PIC32MZ0512EFK100-I/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
MPN: PIC32MZ0512EFK100-I/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.85 | $11.85 |
| 10 | $10.66 | $106.60 |
| 100 | $9.49 | $949.00 |
| 500 | $8.55 | $4,275.00 |
| 1,000 | $7.61 | $7,610.00 |
PIC32MZ0512EFK100-I/GJX Overview
A 32-bit microcontroller (MCU) is an integrated processor that combines a CPU core, memory (Flash and SRAM), and configurable peripherals on a single silicon die. The PIC32MZ family belongs to the broader category of embedded microcontrollers used in industrial, IoT, automotive, and graphics/HMI applications. These MCUs sit below application processors and above simple 8/16-bit microcontrollers in compute capability, providing deterministic real-time performance with rich connectivity options. The EF (Embedded Connectivity with FPU) sub-family specifically targets connected applications requiring Ethernet, USB, and CAN alongside high-throughput DSP and floating-point math.
Key features include dual-panel Flash for live-update support, a 12-bit 18 MSPS 40-channel ADC module, a memory management unit (MMU) for optimum embedded OS execution, and crypto acceleration hardware. The 100-TFBGA package provides a compact 7x7 mm footprint suitable for space-constrained designs while exposing up to 78 GPIO, multiple UART/SPI/I2C/CAN interfaces, HS USB, and Ethernet MAC. Operating voltage ranges from 2.1 V to 3.6 V across an industrial temperature range of -40 C to +85 C.
Architecturally, the PIC32MZ0512EFK100 uses a superscalar MIPS core with separate instruction and data caches, allowing sustained 200 MHz operation even with memory-intensive protocols. The FPU and DSP extensions significantly accelerate signal-processing kernels such as FFT, FIR filtering, and motor-control loops, often eliminating the need for a companion DSP chip. The crypto engine handles AES, DES, SHA, and RNG primitives without CPU intervention, reducing firmware overhead for secure-connected applications.
Typical applications include industrial IoT gateways, automotive infotainment and body controllers, graphics HMI panels, motor-control BLDC/PMSM drives, audio processing systems, and connected medical devices. The combination of CAN, USB, and Ethernet connectivity makes the part especially well-suited for industrial protocol bridges and HMI terminals.
When designing with the PIC32MZ0512EFK100-I/GJX, allocate PCB area for at least four 0.1 uF decoupling capacitors near the power pins and follow Microchip's recommended BGA fanout and via pattern to maintain signal integrity on high-speed interfaces. The TFBGA-100 package requires careful PCB-level thermal management; refer to Microchip's family datasheet for thermal design guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MZ0512EFK100-I/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ0512EFK100-I/GJX (same form factor and footprint) — differing in Package, Core Architecture, ADC, Ethernet, FPU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ0512EFK100T-I/GJX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024EFK100-I/GJX
✅ Drop-In✓ In Stock
$5.41 / Unit
View Datasheet →PIC32MZ0512EFK100-E/GJX
✅ Drop-In✓ In Stock
$9.65 / Unit
View Datasheet →PIC32MZ0512EFF100-I/GJX
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.85 / Unit
View Datasheet →PIC32MZ0512EFK100-I/GJX Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M-Class |
| Core Architecture | 32-bit MIPS with FPU and DSP extensions |
| Maximum CPU Frequency | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (single and double precision) |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Operating Voltage | 2.1 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| ADC | 12-bit, 18 MSPS, 40-channel |
| GPIO Count | 78 |
| Package | 100-TFBGA (7x7 mm) |
| Mounting Type | Surface Mount |
| Connectivity | HS USB, Ethernet MAC, CAN, UART, SPI, I2C |
| Crypto Engine | AES, DES, SHA, RNG hardware acceleration |
| RoHS Status | Compliant |
PIC32MZ0512EFK100-I/GJX 100-tfbga (7x7 mm) Pin Configuration Guide
Pin configuration for PIC32MZ0512EFK100-I/GJX (100-tfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ0512EFK100-I/GJX.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ0512EFK100-I/GJX is suitable for 6 applications: Industrial IoT Gateways, Automotive Infotainment HMI, BLDC Motor Control, Audio Processing Devices, Graphics HMI Terminals, Connected Medical Devices.
Industrial IoT Gateways
The PIC32MZ0512EFK100-I/GJX is well suited for industrial IoT gateways requiring deterministic TCP/IP performance over Ethernet plus secure cloud connectivity. Its 200 MHz MIPS core and 128 KB SRAM comfortably run lwIP + TLS 1.2 stacks, while the AES/SHA crypto engine offloads handshake acceleration. The 12-bit 18 MSPS ADC handles 4-20 mA sensor inputs at full throughput, and the integrated Ethernet MAC eliminates external PHY glue logic, reducing BOM cost by $1-2 per node.
Recommended
Automotive Infotainment HMI
For automotive infotainment HMI panels, the PIC32MZ0512EFK100-I/GJX's 200 MHz throughput drives TFT LCD controllers and touch I2C interfaces while leaving CPU headroom for CAN diagnostics and graphics rendering. The FPU accelerates scaling/anti-aliasing routines without burdening the main thread. Industrial temperature grade (-40 to +85 C) is acceptable for cabin-mounted head units; under-hood designs should choose the -E/GJX extended temperature variant (-40 to +125 C) instead.
Recommended
BLDC Motor Control
The PIC32MZ0512EFK100-I/GJX's hardware FPU and DSP extensions deliver field-oriented control (FOC) loops for BLDC/PMSM motors at switching frequencies up to 30 kHz with sub-microsecond execution. The 12-bit 18 MSPS ADC simultaneously samples phase currents and BEMF voltages via DMA, freeing the CPU to focus on control math. 512 KB Flash accommodates sensorless startup firmware plus telemetry logging, while 78 GPIO drive inverter gate drivers, Hall sensors, and encoder quadrature inputs directly.
Recommended
Audio Processing Devices
For audio DSP applications such as digital mixers, headphone amplifiers with EQ, and active speaker crossovers, the PIC32MZ0512EFK100-I/GJX offers a 200 MHz MIPS core with IEEE 754 FPU capable of running multi-band biquad filters and FFT-based spectrum analysis in real time. The I2S/SSI peripheral interfaces directly to S/PDIF transmitters and audio DACs. Crypto engine remains unused but does not consume power when disabled, preserving the 50 mA typical active current budget for battery-powered speakers.
Recommended
Graphics HMI Terminals
Industrial graphics HMI terminals benefit from the PIC32MZ0512EFK100-I/GJX's 200 MHz throughput and 78 GPIO, which drive parallel TFT displays up to WVGA resolution via the integrated LCD controller. The 512 KB Flash holds asset libraries and language tables for multilingual UIs, while 128 KB SRAM supports double-buffered framebuffers for flicker-free updates. Hardware crypto accelerates user authentication and secure firmware bootload, critical for IEC 62443-compliant industrial control panels.
Recommended
Connected Medical Devices
Connected medical devices such as patient monitors, infusion pumps, and portable diagnostic tools leverage the PIC32MZ0512EFK100-I/GJX's Ethernet and USB connectivity to stream vital signs while the AES hardware crypto engine secures HIPAA-compliant data transmission. The 12-bit 18 MSPS ADC captures ECG, SpO2, and temperature sensor signals with sufficient resolution for clinical-grade measurements. Industrial temperature rating supports clinical environments; designers should add IEC 60601 isolation externally since the MCU does not provide reinforced isolation.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ0512EFK100-I/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ0512EFK100T-I/GJX | PIC32MZ1024EFK100-I/GJX | PIC32MZ0512EFK100-E/GJX | PIC32MZ0512EFF100-I/GJX |
|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 1024 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Packaging Format | Tray | Tape & Reel | Tray | Tray | Tray |
| FPU + Crypto | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Dual-panel Flash for live firmware updates (vs PIC32MX795F512L-80I/PT)
- 4x core throughput (vs PIC32MX570F512L-I/PT)
- Hardware crypto engine (vs PIC32MX470F512H-I/PT)
Design Notes
Estimated: TFBGA-100 requires 0.6 mm pitch via-in-pad or dog-bone fanout. Place at least four 0.1 uF X7R ceramic decoupling capacitors within 2 mm of the VDD/VSS power pairs. Route all differential pairs (USB, Ethernet) with 90 ohm differential impedance and length-matching within 150 mil. Add a ground plane cutout under the BGA to reduce thermal resistance and provide direct solder-joint inspection access.
Estimated: At 200 MHz full-load with all peripherals active, typical power dissipation is around 200-250 mW. The TFBGA-100 has theta_JA of approximately 40 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of 8-10 C above ambient - well within safe limits. For sealed enclosures with limited airflow, add thermal vias under the package center ball array to expose the die flag to the bottom-side copper pour.
Three common pitfalls when migrating from PIC32MX to PIC32MZ: (1) PIC32MZ requires the 3.3 V rail to ramp monotonically - brown-out reset is more aggressive; (2) the peripheral library (PLIB) API changed substantially; (3) ICSP programming uses different PGECx/PGEDx pin pairs than legacy MX devices - any pair works, but you must use the matched pair. Reference the family errata DS80000496 before committing to a design.
Compliance Information
RoHS and lead-free compliant per JLCPCB and Microchip product page. Not AEC-Q100 qualified in this industrial-temperature grade; automotive designs requiring AEC-Q100 should evaluate other PIC32MZ variants.