Consumer and networking platforms such as set-top boxes, routers, and switches historically used parallel NOR as the boot device that initializes the SoC before handing control to larger NAND or serial flash. The M29W800FB70ZA3SE's 70 ns random access and 1 M x 8 / 512 K x 16 organization match the 16-bit boot buses of common media processors. The bottom boot block arrangement keeps the first-stage bootloader in small, well-protected sectors at the reset vector. Designers of service replacements value that the 48-TFBGA footprint and command set match the installed base, simplifying drop-in repairs without firmware changes.
Empfohlen
Automotive Instrument Cluster and Display Modules
Digital instrument clusters and driver-information displays require graphics configuration, calibration data, and boot firmware that survive key-off and remain immediately available at ignition. The M29W800FB70ZA3SE's 8 Mbit capacity holds these images comfortably, while AEC-Q100 qualification covers the elevated dashboard temperatures. The 70 ns access time lets the cluster MCU render boot screens without delays from code shadowing. Its 3.3 V operation ties directly into the cluster's logic rail, and the compact 48-ball TFBGA 6 x 8 mm package suits the dense multi-layer boards behind modern reconfigurable displays where board height and area are constrained.
Empfohlen
Legacy System Service and Repair
Maintenance organizations supporting fielded electronics - medical devices, avionics ground equipment, and industrial machines - need exact-fit replacement memory years after original production ends. The M29W800FB70ZA3SE, though obsolete, remains procurable through distributor stock (LCSC from $1.5905 as of 2026-09-02, plus DigiKey and Mouser listings), enabling like-for-like board repair without PCB respin or firmware revalidation. The SE automotive flow also provides the traceability documentation often demanded in regulated industries. Where stock runs dry, the ZA3SF compliance revision is the recommended successor because it preserves the 48-TFBGA footprint, block map, and command interface of the original part.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M29W800FB70ZA3SE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M29W800FB70ZA3SF | M29W800FT70ZA3SF | M29W800FB70N3E |
|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 48-TFBGA (6 x 8 mm) | 48-TFBGA (6 x 8 mm) - same | 48-TFBGA (6 x 8 mm) - same | 48-TSOP - different body |
| Memory Size | 8 Mbit | 8 Mbit | 8 Mbit | 8 Mbit |
| Organization | 1 M x 8 / 512 K x 16 | 1 M x 8 / 512 K x 16 | 1 M x 8 / 512 K x 16 | 1 M x 8 / 512 K x 16 |
| Access Time | 70 ns | 70 ns | 70 ns | 70 ns |
| Boot Block Position | Bottom (FB) | Bottom (FB) | Top (FT) | Bottom (FB) |
| Supply Voltage | 3 V / 3.3 V | 3 V / 3.3 V | 3 V / 3.3 V | 3 V / 3.3 V |
Wichtigste Unterscheidungsmerkmale
- Bottom boot block layout (vs. M29W800FT70ZA3SF)
- Automotive AEC-Q100 flow (SE suffix) (vs. M29W800FB70N3E)
- In-place code execution with 70 ns access (vs. Serial NOR alternatives (e.g. MT25QL family))
Designhinweise
The M29W800FB70ZA3SE appears in Micron's official obsolete part catalog (May 2026 listing), meaning no new production orders are accepted. Before committing the part to any new design, verify remaining distributor stock and secure enough volume for the full product service life, or pre-qualify the M29W800FB70ZA3SF compliance revision, which preserves the 48-TFBGA footprint and block architecture. Do not confuse the FB (bottom boot) and FT (top boot) suffixes: the boot vector address differs and firmware will fail to start if the wrong variant is fitted.
Design the land pattern per the Micron 48-ball TFBGA 6 x 8 mm outline using non-solder-mask-defined (NSMD) pads with dog-bone or via-in-pad fanout for the parallel address, data, and control buses. Place 100 nF ceramic decoupling capacitors adjacent to each VCC ball plus one bulk capacitor per supply domain. Keep the BYTE# and RESET# straps routed with care - RESET# should be driven by a supervisor to guarantee the device exits reset cleanly during brownout events, preventing corrupted erase operations.
At a 70 ns access time the parallel bus can run at moderate frequencies, but long shared address lines on a 6 x 8 mm BGA fanout can still produce reflections. Match address trace lengths within the same bank where practical, add series termination (22-33 ohm) on clocked or strobed lines if the host uses burst modes, and keep the data bus under 10 cm where possible. Verify read timing margins against the datasheet's address-access and chip-enable timing across the full automotive temperature range, not just room temperature.
Compliance-Informationen
Automotive AEC-Q100 qualification stated in distributor descriptions (datasheets.com, Lisleapex). RoHS/REACH/lead-free status not stated in available listings; confirm via Micron product compliance documentation. Later SF-suffix revisions of this family are the RoHS-compliant revisions.
