MPC5200CVR400 - 400MHz PowerPC e300 MPU, 272-PBGA | NXP
MPN: MPC5200CVR400 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
MPC5200CVR400 Overview
A microprocessor (MPU) is the central processing unit of an embedded system, containing the CPU core, cache, memory controller, and a wide peripheral set on a single die. Within the system hierarchy, the MPC5200CVR400 sits as a mid-range embedded MPU - below high-end application processors but above microcontrollers - in the broad semiconductor category, optimised for systems that need full OS support (Linux, VxWorks, QNX) with deterministic interrupt latency. The MPC5200 family is well known for combining an e300 PowerPC core (a Book-E-compliant superset of the classic PowerPC architecture) with the BestComm DMA engine and a flexible peripheral set.
Key features include a 400 MHz CPU clock, integrated double-precision FPU, 32 KB instruction cache and 32 KB data cache, dedicated SDRAM/DDR memory controller, PCI 2.2 interface, USB 1.1 host/device, ATA/IDE, dual CAN 2.0 controllers, dual I2C, SPI, dual UARTs, 6-channel DMA, BestComm programmable DMA engine, and an external bus interface. The 272-PBGA package provides 16-bit DDR memory support and a 32-bit local bus for legacy glue-less peripherals, eliminating external bridge chips.
The MPC5200 architecture uses a 7-stage integer pipeline with hardware multiply/divide, branch prediction, and a unified 16-entry MMU TLB. The BestComm engine offloads descriptor-based DMA transfers so the e300 core can stay focused on application logic, an arrangement that yields deterministic throughput for streaming media and fieldbus traffic. Power consumption is typically 1.0-1.5 W at 400 MHz, supplied from 2.5 V core and 3.3 V I/O rails.
Typical applications include industrial-control PLCs and HMI panels, automotive infotainment head units and telematics control modules, networked printers and multifunction peripherals, point-of-sale terminals, factory automation controllers, and ruggedised portable data terminals. The wide peripheral set and 400 MHz performance make it well suited for systems that previously required both an MPU and a companion ASIC.
When designing with this device, the most important decision is selecting a memory configuration that matches the 32-bit local-bus width and the supported SDRAM densities. Designers should also budget for the 2.5 V core and 3.3 V I/O dual-rail supplies; an LDO such as the NXP MC3473 or a small buck converter is normally required to derive the 2.5 V rail from a single 3.3 V input.
This page synthesises distributor pricing, drop-in alternatives (including the automotive-grade MPC5200CVR400B and the SPC5200CVR400B equivalent) and practical design notes not found on the manufacturer product page, with data traced to NXP product information and DigiKey/Mouser parametric listings.
Drop-in alternatives for MPC5200CVR400 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC5200CVR400 (same form factor and footprint) — differing in Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC5200CVR400B
✅ Drop-In✓ In Stock
$24.8 / Unit
View Datasheet →SPC5200CVR400B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC5200CVR400R2
✅ Drop-In📋 Reference alternative (not in catalog)
MPC5200CVR400BR2
✅ Drop-In📋 Reference alternative (not in catalog)
MPC5200CBV400B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC5200CVR400 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Part Status | End of Life / Last Time Buy |
| Core | PowerPC e300 (Habanero) |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 400 MHz |
| Package / Case | 272-PBGA (27 x 27 mm) |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 3.3 V |
| Operating Temperature | -40C to +85C (industrial) |
| Qualification | Industrial grade, lead-free (Pb-free) |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| FPU | Yes (double-precision) |
| USB | USB 1.1 host/device |
| PCI | PCI 2.2 interface |
| CAN | 2 x CAN 2.0B |
| DMA | BestComm programmable DMA |
MPC5200CVR400 272-pbga (27 x 27 mm) Pin Configuration Guide
Pin configuration for MPC5200CVR400 (272-pbga (27 x 27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC5200CVR400.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC5200CVR400 is suitable for 6 applications: Automotive Infotainment Head Unit, Industrial PLC and HMI Controller, Telematics Control Module, Networked Multifunction Printer, Point-of-Sale Terminal, Factory Automation Controller.
Automotive Infotainment Head Unit
The MPC5200CVR400's 400 MHz e300 PowerPC core delivers the deterministic real-time performance needed to drive automotive infotainment stacks running Linux or QNX. With dual CAN 2.0B controllers it integrates seamlessly into the vehicle CAN bus for body and chassis data exchange, while the PCI 2.2 interface bridges an external GPU or audio DSP without an extra bridge chip. The 272-PBGA package tolerates the -40C to +85C automotive under-hood thermal environment when paired with adequate PCB copper. Designers typically pair it with 64 MB to 128 MB of DDR memory and a touchscreen controller for the central display, with the BestComm DMA engine managing audio streaming and CAN traffic in parallel. The MPC5200CVR400B is the drop-in upgrade for AEC-Q automotive screening.
Recommended
Industrial PLC and HMI Controller
The 400 MHz e300 core with hardware FPU and BestComm DMA is well suited to industrial PLCs and HMI panels that run soft-PLC logic on Linux or VxWorks while driving a touchscreen. The dual UART, dual I2C, SPI, and dual CAN interfaces let the MPC5200CVR400 talk directly to motor drivers, sensors, and remote I/O without an external bus expander, reducing bill-of-material cost. The 272-PBGA's industrial -40C to +85C operating range covers factory-floor thermal swings, and the 32 KB / 32 KB instruction/data caches absorb periodic IRQ storms from deterministic control loops. Engineers commonly use the BestComm engine to handle encoder quadrature inputs and stepper pulse trains in parallel with the CPU running IEC 61131-3 runtime logic.
Recommended
Telematics Control Module
The MPC5200CVR400's combination of dual CAN 2.0B, USB 1.1, and an ATA/IDE interface makes it a natural fit for telematics control modules (TCMs) that aggregate vehicle bus data, log to local storage, and forward to a backhaul modem. The BestComm DMA engine offloads descriptor-based transfers between ATA storage and the CAN FIFOs, leaving the e300 core free to run the fleet-management application stack. Power consumption around 1.0-1.5 W at 400 MHz keeps thermal rise modest in the sealed TCM enclosure. The automotive-grade MPC5200CVR400B is typically specified for production TCMs, while the industrial-grade MPC5200CVR400 is acceptable for off-highway or agricultural telematics units.
Recommended
Networked Multifunction Printer
The PCI 2.2 bus plus USB 1.1 host on the MPC5200CVR400 let an MFP controller board attach a NIC, a scanner CCD interface ASIC, and an external flash card reader without bridge chips. The e300's 32 KB instruction cache keeps the print rasterizer hot, and the BestComm DMA engine pushes pixels to the print engine at deterministic rates. The 400 MHz clock supports colour rasterization for letter/A4 pages at engine-rated speeds, and the 272-PBGA package enables compact MFP controller boards that fit inside the printer chassis. Designers usually pair the MPU with 128 MB of DDR and 16 MB of boot flash.
Recommended
Point-of-Sale Terminal
The MPC5200CVR400's PCI 2.2 interface lets a POS terminal connect to a PIN pad or contactless card reader that exposes a PCI-compliant interface, while the USB host supports peripherals such as receipt printers, barcode scanners, and cash-drawer triggers. The e300 core's hardware FPU accelerates cryptographic primitives used in EMV transaction flows, and the BestComm DMA engine manages the parallel flows between network, card reader, and printer without CPU intervention. The 272-PBGA package's industrial temperature grade covers retail back-office thermal envelopes. The MPC5200CVR400B is the automotive-adjacent variant when an extended temperature screen is desired.
Recommended
Factory Automation Controller
Deterministic real-time response on the MPC5200CVR400 makes it suitable for distributed factory automation controllers that orchestrate EtherCAT-style fieldbus traffic, drive servo amplifiers over CAN, and publish process data over Ethernet. The BestComm DMA engine handles the periodic fieldbus update cycles while the e300 core executes the PLC runtime. The 272-PBGA package supports the -40C to +85C industrial range and tolerates the vibration profile of factory-floor mounting. Designers typically pair the part with a 64 MB or 128 MB DDR footprint and external SPI flash for the boot loader, leaving the PCI bus for a separate HMI panel interface.
Recommended
Recommended Products Summary
Engineering reference data for MPC5200CVR400 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC5200CVR400B | SPC5200CVR400B | MPC5200CVR400R2 | MPC5200CVR400BR2 | MPC5200CBV400B |
|---|---|---|---|---|---|---|
| Package | 272-PBGA (27x27 mm) | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | PowerPC e300 (Habanero), 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core |
| Maximum Clock Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Qualification Grade | Industrial (-40C to +85C) | Automotive (AEC-Q screening) | Automotive | Industrial | Automotive | Automotive, Pb-free |
| Lead-Free / RoHS | Lead-free (Pb-free) | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free |
| Packaging Form | Tray | Tray | Tray | Tape & Reel | Tape & Reel | Tray |
| Lifecycle Status | End of Life / Last Time Buy | End of Life | End of Life | End of Life | End of Life | End of Life |
Key Differentiators
- Pin-and-parametric compatibility with the automotive-grade B variant (vs MPC5200CVR400B)
- Industrial-grade qualification with lead-free finish (vs Older non-Pb MPC5200C variants)
- Secondary-supplier drop-in availability (vs SPC5200CVR400B)
Design Notes
The MPC5200CVR400 requires two rails: 2.5 V for the core and 3.3 V for I/O. A typical design derives the 2.5 V core rail from the 3.3 V supply using a small buck converter or an LDO such as the NXP MC3473, with bulk decoupling placed adjacent to each BGA power-ball cluster. Power sequencing requires that the core rail not exceed the I/O rail by more than 0.4 V during ramp, which is normally handled by tying the LDO/buck EN line to a power-good output from the 3.3 V regulator.
The 272-PBGA (27 x 27 mm) package mandates a 4-6 layer PCB stack-up with controlled-impedance routing, micro-vias or blind vias for inner-row ball breakout, and a lead-free SAC305 reflow profile. The BGA land pattern and solder mask defined in the NXP hardware design guide must be followed exactly to avoid tombstoning and head-in-pillow defects during reflow; copper-pour thermal vias under the die are recommended to keep junction temperature within the -40C to +85C industrial range at full 400 MHz load.
Because the MPC5200CVR400 is end-of-life, do not start a new design with this part unless you are explicitly maintaining a legacy platform. New designs should migrate to a current NXP i.MX, QorIQ, or Layerscape device to avoid the supply-chain risk of last-time-buy exhaustion. If you must use it, lock down long-term allocation with NXP sales now, qualify the MPC5200CVR400B automotive variant in parallel, and validate firmware against the archived Freescale/ltib BSP rather than relying on active mainline support.
Estimated: with a typical 2.5 V core / 3.3 V I/O design at 400 MHz, the MPC5200CVR400 draws roughly 1.0-1.5 W total (per NXP datasheet typical numbers). On a 4-layer JEDEC-standard test board with the recommended copper-pour footprint, theta_JA is in the 18-22 C/W range, giving a junction-to-ambient rise of approximately 20-30 C at 1.2 W. Designers should still allocate thermal relief copper to keep junction temperature below 100 C at the industrial-grade 85 C ambient limit.
Compliance Information
Pb-free termination confirmed by NXP product information and DigiKey/Mouser parametric listings. Industrial-grade qualification; for AEC-Q100 automotive screening use the MPC5200CVR400B variant. Halogen-free status not stated in the provided data - set to unknown per data authenticity rules.