MPC8255AVVPIBB - PowerQUICC II MPU, 300 MHz, 480-TBGA | NXP
MPN: MPC8255AVVPIBB ⚠ Last Time BuyMPC8255AVVPIBB Overview
A PowerQUICC II processor belongs to the hypernym chain communications processor -> embedded MPU -> microprocessor -> integrated circuit -> semiconductor. The PowerQUICC family integrates a PowerPC core with the CPM (Communications Processor Module), historically used to offload ATM, Fast Ethernet, HDLC, UART and other serial channel work from the core, enabling deterministic throughput across multiple WAN and LAN interfaces.
Key features of the MPC8255AVVPIBB include the 300 MHz PowerPC 603e-class core, on-chip L1 instruction and data caches, dual 10/100 Ethernet MACs supported by the CPM, PCI interface, dual I2C controllers, and a memory controller that supports SDRAM and general-purpose bus devices. The 'V' in the part suffix indicates an extended commercial operating temperature grade and the 'PIBB' decodes as 300 MHz core frequency in a TBGA package.
Technically, the silicon integrates separate RISC engine CPM cores that handle DMA-driven channel work, freeing the main PowerPC core for control plane and protocol stack processing. This heterogeneous multiprocessing architecture made the PowerQUICC II family a workhorse for legacy telecom and edge-router platforms in the 2000s.
Typical applications include SOHO and enterprise routers, DSLAM line cards, T1/E1 aggregation, industrial control-plane boards, and legacy VoIP gateway designs. For modern designs NXP recommends migrating to the QorIQ families, but the MPC8255AVVPIBB remains widely available through authorized and independent distributors due to long service in deployed equipment.
When designing with this device, allocate careful PCB layout effort to the 480-ball TBGA footprint, which demands multi-layer routing, controlled-impedance traces for the memory bus, and a substantial copper pour under the package for thermal management. Designers should consult the official Freescale/NXP MPC8255 hardware specifications document for memory timing, JTAG and boundary-scan requirements.
This page synthesizes distributor pricing, parametric comparison data, drop-in alternatives and practical design notes that go beyond the manufacturer datasheet alone, helping engineers source, qualify and substitute the MPC8255AVVPIBB with confidence.
Drop-in alternatives for MPC8255AVVPIBB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8255AVVPIBB (same form factor and footprint) — differing in Core Architecture, Data Bus Width, Ethernet, Manufacturer, Number of Cores.
MPC8255AVUPIBB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8255AZUPIBB
✅ Drop-InContact for price
View Datasheet →MPC8250AZUPIBC
✅ Drop-InContact for price
View Datasheet →MPC8270VVUPEA
✅ Drop-InContact for price
View Datasheet →MPC8280CVVUPEA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8255AVVPIBB Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC G2 (PowerQUICC II HIP4) |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 300 MHz |
| Process Technology | HiPerMOS7 0.13-micron |
| Package | 480-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Extended Commercial |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Controller | SDRAM and general-purpose bus |
| Ethernet | Dual 10/100 MACs (FCC/FEC) |
| PCI Interface | Yes (33 MHz) |
| I2C Controllers | 2 |
| RoHS Status | Lead-free / compliant |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
MPC8255AVVPIBB 480-tbga (37.5 x 37.5 mm) Pin Configuration Guide
Pin configuration for MPC8255AVVPIBB (480-tbga (37.5 x 37.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8255AVVPIBB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8255AVVPIBB is suitable for 6 applications: Enterprise Router / Switch Control Plane, DSLAM Line Card Aggregation, Industrial Control / Embedded Networking Board, VoIP Gateway / Media Gateway Platform, Wireless Base Station Controller, Legacy Telecom / Test Equipment Platform.
Enterprise Router / Switch Control Plane
The MPC8255AVVPIBB's 300 MHz PowerPC G2 core combined with the integrated dual 10/100 Ethernet MACs makes it a strong fit for the control plane of legacy enterprise routers and managed switches. The PowerQUICC II CPM offloads forwarding and serial-channel DMA, freeing the CPU for routing protocols, ACL processing and management plane tasks. Its deterministic CPM architecture delivers predictable throughput across multiple WAN interfaces, which is critical for SOHO and SMB gateway platforms that must sustain line-rate Fast Ethernet forwarding without dropping frames under load.
Recommended
DSLAM Line Card Aggregation
In DSL Access Multiplexer (DSLAM) line cards the MPC8255AVVPIBB aggregates subscriber traffic from multiple ADSL/VDSL channels onto the uplink. The integrated HDLC and ATM-capable SCC channels in the CPM handle the per-subscriber framing and encapsulation, while the PowerPC core runs the aggregation and QoS policy logic. The 480-TBGA package provides the signal-integrity margin required for the high-density backplane signaling typical of DSLAM shelves, and the 300 MHz core keeps processing headroom for traffic management and shaping.
Recommended
Industrial Control / Embedded Networking Board
Industrial control and SCADA networking boards use the MPC8255AVVPIBB as a deterministic serial concentrator, leveraging its multiple SCC/SMC channels for RS-232/485, CAN-bridge and PROFIBUS-style connectivity. The on-chip PCI bus enables attachment of FPGA co-processors or specialty I/O cards. Although the part is 'extended commercial' grade, with proper thermal design it operates reliably in the semi-industrial -20 to +70 C envelope typical of factory-floor cabinets. Designers value the long-life-cycle silicon availability for industrial retrofit programs.
Recommended
VoIP Gateway / Media Gateway Platform
VoIP and media gateways historically leveraged the MPC8255AVVPIBB's CPM to handle T1/E1 trunks and serial DSP interfacing, while the PowerPC core executed the SIP/H.323 stack and call routing logic. The dual Ethernet MACs provide separate signaling and RTP paths for QoS prioritization. With native HDLC support and TDM channelization, the MPC8255AVVPIBB remains in service in installed PBX and gateway equipment, supported by the long-term supply chain through Rochester Electronics and independent distributors.
Recommended
Wireless Base Station Controller
In 2G/3G pico-cell and small base-station designs the MPC8255AVVPIBB's CPM handles the Abis/Iub serial transport, while the core runs the radio resource management stack. The PCI interface accommodates companion baseband ASICs and DSPs. The 300 MHz MIPS-class performance is sufficient for pico-cell user counts under typical deployments, and the 480-TBGA package is well-suited to the backplane environment of distributed RAN architectures deployed by operators prior to the 4G transition.
Recommended
Legacy Telecom / Test Equipment Platform
Test-and-measurement platforms for T1/E1, SONET/SDH and protocol analyzers relied on the MPC8255AVVPIBB's wide array of serial controllers and the deterministic CPM. Engineers valued the on-chip dual 10/100 Ethernet for management and result export, plus PCI for instrumentation ASICs. Although the part is no longer manufactured, instrument vendors keep it in production via distributor allocation for long-term support commitments to telecom carriers who standardize on PowerQUICC-based test sets.
Recommended
Recommended Products Summary
Engineering reference data for MPC8255AVVPIBB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8255AVUPIBB | MPC8255AZUPIBB | MPC8250AZUPIBC | MPC8270VVUPEA | MPC8280CVVUPEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA | 480-TBGA | 480-TBGA |
| Core Frequency | 300 MHz | 300 MHz | 300 MHz | 266 MHz | 300 MHz | 300 MHz |
| Core Architecture | PowerPC G2 (HIP4) | PowerPC G2 (HIP4) | PowerPC G2 (HIP4) | PowerPC G2 | PowerPC G2 (HiP7) | PowerPC G2 (HiP7) |
| Process Technology | HiPerMOS7 0.13-micron | HiPerMOS7 0.13-micron | HiPerMOS7 0.13-micron | HiPerMOS7 0.13-micron | HiPerMOS7 0.13-micron | HiPerMOS7 0.13-micron |
| Integrated Ethernet MACs | 2 (10/100) | 2 (10/100) | 2 (10/100) | 2 (10/100) | 2 (10/100) | 2 (10/100) plus additional FCC |
| CPM Serial Channels | Multiple SCC/SMC/FCC | Multiple SCC/SMC/FCC | Multiple SCC/SMC/FCC | Multiple SCC/SMC/FCC | Enhanced CPM with higher throughput | Enhanced CPM with additional FCCs |
| Lifecycle Status | No Longer Manufactured (NRND) | No Longer Manufactured | No Longer Manufactured | No Longer Manufactured | No Longer Manufactured | No Longer Manufactured |
| Approx. Unit Price (USD, qty 1) | 224.87 | 200-230 | 200-230 | 180-210 | 250-300 | 260-320 |
Key Differentiators
- Full 480-TBGA 37.5x37.5 mm footprint match with same-die siblings (vs MPC8255AZUPIBB)
- Higher CPM throughput than MPC8250 series at same package (vs MPC8250AZUPIBC)
- Mature PowerQUICC II architecture with extensive third-party BSP support (vs MPC8280CVVUPEA)
Design Notes
The 480-TBGA package on a 37.5 x 37.5 mm substrate requires an 8-layer (minimum) PCB stack-up to fan out the 1.27 mm pitch ball array. Provide at least 4 routing layers plus dedicated power and ground planes, and follow Freescale/NXP's reference design stack-up for impedance-controlled SDRAM and PCI traces. Estimated: assuming a 0.8 mm BGA ball diameter and standard 1.0 mm via pad design, designers should allocate roughly 6-8 weeks of PCB layout time for first-pass implementation.
The MPC8255AVVPIBB dissipates up to 3.5 W at 300 MHz under typical CPM loading. Attach a heatsink with thermal interface material and ensure the 480-TBGA substrate sees continuous copper pour on top and bottom layers for heat spreading. The device does not have an exposed-die top surface, so all cooling must be conducted through the PCB. Estimated: with a 4-layer 1 oz copper PCB the theta_JA is approximately 12 C/W, giving a 42 C junction rise above 25 C ambient, which is acceptable for the extended commercial grade.
The external memory bus (SDRAM) and PCI bus operate at 66-100 MHz with simultaneous switching of multiple outputs, creating significant SSN (simultaneously switching noise). Use Freescale's recommended source-termination resistor scheme on the memory address/command lines and place decoupling capacitors (0.1 uF ceramic plus 10 uF bulk) within 5 mm of every power ball. The PCI bus requires 33 ohm series termination at the source per the PCI Local Bus Specification.
Do not assume the 'V' temperature suffix in MPC8255AVVPIBB means industrial-grade -40 to +85 C; it indicates extended commercial. For industrial applications request the '-I' or '-M' grade variant. Also note that the part has been NRND since approximately 2013, so authorized allocation is exhausted and most stock today comes from independent distributors - always validate lot traceability via manufacturer date code and X-ray inspection before volume deployment.
Compliance Information
Lead-free per NXP product page (RoHS compliant). NRND status means no new factory orders. Halogen-free status not explicitly stated in the verified web data.