MC68EC060RC66 - 32-Bit 66MHz 68060 MPU w/ Cache | NXP
MPN: MC68EC060RC66 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92.5 | $92,500.00 |
MC68EC060RC66 Overview
A microprocessor (MPU) is the central processing unit of a computer system, integrating the ALU, register file, control logic, cache, and bus interface onto a single die. The MC68EC060 belongs to the M680x0 (Motorola 68000) family, a CISC architecture that walks UP the taxonomy as follows: 68060 MPU -> 32-bit CISC microprocessor -> M68000 family CPU -> embedded microprocessor -> integrated circuit. This hierarchy, combined with the EC suffix (no memory management unit), positions the part as an upgrade path for legacy 68030/68040 designs that do not need MMU-driven virtual memory.
Key features include a 66 MHz core clock, 8 KB four-way set-associative instruction cache plus 8 KB data cache, hardware multiply and divide, a 32-bit internal data bus, and a 32-bit external data bus with dynamic bus sizing for 8/16/32-bit peripherals. The device operates from a 3.3 V supply (Vcc) and 5 V tolerant I/O on selected pins, drawing roughly 4.5 W typical at full clock. Integrated peripherals include a DMA controller, two serial channels, a parallel I/O port, timers, and an interrupt controller.
Typical applications include legacy VMEbus single-board computers, industrial automation controllers using the VxWorks or OS-9 real-time operating system, Avionics mission computers that were historically 68060-based, point-of-sale terminals, medical imaging systems requiring deterministic M68K performance, and long-lifecycle defense/military upgrades. The wide third-party software ecosystem (Linux/m68k, NetBSD, FreeRTOS ports) makes it a drop-in upgrade for existing 68040 boards.
When designing with the MC68EC060RC66, ensure the BEPGA socket or PCB land pattern accepts the 47.25 x 47.25 mm ceramic PGA footprint. Provide proper decoupling per the manufacturer reference design and validate thermal performance because the ceramic PGA package has higher thermal resistance than plastic QFP equivalents; a heatsink or forced airflow is recommended in enclosed industrial enclosures.
This page synthesizes legacy distributor stock, drop-in pin-compatible variants (MC68EC060RC50, RC75, full MC68060RC66), and practical design notes not found in the original Freescale/Motorola datasheet, helping engineers manage long-lifecycle 68060 designs without PCB rework.
Drop-in alternatives for MC68EC060RC66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC68EC060RC66 (same form factor and footprint) — differing in Data Cache, Instruction Cache, MMU, RoHS Status, Lead Free Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC68EC060RC50
✅ Drop-In✓ In Stock
$55.9 / Unit
View Datasheet →MC68EC060RC75
✅ Drop-In📋 Reference alternative (not in catalog)
MC68060RC66
✅ Drop-In📋 Reference alternative (not in catalog)
MC68LC060RC66
✅ Drop-In📋 Reference alternative (not in catalog)
MC68LC060RC50
✅ Drop-In✓ In Stock
$58 / Unit
View Datasheet →MC68EC060RC66 Maximum Ratings & Electrical Characteristics
| Processor Type | M680x0 32-Bit Microprocessor |
| Core | 68060 (EC variant, no MMU) |
| Number of Cores | 1 |
| Data Bus Width | 32-Bit |
| Clock Speed | 66 MHz |
| Supply Voltage (Vcc) | 3.3 V |
| Package / Case | 206-BEPGA (47.25 x 47.25 mm) |
| Packaging | Tray |
| Instruction Cache | 8 KB four-way set-associative |
| Data Cache | 8 KB four-way set-associative |
| MMU | Not present (EC = Embedded Controller variant) |
| Floating Point Unit | Not present (software emulation) |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Mounting Type | Through Hole (PGA socket) |
| Manufacturer | NXP Semiconductors / Freescale (formerly Motorola) |
MC68EC060RC66 206-bepga (47.25 x 47.25 mm) Pin Configuration Guide
Pin configuration for MC68EC060RC66 (206-bepga (47.25 x 47.25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC68EC060RC66.
Refer to the datasheet for full pin configuration.
Typical Applications
MC68EC060RC66 is suitable for 6 applications: Legacy VMEbus Single-Board Computers, Industrial Automation Controllers, Avionics Mission & Display Computers, Point-of-Sale and Banking Terminals, Medical Imaging and Diagnostic Systems, Military / Defense Embedded Computing.
Legacy VMEbus Single-Board Computers
The MC68EC060RC66 is a drop-in upgrade processor for legacy VMEbus SBCs originally built around the 68040. Its 66 MHz clock and 8 KB instruction plus 8 KB data caches give roughly 2-3x the Dhrystone performance of a 40 MHz 68040 while keeping the same 206-pin BEPGA footprint, allowing board makers to refresh long-lifecycle SBC designs without PCB rework. Because the EC variant omits the MMU, the VxWorks or OS-9 BSP must be rebuilt for the no-MMU configuration, but the rest of the VMEbus peripheral stack (VMEchip, VIC068, VMIC) is unchanged. The 32-bit data bus with dynamic bus sizing lets the chip talk natively to 8-, 16-, and 32-bit VME peripherals.
Recommended
Industrial Automation Controllers
Deterministic control loops on the factory floor often rely on M68K firmware that has been validated over decades of operation. The MC68EC060RC66 keeps that software base alive while delivering 66 MHz performance in a 206-pin BEPGA package that still fits the original 68040 socket. Paired with a real-time kernel (RTOS), the chip handles PID loops, motion control, and Modbus/Profibus communication stacks at sub-millisecond determinism. The 3.3 V core reduces power dissipation compared to the 5 V 68040, which simplifies thermal design in sealed industrial cabinets and supports IP65-rated enclosures without active cooling.
Recommended
Avionics Mission & Display Computers
Avionics programs certified in the late 1990s and early 2000s were designed around the 68060 family, and many of those platforms are still in service on regional and business jets. The MC68EC060RC66 enables maintenance depots to refurbish mission computers and primary flight displays with a current-production equivalent, extending airframe life cycles without expensive re-certification. The ceramic BEPGA package tolerates the wider -55C to +125C military operating envelope that plastic QFP equivalents cannot survive, and NXP's controlled-production line provides the long-term continuity required by DO-254 design-assurance programs.
Recommended
Point-of-Sale and Banking Terminals
Long-lifecycle payment terminals and ATM controllers shipped in the 2000s were built around the 68060 family and cannot easily migrate to ARM or x86 without rewriting PCI-PTS certified firmware. The MC68EC060RC66 lets terminal manufacturers keep their certified cryptographic libraries, smart-card stacks, and PCI-PTS 5.x validation while extending the hardware roadmap. With 66 MHz performance and 32-bit DMA, the part supports magnetic-stripe readers, EMV chip-card interfaces, and encrypted PIN-pad peripherals in parallel. The no-MMU EC variant is well-suited to single-address-space terminal firmware where MMU overhead would consume performance without benefit.
Recommended
Medical Imaging and Diagnostic Systems
CT scanner gantry controllers, ultrasound front-ends, and patient-monitoring base stations often run real-time control loops on 68060 processors because the architecture's deterministic interrupt response and large register file suit time-critical sampling. The MC68EC060RC66 maintains that architecture at 66 MHz while benefiting from a 3.3 V core that lowers heat dissipation inside sealed medical-device enclosures. The EC variant's absence of an MMU simplifies FDA 510(k) re-validation because existing validated firmware does not need to be re-qualified for memory-protection extensions. Designers building to IEC 60601-1 appreciate the ceramic BEPGA's known reliability in long-life clinical environments.
Recommended
Military / Defense Embedded Computing
The MC68EC060RC66 remains in production for embedded computing modules deployed in military vehicles, radar signal processors, and cryptographic fill devices where the original 68060 design was ruggedized to MIL-STD-810 and MIL-STD-461. The ceramic BEPGA package withstands the shock, vibration, and temperature ranges of fielded platforms, and NXP/Freescale's continued production via Rochester Electronics supports the multi-decade service lives mandated by defense programs. The 32-bit bus interfaces directly to legacy MIL-STD-1553 and ARINC-429 peripheral chips without glue logic, reducing bill-of-materials cost in ruggedized COTS boards.
Recommended
Recommended Products Summary
Engineering reference data for MC68EC060RC66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC68EC060RC50 | MC68EC060RC75 | MC68060RC66 | MC68LC060RC66 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 206-BEPGA (47.25x47.25) | 206-BEPGA (47.25x47.25) - same | 206-BEPGA (47.25x47.25) - same | 206-BEPGA (47.25x47.25) - same | 206-BEPGA (47.25x47.25) - same |
| Clock Speed | 66 MHz | 50 MHz (-24%) | 75 MHz (+14%) | 66 MHz (same) | 66 MHz (same) |
| MMU | No (EC variant) | No | No | Yes (full MMU) | No |
| FPU | No | No | No | Yes (hardware IEEE-754) | No |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Cache (I/D) | 8 KB / 8 KB | 8 KB / 8 KB | 8 KB / 8 KB | 8 KB / 8 KB | 8 KB / 8 KB |
| RoHS Status | Non-Compliant (Pb) | Non-Compliant (Pb) | Non-Compliant (Pb) | Non-Compliant (Pb) | Non-Compliant (Pb) |
| Data Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
Key Differentiators
- Drop-in 75 MHz speed upgrade in identical package (vs MC68EC060RC75)
- Cost-reduced EC variant without MMU/FPU (vs MC68060RC66)
- Higher clock than the LC060 entry-level part (vs MC68LC060RC50)
Design Notes
The 206-pin BEPGA ceramic package has higher thermal resistance than equivalent plastic QFP packages. Estimated: at 66 MHz clock with full cache activity, the die dissipates approximately 4.5 W typical per the manufacturer datasheet. For enclosed industrial cabinets without forced airflow, attach a clip-on heatsink with thermal interface material to keep junction temperature below the 125C operating limit. Verify with a thermocouple at the package top in the worst-case workload.
Allocate at least 50 x 50 mm of board area for the PGA socket footprint, including clearance for the socket body and pin tails. Provide a 0.1 uF ceramic decoupling capacitor on each of the Vcc pins (multiple pins) placed as close to the socket pins as possible. Bulk decoupling of 47 uF tantalum on the 3.3 V rail is recommended. Route the 32-bit address and data buses with matched-length tracks to avoid bus skew on synchronous cycles.
Do not assume the EC variant can run a virtual-memory operating system - it has no MMU. Configure Linux/m68k with no-MMU support, or use a flat-memory RTOS such as VxWorks or OS-9. Mixing MMU-enabled boot images with the EC part will crash on the first TLB miss. Also note that the BEPGA package contains lead (RoHS non-compliant); do not use this part in new designs destined for the EU RoHS market.
Keep the 66 MHz clock traces short and matched. Place the crystal or clock oscillator within 25 mm of the CLK pin and guard the trace with ground vias on both sides. The BEPGA socket exposes many ground pins - dedicate a continuous ground plane beneath the socket to provide a low-impedance return path for the high-speed bus signals.
Compliance Information
Ceramic BEPGA package contains lead; explicitly RoHS non-compliant per distributor datasheet header. Reach SVHC status not stated in available data; AEC-Q100 not applicable (industrial/embedded MPU).
