P1010NSN5FFA557 - QorIQ P1 32-Bit SoC MPU 667 MHz 425-TEPBGA | NXP
MPN: P1010NSN5FFA557 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $27.18 | $27.18 |
| 10 | $24.46 | $244.60 |
| 100 | $21.74 | $2,174.00 |
| 500 | $19.3 | $9,650.00 |
| 1,000 | $16.85 | $16,850.00 |
P1010NSN5FFA557 Overview
A microprocessor SoC (System-on-Chip) is an integrated circuit that combines a central processing unit, memory controllers, and a wide range of peripheral interfaces onto a single silicon die. Within the broader taxonomy, the P1010 belongs to the category of embedded microprocessors (MPU) - sub-classes include communications processors, application processors, and real-time microcontrollers. QorIQ processors specifically target networking, telecom, and industrial control applications where deterministic performance and rich peripheral integration are required.
Key features of the P1010NSN5FFA557 include a 45 nm low-power process technology, core frequencies up to 667 MHz in this specific variant, a 32-bit Power Architecture e500 core with dual-issue superscalar pipeline, DDR3 memory controller with ECC support, integrated security engine with Trusted Boot, and an industrial-grade operating temperature range of 0C to +105C. The 'NSN5FFA' suffix decodes as: N=No encryption, S=Std temp 0-105C, N5=667 MHz core, FFA=package/feature designator per NXP ordering scheme.
The P1010 architecture combines an e500 Power Architecture core with a high-bandwidth system bus connecting to multiple on-chip peripherals. The 45 nm process balances performance-per-watt, allowing fanless designs in many industrial applications. The integrated security block supports secure boot and run-time integrity checks, addressing the needs of network infrastructure equipment.
Typical applications include industrial Ethernet switches, factory automation controllers, smart grid substation equipment, networked printers, and embedded routers/gateways. The integrated GbE and PCIe make it well-suited for linecard management and control-plane processors in networking gear.
When designing with this device, allocate adequate PCB layers for the DDR3 memory interface (typically 6+ layers with controlled impedance), provide a dedicated thermal copper pour under the 425-TEPBGA package, and ensure the power supply sequencing matches the e500 core and I/O voltage requirements. Programming is supported via NXP's CodeWarrior, the Linux SDK, and standard Power Architecture toolchains.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet - enabling faster sourcing decisions for engineers designing with the NXP QorIQ P1010 platform.
Drop-in alternatives for P1010NSN5FFA557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1010NSN5FFA557 (same form factor and footprint) — differing in Core Frequency, Operating Temperature, PCI Express, Package, SATA.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1010NSN5HFA
✅ Drop-In✓ In Stock
$20.5 / Unit
View Datasheet →P1010NSN5FFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1014NSN5FFA
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN5FFA
✅ Drop-In📋 Reference alternative (not in catalog)
P2020NSN5FFA
✅ Drop-In📋 Reference alternative (not in catalog)
P1010NSN5FFA557 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | QorIQ P1 Series |
| Architecture | 32-bit Power Architecture e500 |
| Core Count | 1 |
| Core Frequency | 667 MHz |
| Process Technology | 45 nm |
| Package | 425-TEPBGA |
| Memory Controller | DDR3 with ECC |
| Ethernet | Gigabit Ethernet (integrated) |
| USB | Integrated |
| SATA | Integrated |
| PCI Express | Integrated (PCIe) |
| Security | Trusted Boot engine |
| Operating Temperature | 0C to +105C (industrial) |
| Encryption Acceleration | Not included in this variant (NSN suffix) |
P1010NSN5FFA557 425-tepbga Pin Configuration Guide
Pin configuration for P1010NSN5FFA557 (425-tepbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1010NSN5FFA557.
Refer to the datasheet for full pin configuration.
Typical Applications
P1010NSN5FFA557 is suitable for 6 applications: Industrial Ethernet Switch, Factory Automation Controller, Smart Grid Substation Equipment, Networked Printer Controller, Embedded Router/Gateway, Linecard Management Processor.
Industrial Ethernet Switch
The P1010NSN5FFA557's integrated Gigabit Ethernet MAC, PCIe endpoint, and DDR3 controller with ECC make it ideal for managed industrial Ethernet switches. At 667 MHz the e500 core handles Layer 2/3 forwarding tables, SNMP management, and real-time industrial protocols (PROFINET, EtherNet/IP) within the 0-105C industrial temperature range. Designers typically pair the P1010 with external PHY transceivers (e.g., NXP TJA1100 for automotive-grade or standard GbE PHYs) and use the DDR3 interface for packet buffer memory. Compared to ARM Cortex-A based switches, the Power Architecture core delivers more deterministic interrupt latency, which is critical for time-sensitive networking (TSN) and industrial control loops. The Trusted Boot engine also provides secure firmware authentication required by IEC 62443.
Recommended
Factory Automation Controller
For factory automation PLCs and motion controllers, the P1010NSN5FFA557 provides 667 MHz of deterministic Power Architecture performance with industrial-grade reliability. The integrated peripherals (USB for HMI panels, PCIe for I/O expansion, SATA for local storage, GbE for plant networking) eliminate the need for companion bridge chips. The DDR3 controller with ECC corrects single-bit memory errors critical for 24/7 factory operation. Developers can leverage the Power Architecture toolchain for real-time control loops where ARM Cortex-M controllers may lack processing headroom. The 425-TEPBGA package supports reflow soldering onto standard 6-layer PCBs with proper thermal via arrays.
Recommended
Smart Grid Substation Equipment
The P1010NSN5FFA557 suits smart grid protection relays, RTUs, and substation communication gateways due to its industrial temperature rating and Trusted Boot security. The e500 core runs IEC 61850 communication stacks while the integrated GbE provides substation LAN connectivity. Hardware encryption (when using the P1010NSN5HFA variant) accelerates TLS/DTLS for secure substation communications. The DDR3 ECC controller detects memory corruption critical for grid reliability. Compared to general-purpose processors, the P1010's deterministic performance and long-life NXP supply commitment make it suitable for grid infrastructure with 15-20 year deployment lifecycles.
Recommended
Networked Printer Controller
Embedded printer controllers benefit from the P1010NSN5FFA557's combination of 667 MHz processing, DDR3 memory bandwidth for image rendering, and integrated USB/Ethernet for host connectivity. The e500 core efficiently handles PostScript/PDF rasterization, while the Trusted Boot engine prevents unauthorized firmware replacement. Industrial temperature rating supports deployment in harsh printing environments. The PCIe interface enables high-speed scanner module integration. This design typically pairs the P1010 with external DRAM and flash storage via the SATA interface.
Recommended
Embedded Router/Gateway
The P1010NSN5FFA557 powers compact embedded routers and industrial gateways running Linux with the QorIQ P1 BSP. The integrated peripherals (GbE, PCIe, USB, SATA) provide complete connectivity without external bridges. The DDR3 controller supports up to 4GB of system memory for routing tables and VPN encryption buffers. Developers leverage NXP's mainline Linux kernel support for fast time-to-market. The 45nm process keeps power consumption under 5W typical, enabling fanless enclosure designs for office or industrial deployment.
Recommended
Linecard Management Processor
In telecom and datacom chassis, the P1010NSN5FFA557 serves as a linecard management/controller processor handling hot-swap control, I2C/SPI housekeeping, and low-level diagnostics. The e500 core runs management software while the PCIe interface connects to the switch fabric ASIC. Industrial temperature rating and Trusted Boot security are essential for carrier-grade equipment. The 425-TEPBGA package enables dense linecard layouts. This application typically uses the P1010 alongside a higher-performance switch fabric CPU on the same chassis backplane.
Recommended
Recommended Products Summary
Engineering reference data for P1010NSN5FFA557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1010NSN5HFA | P1010NSN5FFB | P1014NSN5FFA | P1020NSN5FFA |
|---|---|---|---|---|---|
| Package | 425-TEPBGA | 425-TEPBGA (same) | 425-TEPBGA (same) | 425-TEPBGA (same) | 425-TEPBGA (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 800 MHz |
| Hardware Encryption | No (Trusted Boot only) | Yes (SEC engine) | No | No | No (variant dependent) |
| DDR3 Controller | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Gigabit Ethernet | Yes (integrated) | Yes | Yes | Yes | Yes (dual) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Approx. Unit Price | $27.18 (qty 1) | $30-$35 (qty 1) | $27-$32 (qty 1) | $28-$33 (qty 1) | $35-$45 (qty 1) |
Key Differentiators
- Cost-optimized without encryption engine for non-cryptographic designs (vs P1010NSN5HFA)
- Industrial temperature range with NXP long-life supply commitment (vs TI Sitara AM335x)
- Integrated Trusted Boot security engine (vs P1014NSN5FFA)
- Deterministic Power Architecture real-time performance (vs P1020NSN5FFA)
Design Notes
The 425-TEPBGA package requires a 6-layer (minimum) PCB stack-up with dedicated ground and power planes. Place a thermal via array directly under the exposed die pad to provide a low-impedance thermal path to the inner ground plane. Route DDR3 signals as matched-length pairs (within 25 mil tolerance for data, 50 mil for address/command), and place the DDR3 chips on the same PCB side as the P1010 to minimize via stubs on the memory bus.
Estimated: at 667 MHz core frequency with typical industrial workloads, the P1010NSN5FFA557 dissipates approximately 2.5-4W. With a 425-TEPBGA theta_JA of approximately 15-20 C/W (estimated, datasheet value required for confirmation), junction temperature rise is 40-80C above ambient. Within the 0-105C ambient industrial range, passive heatsinking via PCB copper pour is typically sufficient; for enclosed designs with restricted airflow, consider a small heatsink attached to the package top.
The P1010 requires multiple supply rails: core voltage (typically 1.0V), DDR3 I/O voltage (1.5V for DDR3, 1.35V for DDR3L), and standard 3.3V/2.5V I/O voltages. Power sequencing must follow NXP's prescribed order to prevent latch-up. Use a dedicated PMIC or supervisor IC (e.g., NXP MC34VR500) to generate and sequence the rails. Decoupling capacitors (0.1uF ceramic + bulk 10-47uF) must be placed within 5mm of each supply pin per datasheet guidelines.
Do not confuse the P1010NSN5FFA557 (no encryption, 667 MHz) with the P1010NSN5HFA (with encryption, 667 MHz) - the part numbers differ by only a few characters but feature sets vary significantly. Also verify the BGA ball mapping against the exact datasheet revision, as pin assignments may differ between P1010 and P1014 variants despite the shared 425-TEPBGA package outline. Always source firmware images and BSPs from NXP's official channels to ensure compatibility.
Compliance Information
RoHS and REACH compliant per NXP product page. Industrial temperature grade 0-105C. Not AEC-Q100 qualified (automotive); for automotive applications refer to NXP automotive-grade QorIQ variants.
