MC68360AI33L - 33 MHz QUICC 32-Bit MPU | NXP FQFP-240
MPN: MC68360AI33L ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.75 | $21,750.00 |
MC68360AI33L Overview
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system. Within the broader semiconductor hierarchy, an MPU sits above a microcontroller (MCU) in integration complexity - MPUs typically require external memory and peripherals, while MCUs integrate memory and peripherals on-chip. The MC68360 specifically belongs to the communications-controller subcategory of MPUs, optimized for telecom and datacom applications where multiple serial channels must be managed concurrently alongside general-purpose processing. Within that, the QUICC family is a derivative of the M68K architecture, with a 32-bit internal data path and a 32-bit external data bus.
Key features of the MC68360AI33L include four independent SCC channels supporting protocols such as HDLC, UART, BISYNC, and transparent modes; a RISC-based CPM that handles low-level protocol processing; an 8K x 8 dual-port RAM shared between the core and CPM; integrated DRAM refresh controller; 24-bit external address bus; and a low-power HCMOS process. The 33 MHz internal clock yields approximately 10 MIPS of integer performance, suitable for router, bridge, and remote-access equipment designs.
Architecturally, the device is a heterogeneous dual-processor SoC. The CPU32+ core handles OS and application code, while the CPM (a dedicated RISC engine) drives the SCCs, SMC, and timers. The two processors communicate via shared dual-port RAM and mailbox interrupts, allowing protocol handling to scale independently of the main CPU load.
Typical applications include ISDN routers, frame-relay access devices, telecom control boards, industrial serial concentrators, and legacy M68K-based embedded systems. The wide peripheral integration reduces external glue logic for multi-channel serial designs.
A key design consideration when using the MC68360AI33L is the timing-sensitive FQFP-240 footprint: a 32x32 mm body with 0.5 mm pitch requires a 4-layer PCB minimum to maintain signal integrity on the external bus. Designers should also verify timing margins against the original QUICC reference manual rather than relying on second-source datasheet extracts.
This page synthesizes distributor stock status, lifecycle risk, and drop-in variants from the same MC68360 die family not found in the manufacturer datasheet alone.
Drop-in alternatives for MC68360AI33L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC68360AI33L (same form factor and footprint) — differing in Package, Core, Memory Controller, Mounting Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC68360AI25L
✅ Drop-In📋 Reference alternative (not in catalog)
KMC68360AI33L
✅ Drop-In📋 Reference alternative (not in catalog)
MC68360EM33L
✅ Drop-In📋 Reference alternative (not in catalog)
MC68360AI33LR2
✅ Drop-In📋 Reference alternative (not in catalog)
MC68360AI33
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC68360AI33L Maximum Ratings & Electrical Characteristics
| Core | CPU32+ (32-bit M68000 family) |
| Operating Frequency | 33 MHz |
| Core Count | 1 |
| Bus Width | 32-bit |
| Series | M683xx / QUICC |
| Package | 240-FQFP (32x32 mm) |
| Pin Count | 240 |
| SCC Channels | 4 |
| Communications Processor | RISC CPM |
| Dual-Port RAM | 8 KB |
| External Address Bus | 24-bit |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial, suffix 'I') |
| Lifecycle | End-of-Life / Last Time Buy |
MC68360AI33L 240-fqfp (32x32 mm) Pin Configuration Guide
Pin configuration for MC68360AI33L (240-fqfp (32x32 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC68360AI33L.
Refer to the datasheet for full pin configuration.
Typical Applications
MC68360AI33L is suitable for 6 applications: ISDN Router / Remote Access Equipment, Frame Relay / X.25 Access Concentrator, Industrial Serial Concentrator / Protocol Bridge, Legacy Telecom Control Card, Embedded M68K Evaluation / Industrial Control Platform, Obsolete System Sustainment / Spares Replacement.
ISDN Router / Remote Access Equipment
The MC68360AI33L's four hardware SCC channels and RISC CPM make it a strong fit for ISDN router designs where multiple serial WAN interfaces (PRI/BRI) and a LAN channel must be processed simultaneously. The 33 MHz CPU32+ core delivers approximately 10 MIPS for routing-table lookups, while the CPM offloads HDLC framing, CRC, and DMA at line rate. A typical reference design uses SCC1 for the BRI S/T interface, SCC2 for the LAN Ethernet port, and SCC3/SCC4 for async control channels, with the CPU32+ running the routing stack. Power dissipation in a typical 5V/33 MHz configuration is around 1.5-2 W, manageable with passive heatsinking in a sealed router enclosure.
Recommended
Frame Relay / X.25 Access Concentrator
Frame-relay access devices and X.25 PADs rely on multi-channel HDLC termination, a use case the MC68360AI33L's four SCCs address directly. Each SCC independently supports HDLC framing in hardware up to E1/T1 rates (2.048 Mbps / 1.544 Mbps), and the CPM's RISC engine executes the per-channel state machines without CPU32+ intervention. The 8 KB dual-port RAM provides sufficient buffer headroom for several LAPF/LAPB sessions at typical 64-1536 byte frame sizes. Industrial designers pair the part with external serial transceivers (e.g., DS2155 for T1/E1) and use the 24-bit address bus to access 8-16 MB of external DRAM for routing tables.
Recommended
Industrial Serial Concentrator / Protocol Bridge
Factory automation systems often require aggregating multiple serial protocols (Modbus RTU, PROFIBUS, custom RS-485) onto an Ethernet backbone. The MC68360AI33L can be configured with one SCC as 10 Mbps Ethernet uplink and the remaining three SCCs as RS-232/485 multipoint trunks, with the CPU32+ core running the protocol-conversion firmware. The wide operating temperature range of the AI (industrial) suffix (-40C to +85C) matches typical factory-floor requirements without derating. System integrators should pay attention to the 32x32 mm FQFP-240 footprint, which demands a 4-layer PCB and a moderate copper pour to keep junction temperature within limits under sustained CPM load.
Recommended
Legacy Telecom Control Card
Many legacy telecom central-office control cards from the late 1990s and early 2000s use the MC68360 family as the supervisory CPU, taking advantage of its RISC CPM for SS#7, ISDN D-channel, and V.24 control plane traffic. The MC68360AI33L's 33 MHz performance headroom is sufficient for control-plane processing at typical call-setup rates, while leaving the CPU32+ core available for OAM&P (operations, administration, maintenance, provisioning) tasks. Designers targeting this application should consult the QUICC microcode patch library for SS#7 support and ensure their board layout supports the JTAG boundary-scan chain required for factory programming.
Recommended
Embedded M68K Evaluation / Industrial Control Platform
The MC68360AI33L is also used in M68K-based industrial control platforms where a known architecture and long-term software stability matter more than raw throughput. Its similarity to the smaller MC68302 and MC68332 means engineers can reuse existing toolchains, RTOS ports (e.g., VxWorks, pSOS, Nucleus), and driver libraries across product lines. A typical control design pairs the MPU with 4-16 MB of external DRAM, 512 KB of boot Flash, and an Ethernet PHY on SCC2 for management traffic, with the remaining SCCs wired to industrial sensor buses. The AI industrial temperature grade and well-documented interrupt architecture make it a stable choice for 10+ year product lifecycles.
Recommended
Obsolete System Sustainment / Spares Replacement
A common use case for the MC68360AI33L is sustaining field-deployed equipment whose original production line has been retired. The part's 240-FQFP footprint and the broad ecosystem of NXP/Freescale/Motorola second-source parts (including AI25L and EM33L variants) allow service organizations to source replacements without board rework. For new designs, however, the End-of-Life status on the NXP product page makes the part unsuitable: NXP recommends migrating to PowerQUICC or ColdFire derivatives, which offer higher clock speeds, on-chip Ethernet MAC, and active lifecycle support. Stocking agencies typically reserve MC68360AI33L inventory for legacy spares rather than new deployments.
Recommended
Recommended Products Summary
Engineering reference data for MC68360AI33L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC68360AI25L | KMC68360AI33L | MC68360EM33L | MC68360AI33 |
|---|---|---|---|---|---|
| Package | 240-FQFP (32x32) | 240-FQFP (32x32) - same | 240-FQFP (32x32) - same | 240-FQFP (32x32) - same | 240-FQFP (32x32) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Operating Frequency | 33 MHz | 25 MHz (-24%) | 33 MHz | 33 MHz | 33 MHz |
| Core | CPU32+ | CPU32+ | CPU32+ | CPU32+ | CPU32+ |
| SCC Channels | 4 | 4 | 4 | 4 | 4 |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C (Industrial) | Military / KMC-screened | Extended commercial | -40C to +85C (Industrial) |
| Low-Power Halt/Loop Mode | Yes ('L' suffix) | Yes | Yes | Yes | No (non-L variant) |
| Lifecycle Status | End-of-Life / Last Time Buy | End-of-Life | End-of-Life | End-of-Life | End-of-Life |
Key Differentiators
- Highest available clock speed in the M68360 QUICC family (vs MC68360AI25L)
- Industrial temperature grade (-40C to +85C) for factory and outdoor deployments (vs MC68360EM33L)
- Low-power halt/loop mode for power-sensitive designs (vs MC68360AI33 (non-L))
Design Notes
The MC68360AI33L 240-FQFP package with 0.5 mm pin pitch demands a 4-layer PCB stackup (signal/ground/power/signal) to maintain controlled impedance on the 32-bit external data bus and 24-bit address bus. Per the QUICC hardware reference manual, place a solid ground plane directly beneath the package and keep bus traces short and matched. Designs that attempt 2-layer stackups typically fail timing closure above 25 MHz. Decoupling should include 100 nF ceramic capacitors at every VCC pin and bulk 10 uF tantalums near the package perimeter.
Do not assume the 'L' suffix only denotes low-power mode - it also signals the silicon revision and which CPM microcode patches are pre-loaded. Mixing 'L' and non-'L' revisions on the same firmware branch can cause subtle SCC timing differences. When migrating code from the MC68302 or MC68332, verify that the CPM interrupt vector layout matches the QUICC reference manual rather than relying on legacy code, because the CPM interrupt priorities differ from the older SIM (System Integration Module) used in the MC68302.
At 5V supply and 33 MHz, the MC68360AI33L dissipates approximately 1.5-2 W in typical operation, with peak dissipation up to 2.5 W when all four SCCs are running at full Ethernet line rate. The 240-FQFP package thermal resistance is approximately 25 C/W (theta_JA) on a 4-layer PCB, meaning junction temperature rises 50-62 C above ambient at full load. For sealed industrial enclosures with internal ambient of 60C, junction temperature can approach 120C - derate to 25 MHz operation or add a small heatsink if continuous full-SCC activity is expected.
Route the data strobe signals (DS, DSACK, BERR) as matched-length traces within the QUICC reference manual tolerances, typically +/-10 mm of the data bus length. Place external DRAM chips in line with the chip-select pins (CS0-CS7) to minimize address and data bus skew, and use series damping resistors (22-33 ohm) on the most heavily-loaded bus lines. The 32 kHz crystal oscillator reference (EXTAL/XTAL) traces should be kept short and guarded by a ground ring to avoid coupling CPM noise into the system clock.
Compliance Information
RoHS / REACH / lead-free status not explicitly stated in verified distributor data. The NXP product page indicates End-of-Life with PCN history; confirm material declaration via the latest NXP PCN before use in RoHS-regulated products. Not AEC-Q100 qualified - this part is a microprocessor, not an automotive analog/power IC.
