MX30LF1GE8AB-TI-TR - 1Gbit 3V SLC NAND Flash, x8, TSOP-48 | Macronix
MPN: MX30LF1GE8AB-TI-TR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.66 | $26.60 |
| 100 | $2.36 | $236.00 |
| 500 | $2.12 | $1,060.00 |
| 1,000 | $1.89 | $1,890.00 |
MX30LF1GE8AB-TI-TR Overview
A NAND Flash is a non-volatile memory that stores data as charge on floating-gate cells arranged in pages and blocks, accessed through a command-driven protocol over a multiplexed 8-bit I/O bus. SLC NAND stores one bit per cell, offering the highest endurance and reliability within the NAND family (which itself is a class of non-volatile memory -> flash memory -> semiconductor memory -> IC). Compared with NOR flash, NAND provides higher density at lower cost-per-bit and faster write/erase, but requires sequential access and external ECC for data integrity in mission-critical applications.
Key features include a 2112-byte page size (2048 + 64 spare), 64 pages per block (128 KB + 4 KB spare), 1024 blocks, internal data-move / copy-back operations, hardware-ready/busy (R/B#) signaling, and command-set compatibility with the ONFI 1.0 baseline. ECC-Free means error correction is handled by the host, giving designers freedom to choose ECC strength (typically BCH or Hamming). The TSOP-I 48-pin package is the industry-standard footprint shared by most 1 Gbit to 4 Gbit parallel NAND parts.
The MX30LF1GE8AB architecture uses a 2-plane array that enables interleaved page program and block erase between planes for higher throughput. Plane interleaving can effectively double sequential write bandwidth by overlapping tPROG of one plane with tR of the other. Designers should size VCC decoupling (1 uF + 100 nF) close to the VCC/VSS pins and respect the 100 us R/B# power-on delay per the Macronix datasheet revision v1.3.
Typical applications include embedded Linux/OS boot + mass storage in industrial gateways, set-top box and smart-TV storage, automotive infotainment (non-safety), networking equipment logging, and IoT edge devices that need reliable code + data storage at 3 V. Designers migrating from the older MX30LF1G08AA should review Macronix application note AN0366V1, as the MX30LF1GE8AB has a longer Device ID and slightly longer tR.
When designing in this part, allow 1.5 us tRST after power-up before issuing the reset (0xFF) command. The R/B# pin is open-drain and requires an external pull-up. For long-term data retention, program/erase endurance is rated at 100 K cycles per block typical, with 10-year data retention.
This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MX30LF1GE8AB-TI-TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MX30LF1GE8AB-TI-TR (same form factor and footprint) — differing in Block Size, Data Retention, Operating Temperature, Package, Page Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MX30LF1GE8AB-TI
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF1G08AA-TI
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF2GE8AB-TI
✅ Drop-In📋 Reference alternative (not in catalog)
TC58BVG0S3HTAI0
✅ Drop-In📋 Reference alternative (not in catalog)
MT29F1G08ABAEAWP-IT:E
✅ Drop-In✓ In Stock
$1.6 / Unit
View Datasheet →W29N01GVSIAA
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF1GE8AB-TI-TR Maximum Ratings & Electrical Characteristics
| Memory Type | Non-Volatile NAND Flash (SLC) |
| Memory Organization | 128 M x 8 |
| Density | 1 Gbit (1024 Mbit) |
| Interface Type | Parallel Asynchronous (ONFI 1.0) |
| Cell Technology | Single-Level Cell (SLC) |
| Page Size | 2112 bytes (2048 data + 64 spare) |
| Block Size | 64 pages (128 KB + 4 KB spare) |
| Number of Blocks | 1024 |
| Access Time (tR) | 20 ns / 25 ns (grade dependent) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Active Read Current (ICC1) | 15 mA typical |
| Program / Erase Current (ICC2) | 15 mA typical |
| Program / Erase Endurance | 100 K cycles per block (typical) |
| Data Retention | 10 years (typical) |
| Operating Temperature | -40 C to +85 C (industrial) |
| Package | 48-pin TSOP-I (Type I) |
| Mounting Type | Surface Mount |
| ECC Architecture | ECC-Free (external host ECC required) |
| Compliance Standard | ONFI 1.0 |
| Bad Block Mark | 00h on 1st and 2nd page (per datasheet v1.3) |
| RoHS Status | Compliant |
| Bad Block Indicator | Marked at 1st and 2nd page (00h) per datasheet v1.3 |
| R/B# Power-On Delay | 100 us (per datasheet v1.3) |
MX30LF1GE8AB-TI-TR Pin Configuration
| Pin 1 | NC — Not connected |
| Pin 2 | NC — Not connected |
| Pin 3 | NC — Not connected |
| Pin 4 | NC — Not connected |
| Pin 5 | NC — Not connected |
| Pin 6 | NC — Not connected |
| Pin 7 | WE# — Write Enable (active low) |
| Pin 8 | RE# — Read Enable (active low) |
| Pin 9 | CLE — Command Latch Enable |
| Pin 10 | ALE — Address Latch Enable |
| Pin 11 | WP# — Write Protect (active low) |
| Pin 12 | CE# — Chip Enable (active low) |
| Pin 13 | R/B# — Ready/Busy (open-drain, active low) |
| Pin 14 | NC — Not connected |
| Pin 15 | NC — Not connected |
| Pin 16 | NC — Not connected |
| Pin 17 | NC — Not connected |
| Pin 18 | NC — Not connected |
| Pin 19 | NC — Not connected |
| Pin 20 | VSS — Ground |
| Pin 21 | NC — Not connected |
| Pin 22 | NC — Not connected |
| Pin 23 | NC — Not connected |
| Pin 24 | NC — Not connected |
| Pin 25 | NC — Not connected |
| Pin 26 | NC — Not connected |
| Pin 27 | NC — Not connected |
| Pin 28 | VCC — Power supply (2.7 V to 3.6 V) |
| Pin 29 | I/O0 — Data input/output 0 |
| Pin 30 | I/O1 — Data input/output 1 |
| Pin 31 | I/O2 — Data input/output 2 |
| Pin 32 | I/O3 — Data input/output 3 |
| Pin 33 | VSS — Ground |
| Pin 34 | I/O4 — Data input/output 4 |
| Pin 35 | I/O5 — Data input/output 5 |
| Pin 36 | I/O6 — Data input/output 6 |
| Pin 37 | I/O7 — Data input/output 7 |
| Pin 38 | VSS — Ground |
| Pin 39 | NC — Not connected |
| Pin 40 | NC — Not connected |
| Pin 41 | NC — Not connected |
| Pin 42 | NC — Not connected |
| Pin 43 | NC — Not connected |
| Pin 44 | NC — Not connected |
| Pin 45 | NC — Not connected |
| Pin 46 | NC — Not connected |
| Pin 47 | NC — Not connected |
| Pin 48 | VSS — Ground |
Typical Applications
MX30LF1GE8AB-TI-TR is suitable for 6 applications: Industrial IoT Gateway Storage, Set-Top Box and Smart TV Firmware + Channel Storage, Automotive Infotainment (Non-Safety), Networking Equipment Event Logging, Linux Boot + Rootfs for Industrial HMI Panels, IoT Edge Devices and Sensor Hubs.
Industrial IoT Gateway Storage
The MX30LF1GE8AB-TI-TR fits industrial IoT gateways needing 1 Gbit of reliable on-board storage for Linux rootfs, configuration, and event logs. Its 3.0-3.6 V VCC matches typical 3.3 V system rails directly, while the 100 K cycle per block endurance comfortably handles daily write workloads typical of edge gateways. The x8 parallel interface pairs naturally with industrial SoCs that expose a NAND controller IP. Designers should enable host-side BCH ECC (typically 8-bit) and provision 5-10% over-provisioned blocks to extend endurance. The 10-year data retention rating supports long-life industrial deployments where the gateway may run unattended for 5-10 years before service.
Recommended
Set-Top Box and Smart TV Firmware + Channel Storage
The MX30LF1GE8AB-TI-TR's 1 Gbit SLC NAND is well-sized for set-top box (STB) firmware plus channel/EPG data storage. Its 20 ns access time provides fast channel-zap performance in zapper/semi-smart STBs, and the ONFI 1.0 compliance ensures compatibility with mainstream STB SoCs from Broadcom, Realtek, and Ali. The 48-pin TSOP-I package sits cleanly on the main PCB next to the DRAM, simplifying layout. Designers can use plane-interleaved program operations to double write throughput during firmware updates, and the R/B# pin allows the host to poll for completion without busy-wait loops. Long 10-year retention aligns with the 7-10 year service life of consumer STBs.
Recommended
Automotive Infotainment (Non-Safety)
The MX30LF1GE8AB-TI-TR is widely deployed in automotive infotainment head units and telematics control units where AEC-Q100 is not required. Its industrial -40 C to +85 C temperature range handles cabin and behind-dash thermal environments, and the 100 K cycle endurance easily covers map-data refresh and OTA update workloads over a 10-year vehicle service life. The 3.3 V VCC matches typical automotive PMIC outputs, simplifying power tree design. For safety-critical ECUs (airbag, ADAS) or AEC-Q100 mandated modules, designers should select the dedicated automotive-grade Macronix SLC NAND variant instead.
Recommended
Networking Equipment Event Logging
In routers, switches, and small-cell base stations, the MX30LF1GE8AB-TI-TR stores system logs, configuration snapshots, and firmware A/B images. The 1 Gbit density is ideal for dual-image firmware (2 x 256 MB) plus a 256 MB log partition plus a 256 MB config partition, fitting comfortably within 128 MB. Its parallel interface pairs with networking SoCs that include a NAND controller, and the open-drain R/B# pin simplifies interrupt-driven operation. The 100 us R/B# power-on delay per datasheet v1.3 lets the host issue the reset command 1.5 us after VCC stable, ensuring a clean startup sequence even during fast PoE voltage ramps.
Recommended
Linux Boot + Rootfs for Industrial HMI Panels
Industrial HMI panels running embedded Linux (Buildroot/Yocto) commonly boot from and store their rootfs on a 1 Gbit SLC NAND. The MX30LF1GE8AB-TI-TR fits this role: its 128 MB usable data area (after bad-block and ECC overhead) is enough for a stripped-down Linux rootfs plus application data, and its TSOP-48 package simplifies PCB layout under the LCD carrier board. Pairing with a JFFS2 or UBIFS filesystem handles wear-leveling across the 100 K cycle-per-block endurance, giving years of reliable operation. Designers should budget 5-10% spare blocks for bad-block replacement during the panel's 10+ year service life.
Recommended
IoT Edge Devices and Sensor Hubs
Battery- or line-powered IoT edge devices and sensor hubs benefit from the MX30LF1GE8AB-TI-TR's mature 1 Gbit density and 3.3 V operation. The SLC endurance of 100 K cycles per block supports frequent sensor data buffering in event-driven edge nodes, and the 10-year retention covers long-life sensor deployments in smart-building, smart-agriculture, or smart-metering applications. Designers can implement OTA firmware updates by writing the new image to a secondary partition and switching boot pointers. The TSOP-48 footprint is shared with Macronix 1.8 V (UF) parts, allowing a single layout to support both 3 V and 1.8 V SoCs by changing only the BOM line.
Recommended
Recommended Products Summary
Engineering reference data for MX30LF1GE8AB-TI-TR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MX30LF1GE8AB-TI | MX30LF1G08AA-TI | MX30LF2GE8AB-TI | TC58BVG0S3HTAI0 | MT29F1G08ABAEAWP |
|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | Toshiba | Micron Technology |
| Package | TSOP-48 | TSOP-48 - same | TSOP-48 - same | TSOP-48 - same | TSOP-48 - same | TSOP-48 - same |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 2 Gbit | 1 Gbit | 1 Gbit |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Interface | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| ECC Architecture | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) |
| Endurance | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block |
Key Differentiators
- Mature 1 Gbit supply chain with shorter lead times (vs MX30LF2GE8AB-TI)
- SLC endurance and data retention (vs MT29F1G08ABAEAWP)
- Revision v1.3 datasheet with corrected bad-block marker (vs MX30LF1G08AA-TI)
- Tape-and-reel packaging for SMT production (vs MX30LF1GE8AB-TI)
Design Notes
Decouple VCC with a 1 uF X7R ceramic plus a 100 nF X7R placed within 3 mm of the VCC (pin 28) and VSS (pins 20, 33, 38, 48) pins. Hold VCC stable during program and erase operations - a brown-out below 2.7 V mid-program can corrupt the target block. Allow 1.5 us after VCC reaches 2.7 V before issuing the reset (0xFF) command, then wait at least 100 us for R/B# to de-assert per datasheet revision v1.3.
Route the 8-bit I/O bus (I/O0-I/O7, pins 29-32 and 34-37) with matched trace lengths to within 2-3 mm to preserve setup/hold timing at 20 ns access time. Keep CE#, RE#, WE#, CLE, ALE traces short and away from switching power nodes. The R/B# pin is open-drain and requires a 4.7 K to 10 K pull-up to VCC. Place the TSOP-48 footprint on the top side or bottom side with no vias under the package to simplify inspection and rework.
Per Macronix datasheet revision v1.3, the bad-block marker is now 00h on the 1st and 2nd page (not non-FFh on 1st or 2nd page as in earlier revisions). Host firmware performing factory bad-block scan must check the 2048th byte of the 1st and 2nd pages for 00h. Skipping the 2nd page check can lead to using a partially bad block, causing data corruption in production. Also note that cache read is not supported on the MX30LF1GE8AB (unlike its predecessor MX30LF1G08AA).
The CLE and ALE signals must be held stable while CE# is asserted to correctly latch the command vs address cycle. Driving CLE/ALE too close to the CE# edge can cause the wrong cycle to be latched. Place a series 33 ohm resistor on each NAND control line (CE#, RE#, WE#, CLE, ALE, WP#) if the host SoC is more than 50 mm away, to dampen reflections on the parallel bus at 20 ns access time.
Compliance Information
RoHS compliant per Macronix product page. Industrial temperature grade -40 C to +85 C. Not AEC-Q100 qualified - choose the dedicated automotive-grade Macronix SLC NAND variant for safety-critical automotive modules.
