PIC32MM0064GPL020T-I/ML - 32-bit 25MHz 64KB Flash MCU | Microchip
MPN: PIC32MM0064GPL020T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.65 | $26.50 |
| 100 | $2.2 | $220.00 |
| 500 | $1.85 | $925.00 |
| 1,000 | $1.6 | $1,600.00 |
PIC32MM0064GPL020T-I/ML Overview
A 32-bit microcontroller (MCU) is a single-chip processor integrating CPU core, Flash program memory, SRAM data memory, and peripherals such as timers, ADC, communication interfaces, and GPIO into one package. The PIC32MM family in particular targets eXtreme Low Power (XLP) applications where battery life and standby current dominate the design budget, while delivering 32-bit MIPS performance at the cost of an 8-bit MCU. The 'GPL' sub-family combines this low-power DNA with general-purpose peripherals for cost-sensitive embedded designs.
Key features of the PIC32MM0064GPL020T-I/ML include 25 MHz core speed (38 DMIPS), 64 KB Flash with 4 KB SRAM, multiple low-power modes including 500 nA Deep Sleep, 9-channel 12-bit ADC, three op-amps, and configurable peripherals via Peripheral Pin Select (PPS). The 20-pin QFN (4x4 mm) package provides the smallest form factor in the family while exposing a thermal pad for improved power dissipation.
Architecturally, the MIPS32 microAptiv core uses a 5-stage pipeline with branch prediction and zero overhead loop support, while on-chip peripherals include 12-bit ADC, comparators, configurable logic cells, and PWM/IC/OC timers. The integrated op-amps and configurable logic reduce external component count for sensor-interface and motor-control designs. The 'GPL' part is the general-purpose variant; the 'GPM' variant adds motor-control PWMs, and the 'GPS' variant adds segmented LCD drivers.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, low-cost motor control, touch-interface front-ends, and space-constrained consumer electronics. The 500 nA sleep current suits coin-cell designs such as BLE beacons, environmental sensors, and remote controls.
Design consideration: the 20-pin QFN (4x4 mm) requires careful PCB thermal-via stitching under the exposed pad to keep junction temperature within the -40C to +85C industrial range. At full 25 MHz operation with peripherals active, decoupling with 100 nF ceramic caps placed within 2 mm of VDD pins is essential for stable ADC sampling.
This page synthesizes distributor pricing, drop-in alternatives within the same 20-pin QFN footprint, and practical design notes not consolidated in any single manufacturer datasheet.
Drop-in alternatives for PIC32MM0064GPL020T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MM0064GPL020T-I/ML (same form factor and footprint) — differing in ADC, Package, Operating Temperature, Operating Voltage Range, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MM0032GPL020T-I/ML
✅ Drop-In✓ In Stock
$1.9 / Unit
View Datasheet →PIC32MM0016GPL020-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.1 / Unit
View Datasheet →PIC32MM0032GPL020-E/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$0.89 / Unit
View Datasheet →PIC32MM0032GPL020T-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.55 / Unit
View Datasheet →PIC32MK1024GPD064T-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →PIC32MM0064GPL020T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv UC |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Speed | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Operating Voltage Range | 2.5 V to 3.6 V (typical 3.3 V) |
| Deep Sleep Current | 500 nA (typical) |
| Package | 20-pin QFN (4x4 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial, 'I') |
| Connectivity | I2C, SPI, UART |
| Peripherals | Op-amps, comparators, PWM, timers, PPS |
| RoHS Status | Compliant |
PIC32MM0064GPL020T-I/ML 20-pin qfn (4x4 mm) with exposed pad Pin Configuration Guide
Pin configuration for PIC32MM0064GPL020T-I/ML (20-pin qfn (4x4 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MM0064GPL020T-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MM0064GPL020T-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Low-Cost Motor Control (BLDC/PWM), Touch Interface / Capacitive Sensing Front-Ends, Smart Home / Building Automation, Remote Controls and Consumer Electronics.
Battery-Powered IoT Sensor Nodes
The PIC32MM0064GPL020T-I/ML's 500 nA Deep Sleep current and 25 MHz MIPS32 microAptiv core make it ideal for battery-powered IoT sensor nodes operating from coin cells or 2xAA packs. With 64 KB Flash, designers can include full LoRaWAN or BLE stack support plus sensor drivers, while waking periodically for measurements and transmissions. The integrated 12-bit ADC and three op-amps reduce external component count for sensor signal conditioning, extending battery life beyond what discrete analog solutions would achieve.
Recommended
Wearable Health Monitors
The PIC32MM0064GPL020T-I/ML's 4x4 mm QFN package and 500 nA sleep current fit wearable health monitors like fitness bands, heart-rate patches, and continuous glucose monitors. The 32-bit MIPS core executes biosignal processing algorithms (PPG, ECG filtering) in real time while the integrated op-amps condition sensor signals directly. With 64 KB Flash, designers can include firmware update capability without external memory, keeping the BOM compact for compliance with small-form-factor medical device enclosures.
Recommended
Low-Cost Motor Control (BLDC/PWM)
The PIC32MM0064GPL020T-I/ML provides PWM generation, fast ADC sampling, and three integrated op-amps for current sensing - all in a 20-pin QFN footprint suitable for small BLDC fans, pumps, and appliance drives. At 25 MHz, the core executes sensorless FOC or trapezoidal commutation algorithms with adequate loop bandwidth. Note: For more demanding motor control with high-resolution PWM, the PIC32MM GPM variant adds dedicated motor-control peripherals - choose GPL for cost-sensitive low-power drives.
Recommended
Touch Interface / Capacitive Sensing Front-Ends
The PIC32MM0064GPL020T-I/ML supports mTouch capacitive touch sensing via the on-chip Charge Time Measurement Unit (CTMU), enabling touch buttons, proximity sensors, and slider interfaces without external touch ICs. The 12-bit ADC and configurable peripherals (via PPS) provide flexibility for custom touch patterns. The 64 KB Flash accommodates gesture recognition firmware and proximity-based wake-up algorithms that leverage the 500 nA Deep Sleep mode for battery-powered remote controls and smart switches.
Recommended
Smart Home / Building Automation
The PIC32MM0064GPL020T-I/ML is well suited for smart home devices like Zigbee/BLE smart plugs, dimmers, thermostats, and door/window sensors. Its industrial temperature range (-40C to +85C) and 500 nA sleep current enable multi-year battery operation for door sensors, while the 25 MHz MIPS core handles the wireless protocol stack and local control logic. PPS allows flexible pin assignment for various communication peripheral configurations (UART, SPI, I2C) without PCB rework.
Recommended
Remote Controls and Consumer Electronics
The PIC32MM0064GPL020T-I/ML powers next-generation IR/RF remote controls with voice activation, gesture recognition, and bidirectional communication. Its low sleep current suits always-listening wake-word detection, while the 25 MHz core processes audio streams for voice command decoding. The integrated op-amps amplify microphone signals directly, eliminating external analog front-end ICs and reducing the BOM. The compact 4x4 mm QFN package enables ultra-slim remote designs that consumers prefer.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MM0064GPL020T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MM0032GPL020T-I/ML | PIC32MM0016GPL020-I/SS | PIC32MM0032GPL020-E/SS | PIC32MM0032GPL020T-I/SS |
|---|---|---|---|---|---|
| Package | 20-QFN (4x4 mm) | 20-QFN (4x4 mm) - same | 20-QFN (4x4 mm) family | 20-QFN (4x4 mm) family | 20-QFN (4x4 mm) family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 32 KB (-50%) | 16 KB (-75%) | 32 KB (-50%) | 32 KB (-50%) |
| Core Speed | 25 MHz | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) |
| Operating Voltage | 2.5V to 3.6V | 2.5V to 3.6V (same) | 2.5V to 3.6V (same) | 2.5V to 3.6V (same) | 2.5V to 3.6V (same) |
| Core Architecture | MIPS32 microAptiv UC | MIPS32 microAptiv UC (same) | MIPS32 microAptiv UC (same) | MIPS32 microAptiv UC (same) | MIPS32 microAptiv UC (same) |
| Deep Sleep Current | 500 nA | 500 nA (same) | 500 nA (same) | 500 nA (same) | 500 nA (same) |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
Key Differentiators
- Lowest sleep current in 32-bit MCU category at 500 nA (vs PIC32MM0032GPL020T-I/ML)
- Smallest form factor in PIC32MM family at 4x4 mm (vs PIC32MM0064GPL020T-I/SS (SSOP variant))
- Integrated op-amps eliminate external analog ICs (vs Generic Cortex-M0+ MCU alternatives)
Design Notes
The PIC32MM0064GPL020T-I/ML Deep Sleep mode draws only 500 nA typical, but achieving this requires proper configuration: disable all unused peripherals via PMD registers, set all unused I/O pins to digital outputs driving low (not high-Z), and ensure ADC is powered down between conversions. Estimated: a typical sensor-node application waking every 10 seconds for 50 ms measurements achieves average current of under 5 uA, giving 5+ years on a 1000 mAh coin cell.
The 20-pin 4x4 mm QFN package with exposed pad requires PCB thermal-via stitching directly beneath the EP for heat spreading. Place a 3x3 grid of 0.3 mm thermal vias (0.2 mm drill) connecting the EP to an internal ground plane. Without this stitching, junction-to-ambient thermal resistance rises from approximately 40 C/W to over 80 C/W, risking thermal shutdown during sustained 25 MHz operation with all peripherals active.
Place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin (the PIC32MM0064GPL020T-I/ML has multiple VDD pins on different sides of the package). Add a single 10 uF bulk capacitor near the IC. Route ADC analog signals away from digital switching traces and use a ground pour on the top layer under the QFN. For ADC accuracy, use a separate analog ground pin if available, and connect AGND to DGND only at one point.
Do not omit the exposed pad (EP) solder connection - it is the primary thermal path AND ground connection for the MCU. Cold or missing solder joints here cause erratic behavior and ADC errors. PPS (Peripheral Pin Select) must be configured and locked after programming; an unlocked PPS allows accidental remapping in production firmware that breaks UART/SPI communication. Always include a JTAG/ICSP header or test pads for in-field firmware update capability.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C) is not AEC-Q100 qualified; for automotive designs consider PIC32MM AEC-Q100 variants if available in same package.
