MAX32550-LCS+T - Secure Cortex-M3 MCU 1MB Flash 121-CTBGA | ADI
MPN: MAX32550-LCS+T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.4 | $204.00 |
| 100 | $18.2 | $1,820.00 |
| 500 | $16.1 | $8,050.00 |
| 1,000 | $14.25 | $14,250.00 |
MAX32550-LCS+T Overview
A secure microcontroller is an MCU that combines a standard processor core (here, ARM Cortex-M3) with integrated hardware cryptographic engines, secure boot ROM, tamper detection, and physically separate key storage. The MAX32550 belongs to the broader hierarchy: secure MCU -> microcontroller -> embedded processor -> integrated circuit. This device targets financial-terminal OEMs who need both application-class processing power and FIPS-grade security in a single chip.
Key features include a 32-bit ARM Cortex-M3 core with 108 MHz maximum clock, 1 MB embedded Flash (1M x 8), 256 KB SRAM, 8 KB AES self-encrypted NVSRAM with battery backup, integrated cryptographic accelerators (AES, DES, SHA, RSA, ECC), hardware True Random Number Generator, secure boot ROM, physical tamper detection pins, an integrated smart-card interface (ISO 7816), magnetic-stripe reader interface, and USB 2.0 Full-Speed with on-chip PHY.
The MAX32550 integrates a BGA package with 121 balls on an 8x8 mm body, allowing a compact PCB solution that includes the secure element, application MCU, and physical-tamper mesh interfaces in a single device. The NVSRAM is automatically encrypted with AES-256 keys generated and stored in a dedicated hardware block, removing software-side key management for tamper-sensitive state. The chip targets POS terminal OEMs seeking PCI PTS 4.x/5.x and EMVCo certification.
Typical applications include mobile chip-and-PIN payment terminals, PIN pads, POS terminals, secure authentication tokens, EMV smart-card readers, and other financial-grade trusted devices. Industrial secure-control applications such as access-control and hardware security modules also benefit from the integrated tamper mesh.
Design consideration: route the battery-backup NVSRAM domain with a separate power rail and a battery cell or super-cap; the cryptographic NVSRAM state is preserved while the rest of the chip powers down. Provide adequate ground-return vias under the CTBGA to meet EMI/magnetic-stripe-decoder noise immunity requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for MAX32550-LCS+T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MAX32550-LCS+
✅ Drop-In📋 Reference alternative (not in catalog)
MAX32550-LCS+T Maximum Ratings & Electrical Characteristics
| Manufacturer | Analog Devices Inc./Maxim Integrated |
| Series | DeepCover |
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum CPU Clock | 108 MHz |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| RAM Size | 256 KB |
| Battery-Backed NVSRAM | 8 KB, AES self-encrypted |
| Package | 121-CTBGA (8x8 mm) |
| Mounting Type | Surface Mount |
| Connectivity | USB 2.0 FS, SPI, I2C, UART, ISO 7816 smart-card, MSR |
| Cryptographic Accelerators | AES, DES/3DES, SHA-1/256, RSA, ECC, TRNG |
| Secure Boot | Yes (immutable ROM secure boot) |
| Tamper Detection | Hardware tamper pins, temperature/voltage monitor |
| RoHS Status | Compliant |
MAX32550-LCS+T 121-ctbga (8x8 mm) Pin Configuration Guide
Pin configuration for MAX32550-LCS+T (121-ctbga (8x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MAX32550-LCS+T.
Refer to the datasheet for full pin configuration.
Typical Applications
MAX32550-LCS+T is suitable for 6 applications: Mobile Chip-and-PIN Payment Terminal, PIN Pad and PED (PIN Entry Device), EMV Smart-Card Reader Module, Mobile Point-of-Sale (mPOS) Dongle, Hardware Security Module (HSM) for IoT Edge, Access Control and Identity Token.
Mobile Chip-and-PIN Payment Terminal
The MAX32550-LCS+T integrates an ARM Cortex-M3 core at 108 MHz with 1 MB Flash, 256 KB SRAM, and 8 KB of AES self-encrypted NVSRAM - the exact memory mix needed to host a real-time POS application stack alongside transaction logs and cryptographic keys. Its hardware AES, RSA, ECC, and SHA accelerators satisfy PCI PTS 4.x/5.x cryptographic-response time budgets that software-only MCUs cannot meet at peak tap-and-go load. The integrated ISO 7816 smart-card controller and 3-track magnetic-stripe reader interface remove two external ASICs, while the tamper pins and secure-boot ROM satisfy the physical-security envelope. The 121-CTBGA (8x8 mm) fits inside handheld-terminal enclosures.
Recommended
PIN Pad and PED (PIN Entry Device)
A PCI PTS-compliant PIN Entry Device requires a secure MCU with isolated key storage and tamper detection - the MAX32550-LCS+T provides exactly that through its hardware AES key wrap, secure-boot ROM, and dedicated tamper pins. The Cortex-M3 at 108 MHz drives the keypad-matrix scan, LCD controller, and EMV transaction firmware concurrently without contention, while the encrypted NVSRAM persists PIN-block retry counters across power cycles. Compared with a discrete secure-element + general-MCU two-chip design, the MAX32550 reduces BOM cost, PCB area, and certification surface area.
Recommended
EMV Smart-Card Reader Module
The MAX32550-LCS+T integrates an ISO 7816 smart-card interface with built-in UART and supply-voltage management, eliminating the need for an external smart-card controller ASIC. The Cortex-M3 core runs the EMVCo L1/L2/L3 stack while hardware AES and ECC accelerators perform the CDA (Combined Data Authentication) signature verifications within the 500 ms transaction-time budget. The 8 KB encrypted NVSRAM stores terminal risk-management counters, while the 1 MB Flash holds the EMV application kernels. The CTBGA footprint suits both OEM and modular reader form factors.
Recommended
Mobile Point-of-Sale (mPOS) Dongle
For compact mPOS dongles that pair with smartphones, the MAX32550-LCS+T offers a single-chip solution combining application Cortex-M3, secure-element-grade key storage, and integrated USB 2.0 Full-Speed with on-chip PHY for host pairing. The encrypted NVSRAM protects transaction counters and PIN retry state, while the 108 MHz core executes end-to-end encryption pipelines within mobile tap-and-go latency budgets. The 8x8 mm CTBGA fits inside USB-C dongle enclosures without compromising board real estate for power and antenna.
Recommended
Hardware Security Module (HSM) for IoT Edge
Industrial IoT edge devices that issue and verify signed firmware updates benefit from the MAX32550-LCS+T's hardware RSA/ECC accelerators and True Random Number Generator. The encrypted NVSRAM stores root keys while the Cortex-M3 executes TLS handshake and firmware-signature verification without offloading to a separate secure element. Hardware tamper detection and voltage/temperature monitors give a defense envelope against physical-key extraction. The 121-CTBGA is a fit for sealed industrial enclosures.
Recommended
Access Control and Identity Token
Enterprise access-control readers and government ID tokens leverage the MAX32550-LCS+T's secure boot, encrypted NVSRAM, and hardware AES/SHA accelerators to perform mutual authentication with credentials stored inside the chip. The Cortex-M3 runs the secure token protocol stack while tamper detection erases keys under physical attack. The 121-CTBGA package and integrated USB simplify integration into desktop token readers. Compared with general-purpose MCUs, the integrated crypto block avoids the need for an external secure element.
Recommended
Recommended Products Summary
Engineering reference data for MAX32550-LCS+T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX32550-LCS+ | MAX32555-LNS+ | MAX32560-LNS+ |
|---|---|---|---|---|
| Package | 121-CTBGA (8x8 mm) | 121-CTBGA (8x8 mm) - same | 121-LQFP - different package | 121-LQFP - different package |
| Brand | Analog Devices | Analog Devices - same | Analog Devices - same | Analog Devices - same |
| Core | ARM Cortex-M3 @ 108 MHz | ARM Cortex-M3 @ 108 MHz | ARM Cortex-M3 @ 108 MHz | ARM Cortex-M3 @ lower power |
| Hardware Crypto | AES/DES/SHA/RSA/ECC/TRNG | AES/DES/SHA/RSA/ECC/TRNG | DeepCover AES/SHA/TRNG | DeepCover AES/SHA/TRNG |
| Secure Boot | Yes (immutable ROM) | Yes (immutable ROM) | Yes | Yes |
| POS Peripherals | ISO 7816, MSR, USB FS | ISO 7816, MSR, USB FS | ISO 7816, USB FS | Lower-power variant, smart-card |
| Pin Compatibility | - | Drop-in (same die, no T&R) | Different package (LQFP vs CTBGA) - not drop-in | Different package (LQFP vs CTBGA) - not drop-in |
Key Differentiators
- Integrated DeepCover security subsystem (AES/SHA/RSA/ECC + TRNG + secure-boot ROM + encrypted NVSRAM) on a single die (vs Discrete secure-element + general-MCU two-chip design)
- POS-grade peripheral integration: ISO 7816 smart-card, 3-track MSR, USB FS with on-chip PHY, LCD controller, keypad matrix (vs MAX32560-LNS+)
- 121-CTBGA (8x8 mm) compact footprint tailored to handheld POS enclosures (vs MAX32555-LNS+)
Design Notes
The MAX32550-LCS+T requires a separate VBAT rail for the 8 KB encrypted NVSRAM; route VBAT through a low-leakage diode-or-MOSFET selector from either VDD or a coin-cell/supercap backup. VBAT current during retention is in the sub-uA range - ensure the backup source impedance is below 10 kohm to avoid corruption. Bulk-decouple VDD with at least 10 uF X5R ceramic close to the BGA balls and a 0.1 uF X7R for high-frequency noise. Add a 1 uF X5R on each auxiliary analog supply pin (AVDD/VDDA) per the manufacturer datasheet reference schematic.
Use a 4-layer PCB with a continuous ground plane directly beneath the 121-CTBGA package. Implement via-in-pad (VIP) with filled and plated-over vias on all signal balls to reduce BGA assembly defects. Maintain a 50-ohm controlled-impedance trace for the USB DP/DM pair to the connector. Keep the magnetic-stripe-decoder analog traces short and surrounded by ground pour to reject noise. Estimated: with 4-layer stack-up and 0.5 oz copper on outer layers plus 1 oz inner, the CTBGA dissipates up to 0.8 W without exceeding the 70 C/W theta-JA thermal envelope.
Do not bypass the secure-boot ROM in production firmware - the immutable boot ROM is mandatory for PCI PTS certification, and skipping it invalidates the secure chain. Ensure the tamper-pin mesh covers the entire PCB perimeter with no gaps larger than 1 mm; the MAX32550 compares mesh-impedance against an internal reference and erases the encrypted NVSRAM on mismatch. The CTBGA is moisture-sensitive (MSL3) - bake at 125 C for 24 hours before assembly if the sealed bag has been open longer than the floor-life.
The MAX32550-LCS+T has a maximum junction temperature of 105 C (industrial). With the 121-CTBGA's theta-JA of approximately 31 C/W on a 4-layer JEDEC test board, the chip can dissipate up to 2.5 W continuously. For a chip-and-PIN terminal that runs only intermittently at full crypto load, this is comfortable; for an mPOS dongle with sustained RSA operations, attach a small copper pad or thermal-via array under the exposed die pad to keep Tj below 85 C.
Compliance Information
RoHS compliance confirmed by DigiKey listing; REACH and halogen-free status not stated in retrieved data and left as unknown.
