MC9S12HZ256VAL - 16-bit HCS12 MCU, 256KB Flash, LQFP-112 | NXP
MPN: MC9S12HZ256VAL ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 250 | $20 | $5,000.00 |
| 500 | $18.4 | $9,200.00 |
MC9S12HZ256VAL Overview
The HCS12 (also called S12) is a 16-bit CISC microcontroller core originally developed by Motorola and continued by Freescale and NXP. It belongs to the broader M68HC12 family and sits within the MCU hierarchy as: HCS12 core -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The HCS12 instruction set is upward-compatible with the HC11 and adds native multiply, fuzzy logic, and table-interpolation instructions commonly used in real-time automotive control loops. Compared with ARM Cortex-M parts, the HCS12 offers deterministic interrupt latency and a mature peripheral toolchain that remains entrenched in automotive instrumentation.
Key features of the MC9S12HZ256VAL include 256 KB of Flash, 12 KB of RAM, 4 KB of EEPROM, an integrated motor-control PWM (MC) module with up to 24 high-current drive outputs for up to six stepper motors, multiple stepper stall detectors (SSD) for closed-loop pointer calibration, an SCI/SPI/IIC communication block, a 16-channel 10-bit ADC, and CAN 2.0 interfaces. The MC module is a defining feature of the MCS12H family and is purpose-built for instrument-Cluster gauge driving, where each gauge pointer is moved by a small stepper motor that the MC module can command directly without intermediate driver ICs.
Typical applications include automotive instrument clusters (speedometer, tachometer, fuel, temperature gauges), body controllers, HVAC control panels, and industrial stepper-motor control boards. The 256 KB Flash and 50 MHz bus frequency provide enough headroom for CAN-based diagnostics, OBD-II stacks, and graphics-on-LCD variants when paired with an external display controller.
When designing with the MC9S12HZ256VAL, allocate adequate PCB ground for the 112-pin LQFP thermal pad and follow NXP's EMC layout guidelines for the CAN bus to meet automotive transient immunity requirements. The part is in NXP's product-change-notice / end-of-life flow per the NXP product page, so engineers should confirm long-term availability before starting new programs.
Drop-in alternatives for MC9S12HZ256VAL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S12HZ256VAL (same form factor and footprint) — differing in Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S912XHY256F0MLM
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12HZ256VAA
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S12HZ256CAG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S12HZ256VFM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S12XHY256F0MLM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S12HZ256VAL Maximum Ratings & Electrical Characteristics
| Core | HCS12 (S12), 16-bit CISC |
| Program Memory | 256 KB Flash |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Maximum CPU Bus Frequency | 50 MHz |
| Supply Voltage | 2.5 V / 5 V |
| Operating Temperature | -40C to +105C |
| Package | 112-pin LQFP (20 x 20 mm) |
| Mounting Type | Surface Mount |
| Automotive Qualification | AEC-Q100 |
| Motor Control (MC) Module | Up to 24 high-current outputs (six stepper motors) |
| Stepper Stall Detector (SSD) | Up to 4 channels |
| ADC | 10-bit, 16 channels |
| Communication Interfaces | CAN 2.0, SCI, SPI, IIC |
| RoHS Status | Compliant |
MC9S12HZ256VAL 112-pin lqfp (20 x 20 mm) Pin Configuration Guide
Pin configuration for MC9S12HZ256VAL (112-pin lqfp (20 x 20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC9S12HZ256VAL.
Refer to the datasheet for full pin configuration.
Typical Applications
MC9S12HZ256VAL is suitable for 6 applications: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Panel, Industrial Stepper-Motor Control Board, Automotive Infotainment Auxiliary Display, Power-Train Sensor Interface Module.
Automotive Instrument Cluster
The MC9S12HZ256VAL is purpose-built for automotive analog and hybrid instrument clusters driving six gauge pointers directly from its MC module. With 256 KB Flash, 12 KB RAM, and four stepper stall detectors (SSD) for closed-loop pointer reset calibration, the MCU can command speedometer, tachometer, fuel, and temperature gauges without external driver ICs. The AEC-Q100 qualification and -40C to +105C temperature range satisfy under-dash environmental requirements, while CAN 2.0 plus SCI/SPI/IIC enable OBD-II diagnostics and cluster-to-body network communication. The 50 MHz HCS12 bus gives real-time headroom for CAN stack, gauge update, and backlight PWM tasks simultaneously.
Recommended
Body Control Module (BCM)
In body-controller ECUs, the MC9S12HZ256VAL acts as the central MCU coordinating lighting, wipers, door locks, and accessory controls. Its 256 KB Flash accommodates BCM firmware plus CAN diagnostics, and 4 KB EEPROM stores configuration and trim data. The CAN 2.0 channel links the BCM to the powertrain and cluster networks, while the 16-channel 10-bit ADC reads multiplexed switch inputs. HCS12's deterministic interrupt latency simplifies the BCM scheduler, and the LQFP-112 footprint leaves room for multiple CAN transceivers and high-side drivers on the same PCB.
Recommended
HVAC Control Panel
The MC9S12HZ256VAL suits HVAC human-machine interface panels where a 16-bit MCU drives LCD segments, reads rotary encoder inputs, and talks CAN to the HVAC ECU. Its 256 KB Flash stores the climate-control state machine and CAN diagnostics stack, and 12 KB RAM supports small graphical frame buffers. AEC-Q100 qualification ensures reliable operation across the cabin thermal range, while the 50 MHz HCS12 bus executes debounce, encoder, and CAN tasks in real time. The LQFP-112 pin budget accommodates the LCD segment bus plus PWM fan-control outputs.
Recommended
Industrial Stepper-Motor Control Board
Outside automotive, the MC9S12HZ256VAL can drive up to six stepper motors in industrial positioning or small-CNC control boards, replacing a discrete MCU plus external stepper-driver ICs. The MC module's 24 high-current outputs handle bipolar stepper windings directly, while the four SSD channels detect stall events for closed-loop homing. The 256 KB Flash fits motion-planning firmware, and the CAN interface serves as an industrial bus for multi-axis synchronization. The LQFP-112 footprint simplifies layout on standard 4-layer industrial PCBs.
Recommended
Automotive Infotainment Auxiliary Display
The MC9S12HZ256VAL can serve as the auxiliary-display controller for entry-level infotainment systems that show HVAC, audio, and trip information on a small TFT or segment LCD. The 256 KB Flash holds graphics libraries and CAN-based vehicle-data parsing, while the SPI channel drives the display controller. CAN 2.0 plus SCI/SPI/IIC provide multiple bus options for connecting to the head unit, and the AEC-Q100 qualification keeps the design compliant with OEM automotive EMC requirements.
Recommended
Power-Train Sensor Interface Module
For powertrain-adjacent sensor-interface modules, the MC9S12HZ256VAL provides 16 channels of 10-bit ADC for analog sensor aggregation plus CAN 2.0 to forward processed data to the ECU. Its 256 KB Flash supports calibration tables for temperature, pressure, and position sensors, while the 50 MHz HCS12 bus processes multi-sensor data with deterministic latency. The AEC-Q100 grade and -40C to +105C operating range are required for engine-bay-adjacent modules.
Recommended
Recommended Products Summary
Engineering reference data for MC9S12HZ256VAL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S912XHY256F0MLM | MC9S12HZ256VAA | MC9S12HZ256CAG | MC9S12HZ256VFM | MC9S12XHY256F0MLM |
|---|---|---|---|---|---|---|
| Package | LQFP-112 (20x20 mm) | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (16-bit, 50 MHz) | HCS12 (16-bit, 50 MHz) | HCS12 (16-bit, 50 MHz) | HCS12 (16-bit, 50 MHz) | HCS12 (16-bit, 50 MHz) | HCS12X with XGATE (16-bit, 50 MHz) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Stepper Outputs (MC module) | 6 steppers / 24 high-current outputs | 6 steppers / 24 outputs | 6 steppers / 24 outputs | 6 steppers / 24 outputs | 6 steppers / 24 outputs | 6 steppers / 24 outputs |
| Stall Detector (SSD) | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +125C (industrial) | -40C to +105C | -40C to +105C |
| Lifecycle / Family Status | NRND / EOL flow | Active - recommended for new designs | NRND - last-time-buy | NRND | NRND | Active |
Key Differentiators
- Integrated motor-control module for 6 stepper motors (vs Generic 16-bit MCUs without MC module)
- On-chip stepper stall detection (4 SSDs) (vs MCUs requiring mechanical or optical stall feedback)
- AEC-Q100 automotive qualification with -40C to +105C range (vs Industrial-only 16-bit MCUs)
- 256 KB Flash with same LQFP-112 footprint as successor (vs S912XHY256F0MLM)
Design Notes
The MC9S12HZ256VAL requires both a 5 V analog supply (VDDA) and a 2.5 V core-derived supply generated internally; for best ADC performance, decouple VDDA with a 10 uF tantalum + 100 nF ceramic pair within 5 mm of the pin. Place a ferrite bead between the 5 V digital rail (VDDR) and VDDA to keep digital switching noise out of the ADC reference. NXP's MC9S12HZ256 reference design provides a tested BOM for the supply network.
LQFP-112 (20 x 20 mm) has a junction-to-ambient thermal resistance around 45-55 C/W on a standard 4-layer JEDEC test board. Estimated: at 50 MHz with all peripherals enabled and 6 stepper motors driven at typical cluster duty cycles, internal dissipation stays well under 1 W so no heatsink is required; however, ensure copper pour covers the LQFP-112 thermal pad area and provides at least 4 thermal vias to the inner ground plane.
Route the CANH/CANL pair as a 120-ohm-impedance differential pair with no stubs, and place the TJA105x CAN transceiver within 25 mm of the MC9S12HZ256VAL's CAN pins. Keep the analog inputs (AN0..AN15) away from the MC module high-current outputs and from switching regulator nodes. NXP's MC9S12HZ256 datasheet section 12 (Pinout and Packaging) provides the canonical reference PCB land pattern.
Do not confuse the MC9S12HZ256VAL (LQFP-112) with the MC9S12XDT256VAA (80-QFP) - they are not pin-compatible and the MC peripheral count differs. Always verify the suffix: VAL = LQFP-112 automotive cluster ordering code, while VPVE / VFM / CAG suffixes map to other packages or temperature grades. Confirm the part number against NXP's PCN list before committing to long production runs, since MC9S12HZ256VAL is in the EOL flow as of 2026-10-17.
For clusters where the stepper motor leads are routed across the PCB, add small RC snubbers (100 ohm + 1 nF) at each MC output to suppress ringing that could couple into the ADC channels. The 10-bit ADC achieves the rated ENOB only when input bandwidth is limited to ~1 MHz; place a 1 kHz first-order RC low-pass filter on each ANx input if the source impedance is above 10 kohm.
Compliance Information
AEC-Q100 qualified per NXP product page and DigiKey parametric listing. RoHS and REACH compliant per NXP environmental documentation. Halogen-free status not explicitly stated in the verified web data - left as 'unknown'. Part is in NXP Product Change Notice / End-of-Life flow as of 2026-10-17.
