M29W800FB70N3E - 8Mbit 3V Parallel NOR Flash 70ns | Micron
MPN: M29W800FB70N3E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.45 | $1.45 |
| 10 | $1.31 | $13.10 |
| 100 | $1.18 | $118.00 |
| 500 | $1.06 | $530.00 |
| 1,000 | $0.95 | $950.00 |
Drop-in alternatives for M29W800FB70N3E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M29W800FT70N3E
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View Datasheet →M29W400FT55N3E
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View Datasheet →M29W800FB70N3E Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash |
| Density | 8 Mbit (8388608 bits) |
| Organization | 512K x 16 / 1M x 8 |
| Data Bus Width | x8/x16 (BYTE# selectable) |
| Access Time | 70 ns |
| Supply Voltage (VCC) | up to 3.6 V for program, erase and read |
| Programming Time | 10 us per byte/word (typical) |
| Memory Blocks | 19 blocks, 1 boot block (bottom - FB configuration) |
| Interface | Parallel |
| Operating Temperature | -40C to +125C |
| Package | 48-TSOP (12 x 20 mm), TSOP I |
| Pin Count | 48 |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS compliant (plastic TSOP-48) |
| Product Longevity Program | No |
| FBGA Code | N/A |
| Chipset Validation | N/A |
M29W800FB70N3E 48-tsop (12 x 20 mm), tsop i Pin Configuration Guide
Complete pinout information for M29W800FB70N3E (48-tsop (12 x 20 mm), tsop i package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M29W800FB70N3E.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M29W800FB70N3E is suitable for 6 applications: Industrial PLC and Automation Firmware Storage, Telecom Line Card Boot Memory, Set-Top Box and Consumer AV Boot Firmware, Automotive Body Controller Code Storage, Networking Equipment Boot and Configuration Storage, Legacy Redesign and Obsolescence Recovery.
Industrial PLC and Automation Firmware Storage
The M29W800FB70N3E fits industrial PLC boot and application firmware storage because its 8 Mbit capacity holds a complete control program plus a reserved block for firmware updates, and its -40C to +125C rating covers electrically noisy, thermally stressed factory cabinets. In a typical design, the PLC CPU executes boot code in place from the bottom boot block at 70 ns asynchronous access, then loads application code into RAM. The 19-block architecture lets firmware place parameters in small parameter blocks and reprogram only the application blocks during field updates, with 10 us per byte/word programming time keeping updates under a few seconds. Block protection prevents accidental corruption from power glitches during relay switching.
Recommended
Telecom Line Card Boot Memory
Telecom line cards and network interface modules need nonvolatile storage that survives extended -40C to +85C (and beyond) temperature ranges and supports remote field firmware upgrades. The M29W800FB70N3E's 8 Mbit array accommodates a full protocol-stack image in x16 mode, and the 70 ns access time allows the local microprocessor to run diagnostics directly from NOR at power-up before the network processor is loaded. The RP/RESET hardware reset pin lets the card controller force the device into read mode within microseconds after a system reset, which is essential for meeting carrier-grade reboot timing. The 3.6 V maximum VCC tolerance suits standard 3.3 V telecom backplane rails with regulation tolerance.
Recommended
Set-Top Box and Consumer AV Boot Firmware
Set-top boxes and digital AV receivers commonly boot their SoC from a small parallel NOR while streaming media code loads from larger NAND or eMMC. The M29W800FB70N3E serves this role: its bottom boot block holds the reset vector and secure boot loader, the 8 Mbit array carries rescue firmware and settings, and the BYTE# pin allows reuse of the same board layout for cost-reduced x8 configurations. The 70 ns access time meets typical boot-ROM fetch timing, and x16 mode doubles effective bandwidth during bulk code copy. Its 48-TSOP 12 x 20 mm package is a proven, low-cost footprint for consumer boards that avoid fine-pitch BGA assembly.
Recommended
Automotive Body Controller Code Storage
Body control modules, gateways, and instrument clusters need code storage rated to +125C junction-level conditions. The M29W800FB70N3E's -40C to +125C operating range matches these environments, and its 8 Mbit array accommodates CAN/LIN stack plus diagnostics code in x16 mode. Hardware block protection can lock the boot block against corruption during in-system reprogramming sessions performed at the dealer or factory end-of-line, while remaining blocks accept firmware updates via UDS-style reflash. Note that formal AEC-Q100 qualification was not stated in the reviewed datasheet data, so design teams should verify the automotive ordering options and PPAP availability with Micron before releasing an automotive production BOM.
Recommended
Networking Equipment Boot and Configuration Storage
Routers, switches, and PoE midspans store boot loaders and factory configuration in parallel NOR while the main image lives in larger flash. The M29W800FB70N3E provides 8 Mbit of reliable execute-in-place storage with a 70 ns access time sufficient for the management controller to run U-Boot-style bootloaders directly from NOR. The 19-block structure separates boot block, environment-variable blocks, and configuration blocks, enabling atomic configuration save operations where only one small block is erased per change, minimizing flash wear. Its wide industrial temperature range supports unventilated outdoor cabinets, and the TSOP-48 footprint is compatible with reflow assembly on standard telecom PCBs.
Recommended
Legacy Redesign and Obsolescence Recovery
Many legacy boards designed around the STMicroelectronics M29W800FB NOR Flash now need an exact sourcing replacement; the Micron M29W800FB70N3E is the post-acquisition continuation of that product line, making it the natural repair and continued-production part. Its identical block architecture, command set, and 48-TSOP footprint mean no PCB or driver changes. For designs with slight timing margin differences, the same-family M29F800FB55N3E2 offers a faster 55 ns access time in the same package, and the 4 Mbit M29W400FB55N3E supports reduced-image variants. This makes the M29W800FB70N3E a cornerstone part for EOL recovery and long-tail industrial support programs.
Recommended
Recommended Products Summary
Engineering reference data for M29W800FB70N3E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M29W800FT70N3E | M29F800FB55N3E2 | M29F800FT55N3E2 | M29W400FB55N3E |
|---|---|---|---|---|---|
| Package | 48-TSOP I (12 x 20 mm) | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 8 Mbit | 8 Mbit | 8 Mbit | 8 Mbit | 4 Mbit |
| Access Time | 70 ns | 70 ns | 55 ns | 55 ns | 55 ns |
| Bus Width | x8/x16 | x8/x16 | x8/x16 | x8/x16 | x8/x16 |
| Boot Block Location | Bottom (FB) | Top (FT) | Bottom (FB) | Top (FT) | Bottom (FB) |
| Operating Temperature | -40C to +125C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Block Count | 19 blocks | 19 blocks | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Unit Price (qty 1) | $1.45 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Bottom boot block suits reset-vector-at-zero CPUs (vs M29W800FT70N3E)
- Industrial temperature range to +125C (vs M29F800FB55N3E2)
- Direct sourcing continuity for legacy ST designs (vs M29F800FB55N3E2)
- 70 ns access trades speed for family continuity (vs M29W400FB55N3E)
Design Notes
The boot block location (FB = bottom, FT = top) changes the address where the CPU fetches its reset vector. Swapping an M29W800FB for an M29W800FT in the same 48-TSOP footprint will place boot code at the wrong end of the address map and brick the system, even though the pinout is identical. Always match the boot-block letter suffix to the original design, and confirm the flash driver command sequences match the device family (M29W vs M29F generations have minor timing differences).
Place 0.1 uF ceramic decoupling capacitors within 5 mm of both VCC pins of the TSOP-48 package, plus a 4.7-10 uF bulk capacitor per device. Program and erase operations generate internal charge-pump switching noise that couples into VCC; insufficient decoupling shows up as corrupted bytes during bulk erase. Keep address and data traces length-matched when the bus runs above 25 MHz, and route the RP/RESET pin away from switching regulator nodes to prevent spurious resets during in-system programming.
The BYTE# pin selects x8 vs x16 mode and must be tied to a valid logic level (VCC for x16, GND for x8); floating BYTE# causes unpredictable data bus behavior. Similarly, unused higher-order address pins when running in x8 mode should be driven, not left floating, because they remain sampled. Verify the MCU address mapping shifts by one bit in x8 mode - a common source of 'wrong data at wrong address' bugs during first silicon bring-up of dual-mode NOR designs.
Estimated: program/erase current draw on parallel NOR devices of this class can reach 15-25 mA during erase and program versus a few mA in read mode. Budget the 3.3 V rail accordingly when multiple banks program simultaneously, and ensure the supply can hold VCC within the allowed range (up to 3.6 V maximum per datasheet) during those transients to avoid program errors. Add bulk capacitance near the flash rather than relying solely on the MCU regulator output capacitor.
Compliance Information
Distributor/datasheet aggregator data lists the package as ROHS COMPLIANT, PLASTIC, TSOP-48. Product Longevity Program: No. REACH, halogen-free, and conflict minerals declarations were not stated in the reviewed data - consult Micron product environmental pages.
