PIC24HJ64GP502-E/MM - 40 MIPS 16-Bit MCU | Microchip
MPN: PIC24HJ64GP502-E/MM ✓ ActivePIC24HJ64GP502-E/MM Overview
A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripheral interfaces, and control logic on one chip. The PIC24H family uses a 16-bit architecture suited to industrial, automotive, communications, and embedded-control applications. Within the product hierarchy, the PIC24HJ64GP502-E/MM belongs to the PIC24H microcontroller family and combines high-performance embedded control with peripheral integration in a small QFN package.
The device's headline resources are its 40 MIPS execution capability, 64 KB of Flash program memory, and 28-pin QFN-S implementation. Flash memory retains firmware without a separate nonvolatile memory component, while the 16-bit architecture supports efficient handling of control loops and fixed-point calculations. The -E/MM ordering designation identifies the automotive temperature-grade variant in the 28-QFN-S package.
Microchip positions the PIC24H 16-bit device family for applications requiring high-speed, repetitive computation as well as control. The family is designed to share a high level of peripheral compatibility with compatible dsPIC33F devices, which can simplify architecture planning when engineers evaluate control-oriented alternatives. Its processing performance also supports deterministic loops in motor-control and signal-processing systems.
Typical applications include industrial motor controllers, automotive control modules, digital power converters, industrial communication equipment, data-acquisition systems, and compact embedded-control products. In each case, the 40 MIPS performance provides processing headroom, while 64 KB of Flash accommodates a substantial control program, protocol stack, configuration data, and diagnostic routines.
Board design should account for the 28-QFN-S footprint, exposed thermal-pad requirements, power-supply decoupling, and signal-routing constraints associated with high-performance mixed-signal control systems. Use the manufacturer pin description table and package drawing when assigning PCB pads and nets. Confirm peripheral availability, ADC performance, RAM capacity, and exact electrical limits against the PIC24HJ64GP502 datasheet before freezing the design.
This product page combines the verified orderable MPN, package information, operating-temperature range, performance specifications, sourcing guidance, and practical design considerations. It also identifies the verified same-footprint option while clearly separating confirmed facts from parameters that require confirmation in the manufacturer documentation.
Drop-in alternatives for PIC24HJ64GP502-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24HJ64GP502-E/MM (same form factor and footprint).
PIC24HJ64GP502-I/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24HJ64GP502-E/MM Maximum Ratings & Electrical Characteristics
| Product Type | 16-bit RISC microcontroller |
| CPU Architecture | PIC24 16-bit architecture |
| Maximum Performance | 40 MIPS |
| Program Memory | 64 KB Flash |
| Flash Organization | 22K x 24 bits |
| Package | 28-QFN-S (6 x 6 mm) |
| Pin Count | 28 pins |
| Terminal Form | No-lead |
| Package Shape | Square |
| Mounting Type | Surface mount |
| Operating Temperature Range | -40°C to +125°C |
| Temperature Grade | Automotive |
| Device Family | PIC24H |
| Programmable Memory Type | Flash |
| DMA | Present in PIC24H family |
PIC24HJ64GP502-E/MM square Pin Configuration Guide
Pin configuration for PIC24HJ64GP502-E/MM (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC24HJ64GP502-E/MM.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC24HJ64GP502-E/MM is suitable for 6 applications: Industrial Motor Control, Automotive Control Modules, Digital Power Conversion, Industrial Communication Equipment, Data Acquisition and Condition Monitoring, Embedded Control Instruments.
Industrial Motor Control
PIC24HJ64GP502-E/MM fits compact industrial motor controllers that combine deterministic control loops with operating temperatures from -40°C to +125°C. Its 40 MIPS 16-bit architecture provides processing headroom for PWM sequencing, current-control calculations, fault handling, and supervisory communications, while 64 KB of Flash can retain control code, parameter tables, and diagnostics. Place the MCU close to the power stage and follow the manufacturer layout guidance for the exposed thermal pad, grounding, and sensitive analog inputs. Confirm the required timer, PWM, ADC, and communications resources in the PIC24HJ64GP502 datasheet before assigning control and feedback nets.
Recommended
Automotive Control Modules
The PIC24HJ64GP502-E/MM is suited to automotive auxiliary and body-control modules that require fast repetitive computation in an extended-temperature environment. The 16-bit core operates at up to 40 MIPS, allowing the firmware to combine actuator timing, sensor interpretation, diagnostics, and communication handling, while 64 KB of Flash supports a meaningful embedded application without an external program-memory device. The -40°C to +125°C rating provides a defined environmental operating range. Validate AEC-Q100 qualification, transient requirements, brownout behavior, and all peripheral resources against the manufacturer documentation before production release.
Recommended
Digital Power Conversion
PIC24HJ64GP502-E/MM can serve as the supervisory controller in a digitally controlled power converter because its 40 MIPS performance supports fast sampling, compensation calculations, fault decisions, and communication updates. The 16-bit architecture is useful for fixed-point control arithmetic, and 64 KB of Flash can retain control tables, configuration data, firmware update logic, and telemetry handlers. Use the MCU primarily for control and supervision rather than as the power switch itself. Verify ADC timing, PWM resolution, timer availability, and analog input limits in the manufacturer datasheet, then isolate switching-node signals from sensitive control traces.
Recommended
Industrial Communication Equipment
PIC24HJ64GP502-E/MM is appropriate for protocol gateways, sensor nodes, and industrial communication controllers that combine real-time control with network servicing. Its 40 MIPS 16-bit architecture can support packet processing alongside timers, data acquisition, and local diagnostics, and its 64 KB Flash capacity accommodates firmware, protocol state machines, and configuration data. The -40°C to +125°C range supports industrial equipment exposed to temperature variation. Confirm the required serial interfaces, DMA behavior, peripheral mappings, and I/O levels in the datasheet, and isolate communication and power domains to reduce conducted-noise coupling.
Recommended
Data Acquisition and Condition Monitoring
PIC24HJ64GP502-E/MM can coordinate high-rate data acquisition and condition-monitoring functions where rapid repetitive computation is needed alongside precise peripheral control. The 40 MIPS 16-bit processor provides capacity for sampling schedules, filtering, feature extraction, alarms, and data transfer, while 64 KB of Flash stores application firmware and local parameters. Its -40°C to +125°C rating allows use in demanding monitoring environments. Confirm ADC resolution, sampling characteristics, input count, DMA operation, and trigger resources in the manufacturer datasheet. Use short, shielded analog paths and a quiet grounding strategy to protect measurement quality.
Recommended
Embedded Control Instruments
PIC24HJ64GP502-E/MM fits embedded instruments that need responsive control, local storage, and a compact 28-QFN-S footprint. Its 40 MIPS execution capability supports menu state, calibration, signal conditioning, timing, and communications, while 64 KB of Flash holds firmware and fixed parameters. The 6 x 6 mm package supports space-constrained products, although the exposed thermal pad and fine-pitch routing require careful PCB planning. Verify the analog measurement front end, DAC requirements, timer channels, and supported development tools in the manufacturer documentation. Maintain solid ground continuity and place decoupling exactly as shown in the reference design.
Recommended
Engineering reference data for PIC24HJ64GP502-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24HJ64GP502-I/MM |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6 x 6 mm) | 28-QFN-S (6 x 6 mm) - same |
| CPU Architecture | 16-bit | 16-bit |
| Maximum Performance | 40 MIPS | 40 MIPS |
| Program Memory | 64 KB Flash | 64 KB Flash |
| Flash Organization | 22K x 24 bits | 22K x 24 bits |
| Pin Count | 28 pins | 28 pins |
| Temperature Grade | Automotive -E grade | I grade |
Key Differentiators
- Extended-temperature automotive ordering option (vs PIC24HJ64GP502-I/MM)
- High-speed 16-bit control performance (vs PIC24HJ64GP502-I/MM)
- Identical memory configuration (vs PIC24HJ64GP502-I/MM)
- Direct footprint reuse (vs PIC24HJ64GP502-I/MM)
Design Notes
Use the manufacturer land pattern for the 28-QFN-S, 6 x 6 mm package and confirm the exposed-pad connection and paste pattern before releasing artwork. Fine-pitch perimeter routing and the central thermal pad require a controlled manufacturing process. Place input and output decoupling capacitors close to their assigned supply pins, provide a low-impedance ground reference, and avoid routing fast switching or high-current power paths beneath sensitive analog inputs.
Follow the recommended decoupling network and power-up sequence in the PIC24HJ64GP502 family documentation. Keep the MCU supply loop physically small and provide local bulk capacitance where the reference design calls for it. Check input-voltage limits, core voltage requirements, brownout behavior, and current consumption at the selected clock and peripheral configuration. Do not derive these electrical limits from the distributor summary; verify them in the manufacturer datasheet.
The 28-QFN-S package has no exposed leads on its perimeter, so thermal performance depends heavily on the exposed pad, solder assembly, and PCB copper. Use the manufacturer thermal and land-pattern guidance to determine pad connection, via arrangement, and copper area. Estimate worst-case junction temperature from actual ambient temperature, device dissipation, and the assembled-board thermal resistance. Ensure the firmware clock and peripheral configuration do not create unnecessary sustained power dissipation.
Avoid treating the base PIC24HJ64GP502 identifier as a complete orderable code, because package and temperature-grade suffixes affect procurement and qualification. The -E/MM device is specified for -40°C to +125°C operation and uses the 28-QFN-S package. Also avoid assuming peripheral pins, ADC limits, RAM capacity, or development-tool support from family-level descriptions. Confirm each function and electrical limit against the exact device documentation before schematic and firmware release.
Compliance Information
The -E/MM ordering code is identified as automotive temperature grade, but no explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declaration was identified for this exact MPN.
