MCIMX233CJM4B - i.MX23 ARM926EJ-S 454MHz MPU | NXP
MPN: MCIMX233CJM4B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.23 | $7.23 |
| 10 | $6.51 | $65.10 |
| 100 | $5.78 | $578.00 |
| 500 | $5.07 | $2,535.00 |
| 1,000 | $4.45 | $4,450.00 |
MCIMX233CJM4B Overview
An applications processor is a system-on-chip that combines a CPU core with application-specific peripherals and accelerators, sitting above microcontrollers in capability while remaining below full application processors in cost. The i.MX23 family extends Freescale's ARM9 portfolio and is positioned between low-end microcontrollers and higher-performance Cortex-A application processors such as the i.MX6 and i.MX8 lines, targeting connected audio, simple HMI panels, and industrial point-of-load control where battery life and BOM cost matter.
Key features highlighted by NXP and DigiKey include the integrated power management block, an ARM926EJ-S core with 16 KB instruction and 16 KB data caches, a 12-bit SAR ADC subsystem, an integrated LCD controller for small panels, USB 2.0 high-speed OTG, and on-chip audio codec support. The 169-MAPBGA package provides a compact footprint suitable for space-constrained boards while supporting the wide set of external interfaces required by industrial gateways and consumer AV accessories.
Typical applications include connected audio devices, simple industrial HMI panels, low-cost point-of-sale terminals, e-readers, and portable medical accessories. Designers choose the MCIMX233CJM4B when they need a Linux-capable MPU with integrated PMIC and audio paths but cannot justify the cost or power of newer Cortex-A5/Cortex-A7 based i.MX28 or i.MX6 Solo parts.
Drop-in alternatives for MCIMX233CJM4B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX233CJM4B (same form factor and footprint) — differing in Core Architecture, Mounting Type, Package, Data Cache, Integrated ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX233CJM4C
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →MCIMX233DJM4B
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →MCIMX233DJM4C
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX233CJM4A
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX233DAG4B
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX233CJM4B Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | i.MX23 |
| Core | ARM926EJ-S |
| Core Architecture | ARM9 |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 454 MHz |
| Package | 169-MAPBGA (11x11 mm) |
| Mounting Type | Surface Mount |
| On-chip Memory | 16 KB I-cache + 16 KB D-cache (per ARM926EJ-S) |
| Integrated ADC | 12-bit SAR ADC (per Freescale datasheet overview) |
| USB | USB 2.0 High-Speed OTG (per i.MX23 family feature) |
| Audio | Integrated analog audio paths and codec interfaces |
| LCD Controller | Integrated (per i.MX23 family) |
MCIMX233CJM4B 169-mapbga (11x11 mm) Pin Configuration Guide
Pin configuration for MCIMX233CJM4B (169-mapbga (11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX233CJM4B.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX233CJM4B is suitable for 6 applications: Connected Audio Devices, Industrial HMI Panels, Point-of-Sale Terminals, Portable Medical Accessories, E-Readers and Simple AV Accessories, Industrial Gateways and Protocol Bridges.
Connected Audio Devices
The MCIMX233CJM4B's integrated analog audio paths, ARM926EJ-S 454 MHz core, and on-chip power management make it well-suited to connected audio docks and streaming speakers. Engineers pair the processor with an external Wi-Fi module and a class-D amplifier; the integrated audio block eliminates a separate codec, shrinking the BOM. The 169-MAPBGA package supports compact enclosures, and the 12-bit ADC handles headphone-jack and button sensing. Software runs on Linux with ALSA, so audio routing and DSP effects stay in user space without taxing the limited MHz budget. Power-management integration lets the device enter low-power standby cleanly when the audio stream pauses, extending battery life in handheld wireless speakers versus designs using a discrete MPU plus external PMIC pair.
Recommended
Industrial HMI Panels
The MCIMX233CJM4B drives small industrial HMI panels up to WVGA via its integrated LCD controller while the ARM926EJ-S core runs a Linux or WinCE GUI stack. The integrated 12-bit ADC reads panel-front temperature sensors, button matrices, and 4-20 mA loop monitors through external signal conditioning, reducing component count. The 169-MAPBGA footprint supports sealed front-panel mounting and is paired with industrial-grade DDR/LPDDR memory. Designers leverage the integrated PMIC to meet IEC 61000-4-2 ESD and IEC 61000-4-4 EFT immunity by simplifying the power tree. The 454 MHz ARM9 pipeline is sufficient for static GUI screens, simple animations, and Modbus/Profibus protocol stacks in machine-control cabinets.
Recommended
Point-of-Sale Terminals
POS terminals based on the MCIMX233CJM4B leverage the integrated USB 2.0 High-Speed OTG, LCD controller, and 12-bit ADC to drive barcode scanners, thermal printers, and PIN-pad peripherals. The ARM926EJ-S runs a Linux POS application stack with encryption libraries for PCI-PTS-style key handling. The integrated power-management block supports battery-backed operation for mobile POS units, surviving brown-outs while writing to flash. The 169-MAPBGA 11x11 package keeps the motherboard small enough to fit inside handheld POS enclosures. Compared with discrete MPU plus external PMIC designs, the integrated approach lowers the BOM, simplifies FCC/CE pre-compliance testing, and reduces mean-time-to-repair in the field.
Recommended
Portable Medical Accessories
The MCIMX233CJM4B powers portable medical accessories such as glucose meters, pulse-oximetry add-on modules, and Bluetooth-connected spirometers where low-power ARM9 compute is enough and integrated analog blocks simplify the analog front end. The integrated 12-bit ADC samples sensor signals directly, the audio block supports tone-generation prompts, and the power-management block lets the device enter deep-sleep between measurements. The 169-MAPBGA 11x11 footprint fits handheld form factors. Designers pair the processor with a BLE module for smartphone pairing; the Linux BSP supports standard Bluetooth stacks. EOL status makes this part best suited to legacy platforms with long lifecycles already deployed in the field.
Recommended
E-Readers and Simple AV Accessories
E-readers and simple AV accessories from the i.MX23 era rely on the MCIMX233CJM4B's integrated LCD controller, USB OTG, and audio paths to deliver a low-power reading or media-playback experience. The ARM926EJ-S at 454 MHz drives e-paper refresh via SPI companions and runs a Linux reader stack. The 169-MAPBGA 11x11 package keeps the PCB small enough for thin reader enclosures. Integrated power management handles e-paper discharge waveforms and battery-charging without an external PMIC, lowering the BOM and simplifying FCC/CE certification. Designers favor this part when cost dominates over graphics performance; for richer media, migrate to i.MX6 Solo or i.MX7D designs.
Recommended
Industrial Gateways and Protocol Bridges
The MCIMX233CJM4B sits at the heart of industrial protocol-bridge gateways that translate between Modbus, CAN, and serial fieldbuses and an upstream Ethernet or Wi-Fi link. The ARM926EJ-S 454 MHz core runs lightweight TCP/IP stacks and protocol translators; the integrated USB OTG and multiple UARTs expose fieldbus peripherals. The integrated power-management block supports wide-input industrial 24V rails with on-chip DCDC, removing an external PMIC. The 169-MAPBGA package and its high-ball-count periphery fit into compact DIN-rail enclosures. The 12-bit ADC reads supply voltage and chassis temperature for health-monitoring telemetry; designers favor this MPU for cost-sensitive gateways that don't require the graphics or video engine of Cortex-A i.MX6/i.MX8 parts.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX233CJM4B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX233CJM4C | MCIMX233DJM4B | MCIMX233DJM4C | MCIMX233CJM4A | MCIMX233DAG4B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum Clock Frequency | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life |
| Integrated Power Management | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Drop-in C-revision alternative with same footprint (vs MCIMX233CJM4C)
- Extended temperature option within the same family (vs MCIMX233DJM4B)
- Integrates power management versus discrete MPUs (vs MCIMX283CJM4A (i.MX28 family))
Design Notes
The MCIMX233CJM4B in the 169-MAPBGA package requires careful PCB thermal management. Estimated: with a typical 0.5 W core dissipation at 454 MHz with DDR and peripherals active, the junction-to-ambient thermal resistance (theta_JA) of the 169-MAPBGA on a 4-layer JEDEC board is in the 20-30 C/W range. Apply a solid ground plane under the BGA and stitch vias through the thermal balls to the inner planes; place the device away from board edges to keep case temperature within industrial grade limits. Always consult the NXP hardware reference manual for the latest thermal design rules.
The 169-MAPBGA 11x11 footprint demands a 4-layer (minimum) PCB with microvia-in-pad or via-on-pad technology for clean BGA escape. Estimated: 0.4 mm ball pitch with 0.25 mm drill microvias is typical. Route the DDR/LPDDR signals first with matched lengths and reference to a continuous ground plane to meet timing on the ARM926EJ-S external memory bus. Keep analog audio and ADC traces short and away from switching DCDC nodes to preserve the integrated codec's SNR.
Although the MCIMX233CJM4B integrates a power-management block, several external bulk capacitors are still required on the DCDC outputs and the DDR reference rail. Estimated: 22 uF X5R ceramic plus a 100 nF decoupling cap per power pin pair is a typical starting point. Follow the NXP hardware reference manual's recommended capacitor matrix exactly; deviations can cause brown-out during peak CPU load because the integrated DCDC is sized for steady-state, not transient, conditions.
Do not assume the MCIMX233CJM4B is in production - the NXP product page lists it as End of Life with Discontinuance and Replacement notices. Before committing a new design, validate the BSP against the latest errata document and confirm with NXP that no further PCNs are pending. New designs should target the i.MX28 or i.MX6UL/ULL families, which are pin-compatible at the system level only after board rework and BSP migration.
Compliance Information
RoHS, REACH, lead-free, halogen-free and conflict-minerals status not stated in the verified web data. Request the latest material declaration from the distributor or NXP before volume purchase; most NXP BGAs from this era ship RoHS-compliant, but importers should verify.
