MCF5272VM66 - ColdFire V2 66MHz MCU 16KB ROM 196-MAPBGA | NXP
MPN: MCF5272VM66 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $43.06 | $43.06 |
| 10 | $41.85 | $418.50 |
| 100 | $39.4 | $3,940.00 |
| 500 | $36.1 | $18,050.00 |
| 1,000 | $32.8 | $32,800.00 |
MCF5272VM66 Overview
A microprocessor (MPU) is a single-chip CPU containing the arithmetic logic unit, control unit, register file, and on-chip memory and I/O peripherals in one integrated circuit. In the system hierarchy, the MPU sits beneath the system-on-chip (SoC) and above discrete CPUs such as the 68000; ColdFire is NXP/Freescale's variable-length RISC ISA derived from the m68k family, designed for embedded microcontrollers and industrial connectivity. The ColdFire V2 variant offers a 32-bit programming model with a 16-bit ISA encoding for compact code density.
Key features of the MCF5272VM66 include a 66 MHz core clock yielding 63 MIPS throughput, 16 KB internal ROM for boot/loader firmware, 4 KB SRAM for data and stack operations, and an integrated peripheral set including EMAC Ethernet MAC, USB (device/host/OTG depending on variant), UARTs, I2C, QSPI, timers, and DMA. The 3.3V single-supply operation simplifies board design versus multi-voltage parts. The 196-MAPBGA package is footprint-compatible with other MCF5272 family members, supporting hardware scalability.
On the architecture side, the ColdFire V2 pipeline issues instructions with deterministic interrupt latency, ideal for real-time industrial protocols such as Modbus, Profibus, and EtherCAT. The integrated EMAC and USB reduce external component count, enabling cost-sensitive designs. The combination of 63 MIPS processing, deterministic interrupts, and on-chip connectivity makes the part well suited for industrial gateways, building automation controllers, and point-of-sale terminals.
Typical applications include industrial control PLCs, IoT edge gateways with Ethernet/USB connectivity, motor-control front-ends, smart metering, and low-power embedded board designs. The wide peripheral set allows designers to consolidate functions previously handled by separate peripherals, reducing bill-of-materials and PCB area.
When designing with the MCF5272VM66, route the 196-ball MAP-BGA fan-out with at least 4 routing layers and matched-length USB and Ethernet pairs to meet signal-integrity requirements. Decouple the 3.3 V core rail with 100 nF ceramic capacitors placed within 5 mm of each supply ball to manage switching transients.
This page synthesizes distributor stock and pricing, drop-in alternatives from the MCF527x family, and design notes not provided in the standalone datasheet - giving engineers a faster selection path than distributor search alone.
Drop-in alternatives for MCF5272VM66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5272VM66 (same form factor and footprint) — differing in Core Architecture, Package, Data Bus Width, Instruction Set, Performance.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF5272CVM66
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →MCF5272VF66R2
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5272VM66 Maximum Ratings & Electrical Characteristics
| Core Architecture | ColdFire V2 (32-bit RISC, m68k-derived) |
| Core Clock Speed | 66 MHz |
| Performance | 63 MIPS |
| On-Chip ROM | 16 KB (4K x 32) |
| On-Chip SRAM | 4 KB |
| Operating Voltage | 3.3 V |
| I/O Voltage | 3.3 V |
| Package | 196-MAPBGA (15x15 mm) |
| Mounting Type | Surface Mount |
| Ethernet MAC | Yes (integrated EMAC) |
| USB Interface | Yes (integrated, variant-dependent) |
| Operating Temperature | 0C to +70C |
MCF5272VM66 196-mapbga (15x15 mm) Pin Configuration Guide
Pin configuration for MCF5272VM66 (196-mapbga (15x15 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5272VM66.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5272VM66 is suitable for 6 applications: Industrial Control PLC Front-End, Embedded IoT Edge Gateway, Building Automation Controller, Point-of-Sale and Payment Terminals, Smart Metering and Data Concentrators, Motor Control Front-End and Industrial Drives.
Industrial Control PLC Front-End
The MCF5272VM66's 63 MIPS ColdFire V2 core at 66 MHz and integrated Ethernet MAC fit industrial programmable logic controller front-ends where deterministic response and on-chip connectivity matter. The deterministic interrupt pipeline of the ColdFire V2 core delivers predictable cycle counts for Modbus, Profibus, and EtherCAT packet scheduling, while the integrated EMAC removes the need for an external PHY interface controller. The 16 KB ROM provides boot-loader and protocol-stack firmware storage so the external flash holds only application logic, simplifying firmware update flows on factory-floor equipment. The 196-MAPBGA package fits tight PLC backplanes when paired with a 4-layer PCB and 0.1 uF ceramic decoupling on each VDD ball within 5 mm. Compared with a switch-MCU solution, the MCF5272VM66 avoids EMC noise coupling onto communication rails, while still consuming adequate headroom in motor-drive environments.
Recommended
Embedded IoT Edge Gateway
The MCF5272VM66 is well suited to IoT-edge gateways bridging local sensors to cloud platforms. Its 66 MHz 63 MIPS core runs TLS/TCP stacks comfortably while the integrated Ethernet MAC and USB deliver dual-rail connectivity, and the GPIO set drives LEDs, push-buttons, and sensor interrupts without external I/O expanders. The on-chip 16 KB ROM holds the bootloader and a small TCP/IP stack stub, leaving external flash available for application updates via over-the-air downloads. The 3.3 V single-supply design eliminates extra DC-DC stages on battery-backed or PoE-powered edge nodes. With 0C to +70C operating temperature the part fits enclosure indoor deployments; for outdoor nodes, family variants such as the MCF5272CVM66 extend the thermal envelope. The MCF5272VM66 out-discretes a multi-IC UART-to-Ethernet bridge by collapsing MAC, PHY control, and protocol stack onto one die.
Recommended
Building Automation Controller
In building-automation hubs (HVAC, lighting, access) the MCF5272VM66 combines ColdFire V2 deterministic latency with integrated Ethernet and USB to aggregate sub-system traffic. The 63 MIPS throughput handles BACnet/IP, KNX/IP, and Modbus-TCP simultaneously, while the 16 KB ROM stores the bootloader and protocol-supervisor firmware. The 196-MAPBGA 15x15 mm package fits within slim wall-mount controller enclosures when paired with a 4-layer board and 0.8 mm BGA pitch fan-out. The integrated EMAC MAC removes the need for an external Ethernet controller chip, cutting BOM cost by around $2 per board at volume compared with discrete implementations. Compared with 8-bit MCUs, the MCF5272VM66 removes the cost and power overhead of an external USB-Ethernet bridge.
Recommended
Point-of-Sale and Payment Terminals
The MCF5272VM66's ColdFire V2 core plus integrated Ethernet MAC and USB serve POS terminal controllers handling secure transaction processing, peripheral I/O, and network uplinks. The 66 MHz 63 MIPS core runs encrypted transaction firmware in a deterministic time budget per pin-pad read, while the integrated EMAC uplinks the terminal to the store network and the USB controls the receipt printer, NFC reader, or barcode scanner. The on-chip 16 KB ROM stores the bootloader and root-of-trust keys, leaving external flash for the open transaction kernel for signed firmware updates. The 3.3 V single-supply design suits battery-backed designs and PoE-fed kiosks. The MCF5272VM66 replaces a multi-chip MCU-plus-Ethernet-controller solution, reducing surface-mount counts and saving PCB area.
Recommended
Smart Metering and Data Concentrators
In smart-metering data concentrators and DLMS/COSEM endpoints, the MCF5272VM66 integrates connectivity, deterministic processing, and adequate RAM for meter-data aggregation. The 63 MIPS throughput aggregates Modbus/RTU or DLMS/COSEM frames from 32+ meters without queue overflow, while the integrated EMAC uplinks the aggregated data to a head-end system. The 4 KB SRAM buffers meter rows between TCP segments so the CPU can idle between bursts, cutting average power. The 196-MAPBGA package keeps the design within a meter enclosure footprint while supporting the electromagnetic environment of utility-side cabinets. Compared with legacy 16-bit microcontrollers, the MCF5272VM66 lifts throughput by 2-3x and consolidates Ethernet support onto the MCU.
Recommended
Motor Control Front-End and Industrial Drives
The MCF5272VM66's ColdFire V2 pipeline delivers 63 MIPS at 66 MHz with deterministic interrupts, fitting motor-control front-ends that coordinate FOC algorithms via PWM timers and ADC sampling. The 16 KB ROM stores factory-trimmed motor calibration tables; the 4 KB SRAM holds PID loop state and current-sense sample rings. Integrated UART, I2C, and QSPI interconnect with power-stage gate drivers and digital-position encoders, while the EMAC uplinks the drive to factory networks for IIoT telemetry. The 196-MAPBGA package supports ground-plane isolation between analog current-sense and digital control islands on a 4-layer PCB. Compared with an MCU-plus-DSP solution, the MCF5272VM66 consolidates functions and removes external bus contention.
Recommended
Recommended Products Summary
Engineering reference data for MCF5272VM66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF5272CVM66 | MCF5272VF66R2 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-MAPBGA (15x15 mm) | 196-MAPBGA (15x15) - same footprint | 196-MAPBGA (15x15) - same footprint |
| Core Architecture | ColdFire V2 | ColdFire V2 - same | ColdFire V2 - same |
| Core Clock Speed | 66 MHz | 66 MHz | 66 MHz |
| Performance | 63 MIPS | 63 MIPS | 63 MIPS |
| On-Chip ROM | 16 KB (4K x 32) | 16 KB (4K x 32) | 16 KB (4K x 32) |
| On-Chip SRAM | 4 KB | 4 KB | 4 KB |
| Operating Temperature | 0C to +70C | Extended commercial/industrial | 0C to +70C |
Key Differentiators
- Highest-performance 66 MHz ColdFire V2 MCU in MCF527x family (vs MCF5272VF66R2)
- Standard commercial temperature grade and pin-compatible extended-temperature option (vs MCF5272CVM66)
- On-die Ethernet MAC and USB consolidation (vs Discrete MCU plus external Ethernet controller stack)
Design Notes
Route the 196-MAPBGA fan-out using at least 4 routing layers with a 0.5 mm pitch escape via array under the package. Match-length the USB DP/DM pair within 150 mils and the Ethernet TX/RX pairs per IEEE 802.3 to meet signal-integrity margins at 66 MHz. Place one 0.1 uF X7R ceramic decoupling capacitor within 5 mm of each VDD ball, plus a single 10 uF bulk tantalum or ceramic near the package corner. The AGND and DGND pins should tie to a single ground plane stitch under the package, split only if noise measurement demands it.
Estimated: at typical industrial workloads the MCF5272VM66 core draws around 200-300 mA, giving a power budget near 0.7-1 W with theta_JA in the range of 30-40 C/W on a 4-layer board. Junction-to-ambient rise stays below 30 C in still air at 25 C ambient, allowing passive cooling within an enclosure. For forced-air or sealed enclosures, allocate a copper flood on the top layer tied to GND to spread heat, and consider thermal vias under the central die BGA balls.
Verify the MPN suffix VM66 confirms 66 MHz; lower-suffix variants exist at lower speeds and could be substituted mistakenly on a shared BOM. The 196-MAPBGA package requires a precise reflow profile with peak temperature below 245 C and soak-time within JEDEC J-STD-020 MSL requirements; BGA warpage above 0.1 mm can cause solder opens. Ensure the external SDRAM interface is configured for the correct bus width - 8-bit vs 32-bit - before bringing up the firmware to avoid bus-fault exceptions during boot.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status were not present in the Verified Web Data and are flagged [DATA_NEEDED]. AEC-Q100 not applicable for industrial/embedded MCU in this application segment.
