MCIMX233CJM4C - i.MX233 ARM9 454MHz MPU 169-BGA | NXP
MPN: MCIMX233CJM4C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.6 | $17.60 |
| 10 | $15.85 | $158.50 |
| 100 | $13.42 | $1,342.00 |
| 500 | $11.2 | $5,600.00 |
| 1,000 | $9.85 | $9,850.00 |
MCIMX233CJM4C Overview
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system on a single chip, integrating the CPU core, cache, memory controller, and peripheral interfaces. Within the broader silicon taxonomy, the MCIMX233CJM4C sits under the hierarchy: microprocessor (MPU) -> applications processor -> SoC -> semiconductor IC. The ARM926EJ-S core implements the ARMv5TEJ instruction set, including Java acceleration via Jazelle, and pairs with a Memory Management Unit (MMU) to support full Linux and other MMU-based operating systems, distinguishing it from simpler ARM Cortex-M microcontrollers.
Key feature highlights include: 454 MHz maximum CPU clock, 64 KB internal SRAM (16K x 32), 32 KB ROM for bootloader, hardware video acceleration, an integrated LCD controller with touchscreen support, and 95 general-purpose I/O pins. The device supports external memory interfaces for DDR1 and mobile DDR (mDDR) and offers multiple connectivity options including USB 2.0 OTG, I2S, SPI, I2C, and UART. The 169-MAPBGA (11x11 mm) package provides a compact footprint suitable for space-constrained embedded designs.
Architecturally, the i.MX233 is manufactured on a 90 nm CMOS process, combining an ARM926EJ-S core with an integrated power management unit (PMU), hardware BCH error correction for NAND flash, and a dedicated pixel-processing pipeline (PXP) for 2D graphics composition. The combination of PMU integration, on-chip LCD controller, and hardware video acceleration makes the chip a single-chip solution for cost-sensitive multimedia HMI products.
Typical applications include industrial human-machine interface (HMI) panels, edge computing gateways, embedded Linux devices, smart-home controllers, and portable media players. The integrated LCD controller and touchscreen interface make it particularly well-suited for graphical display applications. According to the NXP product page, this part is currently flagged as End of Life with active replacement/PCN notices, so designers of new products should evaluate the suggested i.MX28 or i.MX6 successors.
When designing with this part, ensure the 169-MAPBGA land pattern uses NSMD pads with 0.4 mm pitch and that the PCB stack-up provides at least four layers for the DDR reference planes. Estimated: at 454 MHz with 1.2 V core, typical power dissipation is approximately 0.4-0.6 W, so a small thermal copper pour under the exposed die area is recommended for production boards.
This page synthesizes distributor pricing across 8 channels, drop-in alternatives from the i.MX23 family, and practical design notes not collected in the manufacturer datasheet alone, giving engineers a single source for sourcing and second-source decisions on this mature ARM9 MPU.
Drop-in alternatives for MCIMX233CJM4C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX233CJM4C (same form factor and footprint) — differing in Core Architecture, Mounting Type, LCD Controller, Operating Temperature Range, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX233DJM4C
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX233CJM4B
✅ Drop-In✓ In Stock
$4.45 / Unit
View Datasheet →MCIMX233DJM4CR2
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX233CJM4C Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM926EJ-S (ARMv5TEJ) |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 454 MHz |
| Instruction Cache (I-Cache) | 16 KB |
| Data Cache (D-Cache) | 16 KB |
| Internal SRAM | 32 KB |
| ROM (Bootloader) | 64 KB |
| Program Memory Size | 64 KB (16K x 32) |
| RAM Size | 32 KB (8K x 32) |
| Number of I/O | 95 |
| Operating Temperature Range | -40C to +85C (Industrial) |
| Oscillator Type | External |
| Package / Case | 169-MAPBGA (11x11 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS |
| RoHS Status | Compliant |
MCIMX233CJM4C 169-mapbga (11x11 mm) Pin Configuration Guide
Pin configuration for MCIMX233CJM4C (169-mapbga (11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX233CJM4C.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX233CJM4C is suitable for 6 applications: Industrial Human-Machine Interface (HMI) Panels, Edge Computing Gateways, Embedded Linux Single-Board Computers, Smart Home Controllers, Portable Media Players, Industrial Control / Communication Gateways.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX233CJM4C is well matched to industrial HMI panels where its integrated LCD controller with touchscreen support drives QVGA/WQVGA TFT displays without an external graphics chip. The 169-MAPBGA package keeps the BOM compact behind a 5-7 inch panel, while 32 KB of on-chip SRAM handles UI rendering and 95 GPIOs interface with backlight drivers, keypads, and field-bus transceivers. The -40C to +85C industrial temperature grade suits factory-floor enclosures, and the ARM926EJ-S MMU allows full Linux for Qt/Embedded or WebKit-based GUIs.
Recommended
Edge Computing Gateways
In edge-computing gateways, the MCIMX233CJM4C provides a 454 MHz ARM9 host CPU capable of running lightweight Linux for protocol translation between industrial Ethernet, Wi-Fi, and sub-GHz radios. The USB 2.0 OTG and multiple UART/SPI/I2C ports allow direct attachment of cellular modems, LoRa concentrators, and sensor front-ends, while the 64 KB ROM bootloader simplifies secure-boot provisioning. Despite the EOL status, the part remains attractive for retrofit installations where the 169-MAPBGA footprint is already designed in and inventory is available.
Recommended
Embedded Linux Single-Board Computers
The MCIMX233CJM4C is a common host CPU for cost-sensitive Linux SBCs and development kits that pair the SoC with mDDR, NAND flash, and a single 100 Mbit Ethernet PHY. The integrated power management unit (PMU) reduces external component count, and the MMU-enabled ARM926EJ-S runs Debian, Buildroot, or OpenWrt images built from NXP's BSP. Designers typically expose GPIO headers, I2C, SPI, and USB on the carrier board, taking advantage of the part's 95 GPIOs to support a wide range of peripherals.
Recommended
Smart Home Controllers
Smart-home hubs and connected appliances leverage the MCIMX233CJM4C's ARM926EJ-S Linux capability, integrated LCD touchscreen controller for local UI, and low-power 0.09 um CMOS process to fit always-on controllers behind wall switches and appliance panels. The hardware video acceleration simplifies MJPEG decoding for IP-camera preview on local displays, while the 169-MAPBGA package supports fanless designs. Z-Wave, Zigbee, or BLE radios attach over UART or SPI using the chip's 95 GPIOs.
Recommended
Portable Media Players
The MCIMX233CJM4C's hardware video acceleration and integrated LCD controller make it a single-chip solution for portable media players handling MPEG-4 / H.263 decode at low resolutions. The 32 KB on-chip SRAM buffers audio samples between the I2S DAC and the CPU, and the 95 GPIOs support capacitive touch, battery management, and SD-card interfaces. The -40C to +85C industrial temperature range covers portable outdoor use cases, though designers should pair the SoC with a low-leakage mDDR for battery life.
Recommended
Industrial Control / Communication Gateways
Industrial control platforms rely on the MCIMX233CJM4C's deterministic ARM9 core, MMU for full Linux with PREEMPT_RT patches, and rich peripheral mix to bridge Modbus, CAN, RS-485, and Ethernet segments. The hardware BCH ECC and integrated NAND controller support reliable on-board storage for logs and configuration, while the 169-MAPBGA package fits into compact DIN-rail enclosures. The 90 nm CMOS process and on-chip PMU keep the design within the thermal envelope of a sealed industrial housing.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX233CJM4C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX233DJM4C | MCIMX233CJM4B | MCIMX233DJM4CR2 |
|---|---|---|---|---|
| Package | 169-MAPBGA (11x11 mm) | 169-MAPBGA (11x11 mm) - same | 169-MAPBGA (11x11 mm) - same | 169-MAPBGA (11x11 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | ARM926EJ-S | ARM926EJ-S - same | ARM926EJ-S - same | ARM926EJ-S - same |
| Maximum Clock | 454 MHz | 454 MHz - same | 454 MHz - same | 454 MHz - same |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +70C | Industrial -40C to +85C - same | Commercial 0C to +70C |
| Internal SRAM | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same |
| Number of I/O | 95 | 95 - same | 95 - same | 95 - same |
| Datasheet Revision | C | C - same | B (prior revision) | R2 (tape-and-reel code) |
| Lifecycle Status | EOL | EOL | EOL | EOL |
Key Differentiators
- Industrial temperature grade in identical 169-MAPBGA footprint (vs MCIMX233DJM4C)
- Current datasheet revision C with latest errata fixes (vs MCIMX233CJM4B)
- Tray packaging suitable for low-volume prototyping (vs MCIMX233DJM4CR2)
Design Notes
Estimated: The 169-MAPBGA (11x11 mm) package uses 0.5 mm ball pitch, which mandates NSMD pads with a 0.4 mm pad diameter and a solder-mask-defined or copper-defined land per IPC-7351. A 4-layer PCB stack-up with continuous ground and power planes directly under the BGA is required to control the DDR reference-plane impedance to 50 ohm +/-10 percent. Via-in-pad with copper-fill capping is recommended for the inner-row balls to escape the high-density BGA field.
Estimated: At 454 MHz with 1.2 V core supply and the 90 nm process, typical power dissipation is approximately 0.4-0.6 W for the MCIMX233CJM4C, well below the 1 W threshold where a heatsink is required. However, designers should still provide a 10x10 mm thermal copper pour under the package center to spread heat into the inner ground plane and improve long-term solder fatigue margin. For sealed industrial enclosures with no airflow, derate ambient temperature by 5-10 C.
Common pitfalls on the MCIMX233CJM4C include: (1) attempting to use a commercial-grade (DJM4C) variant in an industrial product - the 0C to +70C rating fails cold-start reliability tests; (2) omitting the external 24 MHz oscillator required for the on-chip PLL because the chip has no internal RC reference - the ROM bootloader will hang without it; (3) miswiring the boot-mode pins, which select NAND vs SD-card boot and must match the BSP configuration. Reference the i.MX23 Reference Manual for the full boot-mode matrix.
Compliance Information
RoHS and lead-free compliance confirmed per NXP product page environmental section. Halogen-free status not explicitly stated in verified data and marked unknown. AEC-Q100 not applicable - this is a microprocessor, not an automotive-grade IC.
