PIC18F14K22T-I/ML - 8-bit 64MHz XLP MCU 16KB Flash | Microchip
MPN: PIC18F14K22T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.54 | $25.40 |
| 100 | $2.21 | $221.00 |
| 500 | $1.96 | $980.00 |
| 1,000 | $1.74 | $1,740.00 |
| 3,000 | $1.58 | $4,740.00 |
PIC18F14K22T-I/ML Overview
A PIC18F microcontroller is an 8-bit Harvard-architecture MCU from Microchip's enhanced mid-range family, built around the nanoWatt XLP (eXtreme Low Power) technology platform. Within the broader taxonomy, PIC18F sits between the baseline PIC10/12/16 families and the high-performance dsPIC33/PIC32 lines, offering C-compiler-friendly instruction set, hardware multiplier, and self-programmable Flash.
Key features include 16 MIPS performance at 64 MHz (with on-chip 4x PLL from a 16 MHz internal oscillator), 17 I/O pins, 12 channels of 10-bit ADC, dual rail-to-rail comparators with programmable reference, two 8-bit and two 16-bit timers, EUSART, MSSP (SPI/I2C), and nanoWatt XLP sleep currents as low as 20 nA. The QFN-20 (4x4 mm) package is pin-compatible with PIC18F13K22 and PIC18F14K22 family variants.
Internally, the device combines a RISC core with hardware multiply, a 16-level hardware stack, 31 interrupt sources, and a 10-bit ADC capable of up to 100 ksps. The XLP technology implements multiple power-managed modes (Run, Idle, Sleep) and a dedicated low-power Timer1 oscillator for RTC-style operation.
Typical applications include low-power battery sensors, consumer remote controls, motor control for small BLDC fans, automotive body controllers (when qualified part is selected), and industrial sensor nodes. The 20-pin QFN footprint and 5.5V maximum VDD also support 4-20 mA loop instrumentation.
Design consideration: ensure the QFN central exposed pad (EP) is soldered to a sufficiently large copper pour (minimum 10 mm^2) to meet thermal dissipation requirements. For AEC-Q100 automotive deployments, prefer the PIC18F14K22T-I/MLVAO variant over the standard industrial grade.
This page synthesizes Microchip datasheet specifications, distributor pricing tiers, drop-in pin-compatible alternatives from the PIC18F1XK22 family, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for PIC18F14K22T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F14K22T-I/ML (same form factor and footprint) — differing in Package, Core Architecture, Timers, ADC, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F14K22-I/ML
✅ Drop-In✓ In Stock
$1.38 / Unit
View Datasheet →PIC18F14K22-I/SO
✅ Drop-In✓ In Stock
$0.96 / Unit
View Datasheet →PIC18F14K22-E/ML
✅ Drop-In✓ In Stock
$1.71 / Unit
View Datasheet →PIC18F14K22T-I/MLVAO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F13K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F13K22T-I/SO
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC18F14K22T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC18F 8-bit RISC (Harvard) |
| Maximum CPU Frequency | 64 MHz (16 MIPS with 4x PLL) |
| Program Memory (Flash) | 16 KB (8K x 16 words) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Operating Voltage Range | 2.5 V to 5.5 V |
| I/O Pins | 17 |
| ADC | 10-bit, 12 channels, up to 100 ksps |
| Comparators | 2 rail-to-rail with selectable FVR |
| Timers | 2x 8-bit, 2x 16-bit |
| Communication | 1x EUSART, 1x MSSP (SPI/I2C) |
| Package | 20-pin QFN (4x4 mm) with exposed pad |
| Operating Temperature | -40 C to +85 C (industrial) |
| Sleep Current (XLP) | 20 nA typical |
| RoHS Status | Compliant |
| MSL Level | 1 (unlimited floor life) |
PIC18F14K22T-I/ML Pin Configuration
| Pin 1 | RA3/AN3/C1IN+/VREF+ — Bidirectional I/O; analog input; comparator input; voltage reference input |
| Pin 2 | RA0/AN0/C1IN-/CVREF — Bidirectional I/O; analog input; comparator input; comparator voltage reference output |
| Pin 3 | RA1/AN1/C12IN0-/ICSPCLK — Bidirectional I/O; analog input; comparator input; ICSP clock |
| Pin 4 | RA2/AN2/C12IN0+/ICSPDAT — Bidirectional I/O; analog input; comparator input; ICSP data |
| Pin 5 | VDD — Positive supply voltage (2.5V to 5.5V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RA5/AN4/C2IN-/T1CKI — Bidirectional I/O; analog input; comparator input; Timer1 clock input |
| Pin 8 | RA4/AN5/T0CKI — Bidirectional I/O; analog input; Timer0 clock input |
| Pin 9 | RC0/SOSCO/T1OSC — Bidirectional I/O; Timer1 secondary oscillator output |
| Pin 10 | RC1/SOSCI/CCP2 — Bidirectional I/O; Timer1 secondary oscillator input; CCP2 |
| Pin 11 | RC2/AN6/P1D/C2IN+ — Bidirectional I/O; analog input; PWM output; comparator input |
| Pin 12 | RC3/AN7/P1C — Bidirectional I/O; analog input; PWM output |
| Pin 13 | RC4/AN8/P1B/SDA — Bidirectional I/O; analog input; PWM output; I2C data |
| Pin 14 | RC5/AN9/P1A/SCL — Bidirectional I/O; analog input; PWM output; I2C clock |
| Pin 15 | RC6/AN10/TX/CK — Bidirectional I/O; analog input; EUSART TX/clock |
| Pin 16 | RC7/AN11/RX/DT — Bidirectional I/O; analog input; EUSART RX/data |
| Pin 17 | RB7/AN13/PGD — Bidirectional I/O; analog input; ICSP data |
| Pin 18 | RB6/AN12/PGC — Bidirectional I/O; analog input; ICSP clock |
| Pin 19 | RB5/AN11/P1A — Bidirectional I/O; analog input; PWM output |
| Pin 20 | RB4/AN10/P1D — Bidirectional I/O; analog input; PWM output |
| Pin EP | EP — Exposed thermal pad - must be soldered to PCB ground plane |
Typical Applications
PIC18F14K22T-I/ML is suitable for 6 applications: Battery-Powered Wireless Sensor Nodes, Automotive Body Electronics (AEC-Q100), Industrial Sensor Instrumentation, Consumer Remote Controls and HMI, Small Motor Control (BLDC and Stepper), Medical Monitoring Wearables.
Battery-Powered Wireless Sensor Nodes
The PIC18F14K22T-I/ML's nanoWatt XLP 20 nA sleep current and 16 MIPS performance make it ideal for battery-powered wireless sensor nodes using sub-GHz radios like LoRa or sub-1GHz proprietary protocols. The 16 KB Flash accommodates Zigbee PRO, Thread, or BLE HCI firmware stacks with room for application code. Integrated 12-channel 10-bit ADC reads multiple analog sensors without external multiplexers. Designers pair the MCU with sleep-mode duty cycling where the radio wakes every 30-60 seconds; this combination routinely delivers 5-10 year battery life from two AA cells. The 20-pin QFN (4x4 mm) footprint suits compact PCB antennas and coin-cell sensor tags.
Recommended
Automotive Body Electronics (AEC-Q100)
The PIC18F14K22T-I/MLVAO AEC-Q100 qualified variant is suitable for automotive body electronics such as seat controllers, mirror adjusters, HVAC flaps, and rain sensors. The 5.5V supply tolerance directly handles automotive 12V rail transients after a pre-regulator. Operating from -40C to +125C (extended grade) supports under-hood and cabin environments. The integrated EUSART interfaces with CAN transceivers like MCP2515 via SPI-to-CAN bridges. The QFN-20 (4x4 mm) package withstands automotive vibration when properly soldered with a center exposed pad. AEC-Q100 Grade 2 qualification allows deployment in non-safety-critical body and comfort ECUs across passenger vehicle platforms.
Recommended
Industrial Sensor Instrumentation
The PIC18F14K22T-I/ML powers compact industrial sensor modules for pressure, temperature, level, and flow measurement. The dual rail-to-rail comparators enable ratiometric bridge sensor interfaces without an external op-amp, while the 10-bit ADC handles 4-20 mA loop digitization. The 2.5-5.5V supply range supports 3.3V and 5V industrial buses; the 64 MHz CPU executes auto-zero and linearization algorithms in real time. RS-485 connectivity is easily added via the EUSART plus an external transceiver. Designers favor this MCU over 32-bit alternatives when deterministic 8-bit response and low BOM cost matter more than raw processing power.
Recommended
Consumer Remote Controls and HMI
The PIC18F14K22T-I/ML is a workhorse for IR/RF remote controls, small appliances, and consumer HMI panels. Its 16 MIPS performance runs user-interface state machines, debounce logic, and LCD or LED segment drivers without an external co-processor. The integrated comparators handle touch sensing through the mTouch technology framework. XLP 20 nA sleep extends shelf life of battery-powered remotes to multiple years from a single coin cell. Designers can pair the MCU with an external EEPROM for user preferences, or use the internal 256-byte EEPROM for settings. The compact QFN-20 fits thin remote enclosures.
Recommended
Small Motor Control (BLDC and Stepper)
The PIC18F14K22T-I/ML drives small brushless DC and stepper motors in fans, dampers, and pump applications. The four timers (two 8-bit, two 16-bit) provide the PWM generation and commutation timing required for sensorless BLDC trapezoidal control. The integrated comparators detect back-EMF zero-crossing for sensorless operation, eliminating the need for Hall-effect sensors. The EUSART interfaces with external gate drivers like the MCP8024 or DRV8313 for higher-current three-phase designs. The compact 4x4 mm QFN keeps the MCU footprint tiny next to its motor driver.
Recommended
Medical Monitoring Wearables
The PIC18F14K22T-I/ML's nanoWatt XLP technology extends battery life in wearable medical monitoring devices such as pulse oximeters, single-lead ECG patches, and continuous glucose monitors. Sleep current as low as 20 nA enables months-long operation on small Li-ion cells. The 64 MHz CPU runs real-time biosignal filtering algorithms like FIR low-pass and moving-average smoothing at sample rates up to 1 kHz. The 10-bit ADC captures biosensor analog signals; the EUSART streams processed data over BLE or proprietary RF links. QFN-20 4x4 mm packaging suits the small wrist-worn or patch-mounted form factors typical in medical wearables.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F14K22T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F14K22-I/ML | PIC18F14K22-E/ML | PIC18F14K22T-I/MLVAO | PIC18F13K22-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-pin QFN (4x4) | 20-pin QFN (4x4) - same | 20-pin QFN (4x4) - same | 20-pin QFN (4x4) - same | 20-pin QFN (4x4) - same |
| Flash Memory | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB |
| SRAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 256 bytes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (AEC-Q100 Grade 2) | -40C to +85C (Industrial) |
| AEC-Q100 Automotive | No (use /MLVAO) | No | No | Yes | No |
| Maximum CPU Frequency | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Sleep Current (XLP) | 20 nA typical | 20 nA typical | 20 nA typical | 20 nA typical | 20 nA typical |
| ADC Channels | 12 channels, 10-bit | 12 channels, 10-bit | 12 channels, 10-bit | 12 channels, 10-bit | 11 channels, 10-bit |
| Packaging Format | Tape & Reel (T suffix) | Tray | Tray | Tape & Reel | Tray |
Key Differentiators
- Industrial temperature grade with tape-and-reel packaging (vs PIC18F14K22-I/ML)
- Pin-compatible with PIC18F13K22 family for memory scalability (vs PIC18F13K22-I/ML)
- AEC-Q100 variant available for automotive grade (vs PIC18F14K22T-I/MLVAO)
Design Notes
The 20-pin QFN (4x4 mm) package relies on the central exposed pad (EP) for thermal dissipation. The EP must be soldered directly to a PCB copper pour with a minimum area of 10 mm^2 (recommended 30+ mm^2) connected to ground. Without proper EP soldering, junction temperature can exceed limits under high CPU load. Per Microchip layout guidelines, use thermal vias in the EP pour (typical 4-9 vias at 0.3 mm drill) to conduct heat to inner PCB planes. For continuous 64 MHz operation at 5V VDD, estimate power dissipation at approximately 60-90 mW, which is well within the QFN thermal envelope when EP is properly soldered.
Place a 100 nF decoupling capacitor as close as possible to VDD pin 5 with the ground side connected to the EP/ground pour. Add a bulk 10 uF capacitor near the supply input to handle transient switching currents. Route the 16 MHz external crystal traces (if used instead of internal oscillator) symmetrically with short traces and guard ground. For ICSP programming pins PGC (RB6) and PGD (RB7), keep the trace lengths short and avoid routing them near high-frequency switching nodes. The ICSP connector footprint should accommodate the Microchip PICkit 4 pinout standard.
Three common pitfalls when designing with the PIC18F14K22T-I/ML: (1) Failing to solder the exposed pad - this causes thermal failure under load and violates the datasheet's thermal resistance specification of 39 C/W theta_JA. (2) Configuring CONFIG registers incorrectly - the default configuration after POR uses the internal oscillator, but PLL must be explicitly enabled in CONFIG1H to reach 64 MHz; without PLL the CPU runs at 16 MHz. (3) Not enabling low-voltage programming (LVP) correctly when using ICSP - use the LVP bit in CONFIG4L or use HV programming (MCLR high voltage) for production. Also verify that the BOR (Brown-Out Reset) voltage setting matches the application's minimum VDD to avoid unexpected resets.
For battery-powered designs, take full advantage of nanoWatt XLP sleep modes. Configure the MCU to enter Sleep between sensor reads, wake via Watchdog Timer (typically every 8 seconds), or via an external interrupt on RB0/INT. Disable unused peripherals in firmware using the PMD (Peripheral Module Disable) registers; each disabled peripheral saves 1-3 uA. For 3V coin-cell designs, the 20 nA sleep current plus intermittent 64 MHz active bursts (8 mA typical at 64 MHz) yields an average system current around 100 uA for a typical sensor read every 10 seconds, giving 2-3 years from a CR2032 cell.
Compliance Information
RoHS compliant per Microchip product page. Standard /ML part is not AEC-Q100 qualified; choose /MLVAO variant for AEC-Q100 Grade 2 automotive deployment. Halogen-free and lead-free per Microchip material declaration.
