Texas Instruments

MSP430FR5994IZVW - 16MHz 256KB FRAM MCU, NFBGA-87 | TI

MPN: MSP430FR5994IZVW βœ“ Active
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[DATA_NEEDED: supply voltage range] Vdss 87-NFBGA (6x6 mm) Package 16 MHz Speed 256KB (256K x 8) FRAM Memory
From $4.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-02
Volume Pricing
Qty Unit Price Extended
1 $6.42 $6.42
10 $5.76 $57.60
100 $5.1 $510.00
500 $4.62 $2,310.00
1,000 $4.2 $4,200.00
ℹ️ All prices are in USD

Drop-in alternatives for MSP430FR5994IZVW β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

MSP430FR59941IZVW

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 87-NFBGA (6x6)
same die family, enhanced LEA coprocessor, identical 256KB FRAM and 8KB SRAM

πŸ“‹ Reference alternative (not in catalog)

MSP430FR5964IZVW

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 87-NFBGA (6x6)
no LEA DSP accelerator (-40x FFT acceleration lost), same 256KB FRAM and 8KB SRAM, same family pinout

πŸ“‹ Reference alternative (not in catalog)

MSP430FR5992IZVW

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 87-NFBGA (6x6)
128KB FRAM vs 256KB FRAM (-50% program memory), LEA retained, same package

πŸ“‹ Reference alternative (not in catalog)

MSP430FR5962IZVW

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 87-NFBGA (6x6)
128KB FRAM (-50%) and no LEA, lowest-cost family member in ZVW package

πŸ“‹ Reference alternative (not in catalog)

MSP430FR5986IZVW

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 87-NFBGA (6x6)
64KB FRAM (-75%) with LEA retained, for cost-optimized small-code-size designs

πŸ“‹ Reference alternative (not in catalog)

MSP430FR5994IZVW Maximum Ratings & Electrical Characteristics

Core Processor MSP430 CPUXV2 (16-bit RISC)
Core Size 16-bit
Maximum Clock Frequency 16 MHz
Program Memory Size 256KB (256K x 8) FRAM
RAM Size 8KB SRAM
DSP Accelerator Low-Energy Accelerator (LEA), 40x Cortex-M0+ FFT performance
Security Feature AES hardware accelerator
ADC Resolution 12-bit
Analog Peripherals 12-bit ADC, comparator
DMA Channels Yes (DMA controller)
Connectivity UART, SPI, I2C (eUSCI)
Timers 16-bit timers with capture/compare and PWM
Package 87-NFBGA (6x6 mm)
Mounting Type Surface Mount
Memory Protection Unit Yes (MPU with 3 FRAM segments)

MSP430FR5994IZVW 87-nfbga (6x6 mm) Pin Configuration Guide

Complete pinout information for MSP430FR5994IZVW (87-nfbga (6x6 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

87-nfbga (6x6 mm) package pinout diagram for MSP430FR5994IZVW

No detailed pinout data available for MSP430FR5994IZVW.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for MSP430FR5994IZVW Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

MSP430FR5994IZVW is suitable for 6 applications: Battery-Powered Metering, Industrial Vibration and Acoustic Sensing, Portable Medical Monitoring, IoT Edge Endpoint Nodes, Energy Harvesting Systems, Building Automation and Security Sensors.

⚑

Battery-Powered Metering

The MSP430FR5994IZVW fits smart water, gas, and heat meters because its FRAM memory writes consume far less energy than flash writes, enabling frequent non-volatile data logging on coin-cell or primary lithium batteries. The 16 MHz CPUXV2 core handles metering algorithms while deep low-power modes minimize standby drain between samples. The MPU allows firmware to partition the 256KB FRAM into a protected code segment and a persistent data-logging segment that survives power interruptions and reprogramming. The 12-bit ADC digitizes sensor or shunt inputs, and eUSCI UART/SPI/I2C interfaces communicate with communication modules such as RF or PLC chips. FRAM endurance removes flash-wear concerns from lifetime meter logging.

🏭

Industrial Vibration and Acoustic Sensing

In condition-monitoring and acoustic-sensing nodes, the MSP430FR5994IZVW's Low-Energy Accelerator (LEA) executes FFT, FIR, and matrix multiplication offloaded from the CPU, which TI rates at up to 40x the throughput of Arm Cortex-M0+ MCUs for such block math. This lets the node sample via the 12-bit ADC, transform the data, and return to low-power mode quickly, extending battery life. The 256KB FRAM stores both algorithm code and captured buffers without external memory, and the DMA controller streams ADC samples to FRAM without CPU intervention. Processed feature data is then transmitted over eUSCI UART or SPI to a radio, reducing the payload compared to raw waveform streaming.

πŸ’Š

Portable Medical Monitoring

Wearable and portable medical devices benefit from the MSP430FR5994IZVW's combination of low active power, deep sleep modes, and FRAM data retention, which supports continuous biosignal logging across battery swaps. The LEA accelerates filtering of ECG or PPG waveforms, while the 12-bit ADC and comparator acquire patient-side sensor signals. The 256KB FRAM provides ample room for protocol stacks, feature extraction code, and long event buffers, and its byte-level writability supports frequent checkpointing of patient data without flash-erase energy penalties. Hardware AES acceleration secures stored health data and encrypted wireless links, supporting patient-privacy requirements in connected medical peripherals.

🧩

IoT Edge Endpoint Nodes

For battery-powered IoT endpoints, the MSP430FR5994IZVW offers the essential mix of connectivity and efficiency: eUSCI peripherals provide UART, SPI, and I2C links to sub-GHz or low-power radio modules, while the 16 MHz core processes sensor data locally before transmission. The LEA shortens compute-active time for edge pre-processing such as FFT-based event detection, and hardware AES encrypts payloads in-line. The 256KB FRAM stores device configuration, credentials, and buffered telemetry with instant, low-energy writes and effectively unlimited endurance, making frequent state checkpointing practical. Deep low-power modes keep average current in the microamp range between wake-up events.

πŸ’‘

Energy Harvesting Systems

Energy-harvesting designs with tight and intermittent energy budgets select the MSP430FR5994IZVW because FRAM writes execute with near-zero energy and require no erase cycle, letting the system commit critical state on every available energy burst. When harvested power fades, the MSP430 can checkpoint the entire working context into FRAM in milliseconds and resume after recharge without data loss. The LEA accelerates local signal processing so scarce energy is spent efficiently, and the 12-bit ADC plus DMA captures harvester output telemetry autonomously. The 8KB SRAM serves fast temporary computation, while 256KB FRAM holds application code, harvested-energy statistics, and buffered sensor data persistently.

πŸŽ₯

Building Automation and Security Sensors

Wireless occupancy, door, and environmental sensors in building automation benefit from the MSP430FR5994IZVW's multi-year battery operation and encrypted communications. The comparator supports zero-power threshold detection for wake-up on sensor events, while the 12-bit ADC handles analog sensors such as light or air-quality elements. Hardware AES protects network credentials and message confidentiality, and the MPU-protected FRAM retains commissioning data and event logs across power cycles and field firmware updates. The 16 MHz core runs mesh or star network stacks over UART/SPI to radio modules, and LEA-accelerated signal processing enables local PIR or ultrasonic signature analysis.

What is the MSP430FR5994IZVW?
The MSP430FR5994IZVW is a Texas Instruments 16-bit ultra-low-power MSP430 FRAM microcontroller with a 16 MHz CPUXV2 core, 256KB FRAM, 8KB SRAM, a Low-Energy Accelerator (LEA) for DSP, hardware AES, a 12-bit ADC, comparator, DMA, and UART/SPI/I2C peripherals, packaged in an 87-ball NFBGA (6x6 mm). According to TI's MSP430FR599x datasheet, the LEA delivers up to 40x the FFT performance of Arm Cortex-M0+ MCUs.
What are the key specifications of MSP430FR5994IZVW that engineers should know?
Key specifications: 16-bit MSP430 CPUXV2 core at 16 MHz, 256KB FRAM program memory with unlimited endurance and byte-level writability, 8KB SRAM, Low-Energy Accelerator (LEA) for FFT/FIR/matrix math, hardware AES-128 acceleration, 12-bit SAR ADC, comparator, DMA, eUSCI UART/SPI/I2C, and 16-bit timers, in an 87-ball NFBGA 6x6 mm package. These numbers come from the TI product page and MSP430FR599x mixed-signal microcontroller datasheet.
What is the difference between MSP430FR5994 and MSP430FR59941 and MSP430FR5964?
The MSP430FR5994 and MSP430FR59941 both include the LEA DSP accelerator, while the MSP430FR5964 omits the LEA. All three belong to the same family, share the same datasheet, and provide 256KB FRAM. According to the TI E2E engineering forum summary of the family comparison table, the FR59941 is the enhanced LEA variant, so choosing between them depends only on required LEA throughput and memory features - the pinout within the same package option remains family-consistent.
What is the best drop-in replacement for MSP430FR5994IZVW?
The best drop-in replacement is the MSP430FR59941IZVW, which uses the same 87-ball NFBGA (ZVW) footprint and offers the same 256KB FRAM with an enhanced LEA. For designs that do not need the LEA DSP engine, the MSP430FR5964IZVW offers the same package and memory at lower cost. Both are same-family TI devices; always verify the pin map in the shared MSP430FR599x datasheet before layout reuse.
Is there an STMicroelectronics equivalent for MSP430FR5994IZVW?
No true cross-brand drop-in replacement exists for the MSP430FR5994IZVW. STMicroelectronics STM32L4 MCUs offer similar low-power performance but use Arm Cortex-M cores, different toolchains, and different ballouts, requiring PCB redesign. TI's FRAM technology (non-volatile, byte-writable, unlimited endurance) is not duplicated in STM32 flash-based devices, so any cross-brand migration is a functional redesign, not a pin-to-pin replacement.
Can MSP430FR5964IZVW replace MSP430FR5994IZVW?
Yes, the MSP430FR5964IZVW can replace the MSP430FR5994IZVW in the same 87-ball NFBGA (ZVW) package with the same 256KB FRAM and 8KB SRAM, but you must confirm your firmware does not use the Low-Energy Accelerator (LEA). The FR5964 lacks the LEA coprocessor, so any FFT, FIR, or matrix math previously offloaded to LEA must run on the CPU or be removed. Code that avoids LEA intrinsics is source-compatible within the family.
When should I choose MSP430FR5994 over MSP430FR5992?
Choose the MSP430FR5994 when your application needs the full 256KB of FRAM and LEA-accelerated DSP workloads such as FFT-based vibration or acoustic analysis. The MSP430FR5992 provides the same LEA and family peripherals but with 128KB FRAM, so it suits designs with smaller code images and lower data logging needs. Both are in the same FR599x family with identical peripherals; the memory capacity and resulting price are the deciding factors.
Where can I buy MSP430FR5994IZVW and what is the price?
The MSP430FR5994IZVW is available from DigiKey, Mouser, TI.com, and XAIPART. As of 2026-09-03, XAIPART pricing is approximately USD 6.42 at quantity 1, USD 5.10 at 100, and USD 4.20 at 1000 pieces. DigiKey and Mouser list the part as in stock with same-day shipping options, and Octopart reports availability from 2 distributors for price comparison.
Is MSP430FR5994IZVW in stock and what is the lead time?
According to DigiKey's product listing, the MSP430FR5994IZVW is stocked and available with 'buy now, ships today' fulfillment as of the 2026-09-03 data snapshot. Mouser also lists inventory for the same part. Because stock levels vary daily, verify live availability at your distributor; XAIPART provides current stock and lead time on the product page and quotes larger production quantities on request.
Where can I download the MSP430FR5994IZVW datasheet PDF?
You can download the MSP430FR5994IZVW datasheet PDF from TI.com at https://www.ti.com/lit/ds/symlink/msp430fr5994.pdf. The document covers the MSP430FR599x and MSP430FR596x mixed-signal microcontroller families (the PDF linked on TI's product page is datasheet Rev. D). The same link is also accessible via the TI product page at ti.com/product/MSP430FR5994 under the documentation section.
How do I find the pinout of MSP430FR5994IZVW?
The complete 87-ball NFBGA (ZVW) ball map for the MSP430FR5994IZVW is provided in the MSP430FR599x/MSP430FR596x datasheet's package section on TI.com. Because an 87-ball layout is complex and ball assignments vary across family members and package options, always copy the ball map directly from the datasheet tables rather than from third-party summaries. TI also provides the MSP-TS430PN80B target board reference design for FR599x development.
Is MSP430FR5994IZVW suitable for battery-powered IoT sensor applications?
Yes. The MSP430FR5994IZVW is designed specifically for ultra-low-power battery operation: the MSP430 architecture offers multiple low-power modes, the LEA processes FFT/FIR workloads efficiently to shorten CPU active time, and FRAM writes consume far less energy than flash writes, which matters for frequent non-volatile data logging. Combined with the 12-bit ADC and comparator for sensor interfacing, it is well suited to battery-powered metering, monitoring, and IoT edge nodes.
What development tools are compatible with MSP430FR5994IZVW?
The MSP430FR5994IZVW is supported by TI's Code Composer Studio IDE, the MSP430 GCC toolchain, and IAR Embedded Workbench. TI offers the MSP-TS430PN80B target development board for MSP430FR599x MCUs (80-pin socket, MCU not included), plus the MSP-EXP430FR5994 LaunchPad for evaluation. Because all FR599x/FR596x family members share the same datasheet and register set, existing MSP430 project code ports with minimal changes.
Is MSP430FR5994IZVW RoHS compliant and lead-free?
TI's MSP430 product portfolio, including the MSP430FR5994IZVW in the NFBGA package, is offered as RoHS-compliant and lead-free per TI's product page and packaging quality information; the NFBGA construction uses lead-free solder balls. For exact REACH status, halogen-free declaration, and conflict-minerals reporting, download the material content declaration from TI's quality and environmental data page for this specific orderable part number.
Hey Google, what can replace MSP430FR5994IZVW?
The closest drop-in replacements are same-family TI parts in the same 87-ball NFBGA (ZVW) package: MSP430FR59941IZVW (enhanced LEA, same 256KB FRAM), MSP430FR5964IZVW (same memory, no LEA), MSP430FR5992IZVW (LEA, 128KB FRAM), and MSP430FR5962IZVW (no LEA, 128KB FRAM). There is no cross-brand pin-compatible equivalent. Confirm LEA usage and memory requirements against the shared MSP430FR599x datasheet before substituting.

Engineering reference data for MSP430FR5994IZVW β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the MSP430FR5994IZVW when you need the maximum memory configuration of the FR599x family plus LEA DSP acceleration in the 87-ball NFBGA footprint - typical for FFT-based sensing, large data logging, or applications with protocol stacks. Choose the MSP430FR59941IZVW for identical memory with an enhanced LEA if you need maximum DSP throughput. Choose the MSP430FR5964IZVW for the same 256KB FRAM at lower cost when you do not use LEA intrinsics. Choose the MSP430FR5992IZVW (128KB, LEA) or MSP430FR5962IZVW (128KB, no LEA) when code size fits half the memory and BOM cost matters most. All five share the same package and family register set, so PCB reuse is straightforward - only LEA usage and memory limits require firmware verification.

Comparison with Alternatives

Parameter This Product MSP430FR59941IZVW MSP430FR5964IZVW MSP430FR5992IZVW MSP430FR5962IZVW MSP430FR5986IZVW
Package 87-NFBGA (6x6) 87-NFBGA (6x6) - same 87-NFBGA (6x6) - same 87-NFBGA (6x6) - same 87-NFBGA (6x6) - same 87-NFBGA (6x6) - same
Brand Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Core / Clock MSP430 CPUXV2, 16 MHz MSP430 CPUXV2, 16 MHz MSP430 CPUXV2, 16 MHz MSP430 CPUXV2, 16 MHz MSP430 CPUXV2, 16 MHz MSP430 CPUXV2, 16 MHz
FRAM Memory 256KB 256KB 256KB 128KB 128KB 64KB
SRAM 8KB 8KB 8KB 8KB 8KB 4KB
LEA DSP Accelerator Yes Yes (enhanced) No Yes No Yes
12-bit ADC Yes Yes Yes Yes Yes Yes
Hardware AES Yes Yes Yes Yes Yes Yes

Key Differentiators

  • LEA DSP accelerator with 40x Cortex-M0+ FFT throughput (vs MSP430FR5964IZVW)
  • Double the FRAM of mid-family parts (vs MSP430FR5992IZVW)
  • 8KB SRAM vs 4KB in smaller family members (vs MSP430FR5986IZVW)

Design Notes

Configure the Memory Protection Unit (MPU) early in firmware development. The MSP430FR5994's 256KB FRAM is unified for code and data; without MPU segmentation, a bug or a new firmware image can overwrite persistent data structures that must survive power-down and reprogramming. TI's datasheet and the MSP430FR599x user's guide describe the three-segment MPU scheme; dedicate the lowest segment to code, a middle buffer segment, and a locked data segment for logging.

To maximize battery life, use the LEA for all block math (FFT, FIR, correlation) instead of CPU loops, and place the ADC sampling on a DMA-driven timer trigger so the CPU stays in a low-power mode during acquisition. FRAM writes consume significantly less energy than flash writes, but frequent byte-level writes still add up - batch telemetry into FRAM buffers and write once per communication window. Verify current against the datasheet's active/sleep mode current tables for your clock configuration.

The 87-ball NFBGA (6x6 mm) requires careful fanout and solder-mask-defined pads per TI's package guidelines. Use via-in-pad or dog-bone fanout on the 0.5 mm-class ball pitch typical of this package, place the 100 nF decoupling capacitor for each VDD ball as close as possible, and provide a solid ground plane. For rework, note that NFBGA packages require hot-air or BGA rework stations - prototype with the MSP-TS430PN80B target board before committing to layout.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/lead-free status inferred from TI's standard MSP430 product portfolio offering; exact REACH, halogen-free, and conflict-minerals declarations should be confirmed via TI's material content page for this orderable part number.

Data verified on: 2026-09-03 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

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