PIC16LF18325-E/SL - 8-bit 32MHz MCU, 14KB Flash, 14-SOIC | Microchip
MPN: PIC16LF18325-E/SL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.65 | $1.65 |
| 10 | $1.49 | $14.90 |
| 100 | $1.3 | $130.00 |
| 500 | $1.1 | $550.00 |
| 1,000 | $0.92 | $920.00 |
PIC16LF18325-E/SL Overview
What is a PIC16LF18325-class microcontroller? The PIC16F/LF183xx family belongs to Microchip's PIC® XLP™ (eXtreme Low Power) 16F family of 8-bit RISC microcontrollers. It sits inside the broader product hierarchy: PIC16LF18325 -> PIC16F183xx family -> PIC16F family -> PIC microcontroller -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. It is fabricated on a low-power CMOS process (the LF prefix denotes 1.8V-3.6V operation), making it suitable for battery-powered and energy-harvesting applications where the classic F1xx (2.3V-5.5V) variants would draw too much quiescent current.
Key features of the PIC16LF18325-E/SL include a 10-bit ADC with computation (ADC²), a 5-bit and 10-bit DAC, two 10-bit PWMs, Capture/Compare/PWM (CCP), Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), Complementary Waveform Generator (CWG), Peripheral Pin Select (PPS) for flexible signal mapping, EUSART, SPI, and I²C. It also integrates a comparator and runs from 1.8V to 3.6V. The device offers self-programming Flash, an instruction set optimized for C and assembler, and nanoWatt XLP sleep modes drawing nanoamps of standby current.
Typical applications include remote control and IoT sensor nodes, low-power wireless modules, small appliances and consumer devices, LED lighting controllers, sensor signal conditioning, general-purpose digital logic replacement, and battery-backed instrumentation. The Peripheral Pin Select feature lets designers remap digital peripherals (CLC, CWG, CCP, PWM, comms) onto most I/O pins, simplifying PCB layout when migrating between SOIC, QFN, and QFP package variants of the same die.
A key design consideration is that the LF suffix limits the supply to 3.6V maximum; if a 5V rail is present, choose the PIC16F18325 variant. Decoupling requires a 0.1 µF ceramic capacitor placed within a few millimetres of VDD with a low-ESR ground return, and the ICSP™ pins (PGED/PGEC) must be accessible for in-circuit programming.
This page synthesizes distributor pricing, verified drop-in same-package alternatives, and engineering design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC16LF18325-E/SL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18325-E/SL (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), MSL Level, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18325-I/SL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF18325-E/JQVAO
✅ Drop-In✓ In Stock
$1.95 / Unit
View Datasheet →PIC16LF18323-E/SL
✅ Drop-In✓ In Stock
$0.95 / Unit
View Datasheet →PIC16LF18324-E/SL
✅ Drop-In✓ In Stock
$0.6 / Unit
View Datasheet →PIC16LF1825-I/SL
✅ Drop-In✓ In Stock
$1.45 / Unit
View Datasheet →PIC16LF18325-E/SL Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC RISC |
| Family | PIC® XLP™ 16F |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| EEPROM | 256 bytes |
| Operating Voltage Range | 1.8 V to 3.6 V (LF series) |
| I/O Pins | 12 |
| ADC | 10-bit, with Computation (ADC²) |
| DAC | 5-bit and 10-bit |
| PWM | 2 x 10-bit |
| Package | 14-pin SOIC (SL), 0.154" / 3.90 mm body width |
| Mounting Type | Surface Mount |
| Operating Temperature (E suffix) | -40 C to +125 C |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 1 (unlimited floor life) |
| Qualification | Functional Safety (FuSa) family |
PIC16LF18325-E/SL Pin Configuration
| Pin 1 | RA5/ICSPDAT/ANA5 — Digital I/O / ICSP data / analog input 5 |
| Pin 2 | RA4/AN3/ANA4 — Digital I/O / analog input 3 / analog input 4 |
| Pin 3 | RA3/MCLR/VPP — Digital I/O / master clear (reset, active-low) / ICSP VPP |
| Pin 4 | RA2/ANA2/DAC6REF — Digital I/O / analog input 2 / DAC reference |
| Pin 5 | RA1/ICSPCLK/ANA1 — Digital I/O / ICSP clock / analog input 1 |
| Pin 6 | RA0/ANA0/DAC1OUT — Digital I/O / analog input 0 / DAC1 output |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA7/OSC1/CLKIN — Digital I/O / external oscillator input / external clock in |
| Pin 9 | RA6/OSC2/CLKOUT — Digital I/O / external oscillator output / clock out |
| Pin 10 | RC0/SOSCIO/ANA6 — Digital I/O / secondary oscillator I/O / analog input 6 |
| Pin 11 | RC1/SOSCIN/ANA7 — Digital I/O / secondary oscillator in / analog input 7 |
| Pin 12 | RC2/AN6/ANA8 — Digital I/O / analog input 6 / analog input 8 |
| Pin 13 | RC3/AN7/ANA9 — Digital I/O / analog input 7 / analog input 9 |
| Pin 14 | VDD — Positive supply input (1.8V-3.6V) |
Typical Applications
PIC16LF18325-E/SL is suitable for 7 applications: Battery-Powered IoT Sensor Nodes, Remote Control and Wireless Modules, Small Appliance and Consumer Devices, LED Lighting and Display Controllers, Sensor Signal Conditioning, Battery-Backed Instrumentation, Industrial Automation Modules.
Battery-Powered IoT Sensor Nodes
The PIC16LF18325-E/SL is engineered for battery-powered IoT sensor nodes where sub-µA standby current is critical to multi-year coin-cell life. Its 1.8V-3.6V LF process node and nanoWatt XLP sleep modes draw less than 100 nA in retention, while the 14 KB Flash can host LoRaWAN device firmware, BLE peripheral stacks, or Zigbee endpoint fragments alongside application logic. The 10-bit ADC with computation (ADC²) averages background readings autonomously, waking the CPU only on threshold crossings. With 12 I/O lines via PPS, designers can route SPI to one peripheral block and I2C to another without pin re-routing, enabling flexible PCB design such as temperature/humidity sensor plus PIR sensor accessory assemblies on shared rails.
Recommended
Remote Control and Wireless Modules
For 2.4 GHz or sub-GHz remote controls, the PIC16LF18325-E/SL's 32 MHz core and 1 KB SRAM comfortably handle timing-critical bit-banging for proprietary RF protocols, or UART hand-off to companion transceivers over SPI/I²C. Its low 1.8 V minimum supply lets designers use a single 3 V coin cell for both MCU and RF front-end, while PPS route EUSART/SPI to whichever GPIO is convenient for PCB layout. The CWG (Complementary Waveform Generator) and NCO (Numerically Controlled Oscillator) generate precise carrier frequencies and dead-band control for IR remote LEDs and PWM motor drivers, dropping BOM cost versus dedicated timer ICs.
Recommended
Small Appliance and Consumer Devices
Small appliances and consumer handheld devices benefit from the PIC16LF18325-E/SL's compact SOIC-14 footprint, integrated 5-bit and 10-bit DAC for audio cues, and 10-bit PWM for LED dimming or fan speed control. The peripheral pin select (PPS) flexibility lets a single PCB layout drive different sensor or actuator combinations across SKUs by re-mapping I/O in firmware. Built-in CLC cells implement glue logic - debouncing, edge detection, and time-delay relays - in hardware without external gates, reducing BOM cost and improving noise immunity versus discrete logic.
Recommended
LED Lighting and Display Controllers
The PIC16LF18325-E/SL's two 10-bit PWM channels and 5-bit/10-bit DAC suit it for multi-channel LED lighting drivers and small character-display controllers. Combined with the CWG, designers generate phase-shifted complementary drive for half-bridge LED strings with programmable dead-band, reducing audible noise and switching losses. The device runs from 1.8 V to 3.6 V, enabling direct operation from a 2xAA battery stack or regulated 3.3 V rail, while extended -40 C to +125 C temperature grade supports outdoor and industrial lighting installations.
Recommended
Sensor Signal Conditioning
The PIC16LF18325-E/SL integrates a 10-bit ADC with computation, a comparator, and a 5-bit/10-bit DAC in a single SOIC-14 package, making it ideal for analog sensor signal conditioning modules. The ADC² hardware performs averaging and oversampling autonomously, freeing CPU cycles for communication. The internal comparator and DAC enable threshold detection and offset adjustment in bridge sensor circuits, while the CLC cells implement digital filtering without external logic. This tight integration is valuable for thermocouple, strain gauge, and pressure-sensor front ends where PCB area is constrained.
Recommended
Battery-Backed Instrumentation
For battery-backed instrumentation such as handheld multimeters, portable data loggers, and field measurement tools, the PIC16LF18325-E/SL delivers up to 32 MHz processing, 256 B EEPROM for calibration constants, and 1 KB SRAM for measurement buffering - all in a 14-pin SOIC footprint. The LF supply range supports a single 3 V lithium primary cell, while XLP sleep modes extend shelf life when the device is idle. The EUSART and I²C peripherals connect to Bluetooth or USB-to-UART bridges for PC connectivity, and the 10-bit ADC captures sensor data with computation-based post-cycle noise rejection.
Recommended
Industrial Automation Modules
In industrial automation edge modules - sensor concentrators, actuator drivers, and protocol bridges - the PIC16LF18325-E/SL's -40 C to +125 C extended temperature range and 14-pin SOIC footprint enable harsh-environment deployment. Its 32 MHz core handles Modbus RTU or CANopen-over-UART framing, while the 10-bit ADC and comparator implement analog monitoring and overcurrent detection. The PPS and CLC blocks reduce external component count versus discrete or discrete-MCU designs, while the on-chip 10-bit PWM drives proportional valves or heater elements with deterministic timing for industrial automation edge modules.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18325-E/SL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18325-I/SL | PIC16LF18325-E/JQ | PIC16LF18323-E/SL | PIC16LF18324-E/SL | PIC16LF1825-I/SL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 14-SOIC (SL) | 14-SOIC (SL) - same | 14-SOIC (SL) - same | 14-SOIC (SL) - same | 14-SOIC (SL) - same | 14-SOIC (SL) - same |
| Operating Voltage | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 7 KB (-50%) | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 512 B (-50%) | 1 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature (Grade) | -40 C to +125 C (E, Extended) | -40 C to +85 C (I, Industrial) | -40 C to +125 C (E, Extended) | -40 C to +125 C (E, Extended) | -40 C to +125 C (E, Extended) | -40 C to +85 C (I, Industrial) |
| PPS / CLC / NCO / CWG | Yes | Yes | Yes | Yes | Yes | No (previous-gen, no PPS/CLC/NCO/CWG) |
Key Differentiators
- NanoWatt XLP technology for sub-100nA sleep current (vs PIC16LF1825-I/SL)
- PPS + CLC + NCO + CWG peripheral integration (vs PIC16LF1825-I/SL)
- 10-bit ADC with computation (ADC²) (vs PIC16LF18323-E/SL)
- Extended -40 C to +125 C temperature grade (vs PIC16F18325-I/SL)
Design Notes
The PIC16LF18325-E/SL runs from 1.8 V to 3.6 V; exceeding 3.6 V will damage the device. For 5 V systems, choose the PIC16F18325-I/SL on the same SOIC-14 footprint. A 0.1 µF ceramic decoupling capacitor must be placed within 3 mm of VDD (pin 14) with a low-impedance ground return to VSS (pin 7); add a 1 µF bulk capacitor on the VDD rail if multiple peripherals switch simultaneously. For battery-powered designs, place the MCU in sleep mode between events to leverage the nanoWatt XLP sub-100 nA retention current documented in the Microchip datasheet (40001795E).
The 14-pin SOIC (3.90 mm body) is footprint-compatible with most 14-pin SOIC peripherals. Leave at least 0.5 mm clearance between ICSP signals (PGED on RA5/ICSPDAT and PGEC on RA1/ICSPCLK) and any high-current switching nodes such as PWM outputs and even motor LED driver outputs to prevent programming glitches. The exposed copper pour should connect all VSS pins to a single ground plane, and ICSP connector traces must be short - Microchip recommends under 50 mm total length.
Do not confuse the LF (1.8-3.6 V) and F (2.3-5.5 V) variants - the package markings are similar and substituting one for the other will damage the LF device on a 5 V rail. Also note that the E suffix denotes the extended -40 C to +125 C temperature grade while I denotes -40 C to +85 C industrial; do not substitute I for E in outdoor or automotive under-hood designs. Finally, ensure the ICSP header (PGED/PGEC/VPP/VSS) is accessible after PCB assembly for in-circuit firmware updates - production boards without ICSP access require bootloader provisioning instead.
Route the crystal or external clock traces (OSC1/RA7 pin 8 and OSC2/RA6 pin 9) symmetrically with the load capacitors placed close to the crystal pins. Keep crystal traces short, surrounded by ground, and isolated from switching signals. If using the internal 32 MHz HFINTOSC, leave OSC1/OSC2 as GPIO and follow Microchip's AN1527 layout recommendations. Place analog inputs (RA0-RA5, RC0-RC3) away from digital switching traces to minimize ADC noise pickup; use Microchip's ADC² averaging mode for further rejection if needed.
Compliance Information
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade only); for AEC-Q100 see PIC16F18325-E/SLVAO automotive variants. Functional Safety (FuSa) family support per Microchip datasheet 40001795E.
