M1AFS1500-1FGG484K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
MPN: M1AFS1500-1FGG484K ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1804.78 | $1,804.78 |
| 10 | $1750 | $17,500.00 |
| 100 | $1680 | $168,000.00 |
| 500 | $1615 | $807,500.00 |
| 1,000 | $1560 | $1,560,000.00 |
Drop-in alternatives for M1AFS1500-1FGG484K — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-1FG484K
✅ Drop-In✓ In Stock
$1170.4 / Unit
View Datasheet →M1AFS1500-2FGG484
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
M1AFS600-1FGG484
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$59.5 / Unit
View Datasheet →M1AFS600-1FG484
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$172 / Unit
View Datasheet →M7AFS600-1FGG484
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$200 / Unit
View Datasheet →M7AFS600-2FGG484
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$210 / Unit
View Datasheet →M1AFS1500-1FGG484K Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| User I/O | 223 |
| Flash Memory Bits | 276,480 |
| Processor Core | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based |
| Maximum Fabricate Frequency (family, per Jotrin) | 1282.05 MHz |
| Package | 484-ball FBGA, 1.00 mm ball pitch |
| Mounting Type | Surface Mount |
| Configuration | Flash-based, live at power-up, single chip |
| Analog Peripherals | Integrated configurable analog (voltage/current/temperature monitoring) |
| Clock Management | On-chip clock generation and management circuitry |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
M1AFS1500-1FGG484K 484-ball fbga, 1.00 mm ball pitch Pin Configuration Guide
Complete pinout information for M1AFS1500-1FGG484K (484-ball fbga, 1.00 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-1FGG484K.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-1FGG484K is suitable for 6 applications: Intelligent Power and System Management, Server and Datacenter Telemetry, Industrial Control and Motor Drive Supervision, Defense and Aerospace Secure Systems, Telecom Line Cards and Network Equipment, Mixed-Signal ASIC Prototyping and Bridging.
Intelligent Power and System Management
The M1AFS1500-1FGG484K is a natural fit for intelligent power and system management because its Fusion architecture integrates configurable analog monitoring (board-input voltage, current, and temperature channels), 276,480 bits of on-chip flash for event and PEF logging, and a programmable fabric that is live at power-up from on-chip flash. A single device can supervise multiple power-supply rails, implement turn-on/turn-off sequencing state machines, and drive PWM fan control outputs, replacing a discrete supervisor ASIC plus microcontroller. With 223 user I/O on the 484-ball FBGA, one chip can manage an entire shelf. The trade-off versus a dedicated hot-swap controller is higher unit cost, offset by consolidation and programmability.
Recommended
Server and Datacenter Telemetry
In server and datacenter platforms, the M1AFS1500-1FGG484K serves as a board-management controller collecting voltage, current, and temperature telemetry through its integrated analog blocks and reporting over I2C/SMBus implemented in the fabric. Because configuration resides in on-chip flash, the device is functional during power-up transitions, which is essential for measuring and sequencing rails as they rise. The embedded ARM Cortex-M1 soft core executes management firmware alongside hardware monitoring logic, and the 484-ball footprint with 223 I/O supports dense backplane interfaces. Its flash-based fabric also simplifies secure-boot and inventory logging compared with SRAM FPGAs that need an external configuration flash device.
Recommended
Industrial Control and Motor Drive Supervision
Industrial motor drives and process-control boards benefit from the M1AFS1500-1FGG484K's combination of analog monitoring and deterministic flash-based logic. The integrated analog subsystem measures DC-bus voltage, shunt current, and heatsink temperature, while the fabric implements PWM generation, protection interlocks, and communication interfaces such as CAN or RS-485 in logic. Because the device is live at power-up, safety interlocks are active before the digital controller completes booting, improving fault coverage. The 1.5M-gate capacity accommodates both the protection logic and a Cortex-M1 supervisory core. Industrial designers should verify conduction-cooled thermal limits, since the FBGA relies on PCB thermal vias for heat extraction.
Recommended
Defense and Aerospace Secure Systems
Flash-based Fusion FPGAs are widely used in defense and aerospace programs because the configuration is stored on-chip in nonvolatile flash, eliminating the external bitstream flash that SRAM FPGAs require and reducing single-event configuration-upset exposure. The M1AFS1500-1FGG484K supports single-chip, secure designs with the ARM Cortex-M1 soft core and custom logic in one certified-bill-of-material device, and its analog blocks add board-health telemetry without extra components. Designers pairing it with radiation-tolerant RTAX parts elsewhere in the stack keep a common Microsemi tool flow in Libero. Cost and radiation characterization are the trade-offs to evaluate against true rad-hard alternatives for high-orbit missions.
Recommended
Telecom Line Cards and Network Equipment
Telecom line cards require power-supply supervision, blinking/alarms, and glue logic that the M1AFS1500-1FGG484K consolidates in a single flash-based device. Its 223 user I/O handle backplane interfaces, LED arrays, and slot-ID functions, while the analog subsystem monitors feed voltage and board temperature and logs events to the 276,480-bit flash for NEBS-style fault reporting. Live-at-power-up configuration means alarms are functional before host processors boot. The FBGA's 1.00 mm pitch suits standard line-card assembly processes. For cards with lighter logic needs, the same-footprint AFS600 variants reduce cost without a PCB respin, an important option in long-lived telecom platforms.
Recommended
Mixed-Signal ASIC Prototyping and Bridging
The Fusion family was explicitly positioned by Microsemi as an alternative to costly and time-consuming mixed-signal ASIC designs, making the M1AFS1500-1FGG484K an excellent prototyping and low-volume production platform for mixed-signal systems. Designers implement analog monitoring channels, flash event logs, and custom digital control in programmable fabric, iterating the design in Libero without NRE charges. The embedded ARM Cortex-M1 lets firmware be developed against the real analog environment rather than a simulation model. Once validated, the same architecture can guide an ASIC migration, or the FPGA can remain in production for volumes where ASIC mask costs cannot be amortized.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-1FGG484K — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-1FG484K | M1AFS600-1FGG484 | M7AFS600-1FGG484 |
|---|---|---|---|---|
| Package | 484-ball FBGA (1.00 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | [DATA_NEEDED] | [DATA_NEEDED] |
| Logic Cells | 38,400 | 38,400 | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 223 | 223 | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 (standard) | -1 (standard) | -1 (standard) | -1 (M7 grade) |
| ARM Cortex-M1 Support | Yes | Yes | Yes | Yes |
| Lead-Free / Green Package | Yes (GG suffix) | No (FG standard finish) | Yes (GG suffix) | Yes (GG suffix) |
| Configuration | Flash, live at power-up, single chip | Flash, live at power-up | Flash, live at power-up | Flash, live at power-up |
Key Differentiators
- Full AFS1500 density on the 484-ball footprint (vs M1AFS600-1FGG484)
- Lead-free GG ball finish for RoHS-driven programs (vs M1AFS1500-1FG484K)
- Integrated analog monitoring vs digital-only ProASIC3 peers (vs A3PE1500-1FGG484I)
Design Notes
The M1AFS1500-1FGG484K uses a 1.5 V core supply on a 130 nm flash process. Power dissipation depends heavily on switching activity, so run Microchip Libero SmartPower estimation with realistic toggle rates before finalizing the core rail design. Because the fabric is flash-based, static (configuration) power is low and the device is live at power-up, but inrush must still be managed for the analog blocks and I/O banks. Provide separate, well-decoupled rails per the Fusion power-supply pin groups, and validate sequencing requirements in the family datasheet power chapter.
Estimated: a 484-ball FBGA dissipating 2 W with a typical theta_JA near 20 C/W (verify the exact figure in the Fusion package thermal table) would rise roughly 40 C above ambient, so sustained high-utilization designs need solid thermal relief. Use an array of thermal vias under the ball field tied to internal ground planes, and consider airflow targets early. Fusion devices also dissipate power in the analog monitoring blocks, which is constant rather than activity-dependent, so include it in the worst-case budget rather than treating it as negligible.
The 484-ball FBGA uses a 1.00 mm ball pitch, requiring controlled-impedance breakout on at least one internal signal layer with via-in-pad or dogbone fanout. Assign I/O banks in Libero before routing so voltage-referenced banks group correctly, and keep the JTAG chain short with series termination on TCK. Because the device is a drop-in for same-footprint AFS600/AFS1500 variants, reserve board space and connect unused resources neutrally so a future density change does not force a respin. Decouple every VDD pin with 0.1 uF plus bulk capacitance per the Fusion layout guidelines.
Do not confuse speed-grade and package-finish suffixes when ordering: M1AFS1500-1FG484K (FG finish) and M1AFS1500-1FGG484K (GG lead-free finish) share a footprint, but parts like M1AFS1500-1FG676 or FGG256 use different packages and are NOT drop-ins. Also confirm the design fits AFS600 resources before swapping in lower-density alternatives. Finally, Fusion analog blocks have their own configuration workflow in Libero; treating them as ordinary I/O leads to non-functional monitoring channels.
Compliance Information
Per digchip datasheet summary: Lead Free Status = Lead Free; RoHS Status = RoHS Compliant. The GG suffix denotes the lead-free package finish variant. REACH, halogen-free, and conflict-minerals declarations were not stated in the reviewed distributor data.
