PIC32MX250F256H-I/MR - 256KB Flash 32-bit MCU 64-QFN | Microchip
MPN: PIC32MX250F256H-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.95 | $6.95 |
| 10 | $6.32 | $63.20 |
| 100 | $5.62 | $562.00 |
| 500 | $5.04 | $2,520.00 |
| 1,000 | $4.5 | $4,500.00 |
| 2,500 | $4.12 | $10,300.00 |
PIC32MX250F256H-I/MR Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and a programmable peripheral set. The PIC32MX2xx family sits within Microchip's broader PIC32 product hierarchy, positioned between the entry-level PIC32MX1xx and higher-performance PIC32MX5xx/7xx families. Designed around a five-stage pipeline MIPS core, the PIC32 architecture combines deterministic real-time behavior with the rich ecosystem of the MIPS instruction set, making it well-suited to embedded systems that require both DSP-grade numeric throughput and conventional microcontroller simplicity.
Key features of the PIC32MX250F256H include two I2S audio interfaces, four SPI modules for codec and serial communications, Peripheral Pin Select (PPS) functionality that allows flexible function-to-pin mapping, and a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces. The device also integrates a 10-bit 1 Msps analog-to-digital converter (ADC), a charge time measurement unit (CTMU) for capacitive touch sensing, multiple UART, I2C, and a JTAG programming/debug port. On-board capacitive touch support makes the device well-suited to button, slider, and wheel touch interfaces. The 64-QFN package with exposed pad (EP) enables efficient thermal dissipation in compact board layouts.
Typical applications for the PIC32MX250F256H include HMI touch panels, audio playback and recording systems, graphics-driven control panels, USB device peripherals, CAN-connected industrial nodes, and general-purpose embedded controllers that need higher MIPS than 8-bit/16-bit MCUs can deliver. The integrated CTMU simplifies capacitive touch key and slider designs, while the parallel master port allows direct interface to graphics TFTs and SRAM/Flash buffers.
When designing with this MCU, plan the peripheral pin select (PPS) mapping early in the schematic, since not all pin assignments are interchangeable. Provide a bulk 1uF ceramic plus 0.1uF bypass capacitor pair adjacent to every VDD/AVDD pin, and tie the exposed thermal pad of the QFN package to a clean ground copper pour to minimize thermal resistance. Programming is performed through the standard 4-wire JTAG or the 2-wire ICSP interface, supported by MPLAB X IDE and the MPLAB XC32 compiler.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet and help engineers accelerate both design selection and procurement decisions for the PIC32MX250F256H-I/MR.
Drop-in alternatives for PIC32MX250F256H-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX250F256H-I/MR (same form factor and footprint) — differing in ADC, Package, Core Architecture, Parallel Master Port (PMP), Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX250F256H-50I/MR
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →PIC32MX250F256H-V/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX150F256H-I/MR
✅ Drop-In✓ In Stock
$3.75 / Unit
View Datasheet →PIC32MX130F128H-I/MR
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →PIC32MX230F128H-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX250F256H-I/MR Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 32 KB |
| Operating Voltage | 2.5V / 3.3V (range 2.3V-3.6V) |
| I/O Pins | 53 (on 64-pin QFN) |
| Package | 64-QFN (MR) 9x9 mm with exposed pad |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| SPI | 4 modules |
| I2C | 2 modules |
| UART | 4 modules |
| I2S | 2 modules |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| USB | Full-Speed USB 2.0 Device/Host/OTG |
| CAN | 1 module (selected variants) |
| CTMU (Capacitive Touch) | Yes, integrated charge-time measurement unit |
| Timers | 5x 16-bit, 2x 32-bit |
| Operating Temperature Range | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Programming Interface | JTAG (4-wire) / ICSP (2-wire) |
| Lead-Free | Yes |
PIC32MX250F256H-I/MR 64-qfn (mr) 9x9 mm with exposed pad Pin Configuration Guide
Pin configuration for PIC32MX250F256H-I/MR (64-qfn (mr) 9x9 mm with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX250F256H-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX250F256H-I/MR is suitable for 6 applications: Capacitive Touch HMI Panels, Audio Playback & Recording Systems, Graphics TFT Control Panels, USB Device Peripherals, CAN-Connected Industrial Nodes, General-Purpose Embedded Controllers.
Capacitive Touch HMI Panels
The PIC32MX250F256H-I/MR is purpose-built for capacitive touch human-machine interfaces. Its integrated CTMU (Charge Time Measurement Unit) works with the 10-bit ADC to measure capacitance deltas with sub-percent accuracy, supporting up to 16 touch channels without an external controller. Combined with 256 KB Flash for touch firmware and 32 KB SRAM for gesture processing, it handles multi-touch key panels, sliders, and rotary wheels. The 64-QFN 9x9 mm package suits sealed front-panel designs, and the -40C to +85C industrial range supports appliances and industrial controls. Designers commonly pair it with the PIC32MTSC touch library and use the PMP port to drive small TFTs alongside touch overlays.
Recommended
Audio Playback & Recording Systems
With two I2S interfaces and four SPI modules, the PIC32MX250F256H-I/MR drives stereo audio codecs directly for MP3 playback, voice recording, and codec-based audio streaming. The 50 MHz / 83 DMIPS core sustains audio decoding and basic DSP algorithms, while 32 KB SRAM buffers audio frames without external memory. DMA-driven I2S reduces CPU load to under 5%, freeing MIPS for user interface logic. Typical pairings include the AK4642 codec for record/play, the VS1053 for compressed MP3, and the SGTL5000 for high-fidelity line-out designs. The QFN exposed pad also aids thermal management in continuous-record products like intercoms and dictation devices.
Recommended
Graphics TFT Control Panels
The Parallel Master Port (PMP) with dual read/write buffers enables direct drive of small 8/16-bit TFTs in compact QVGA panels without an external graphics controller. The PIC32MX250F256H-I/MR sustains 50 MHz MIPS for graphics refresh, while 256 KB Flash accommodates full-frame buffers and font tables. Designers commonly use Microchip's gfx library to render menus, gauges, and icons on 2.4"-3.5" panels. The Peripheral Pin Select (PPS) feature allows flexible mapping of PMP data lines to available I/O pins, easing PCB routing in tight enclosures like thermostats, medical instrument HMIs, and industrial machine controllers.
Recommended
USB Device Peripherals
The PIC32MX250F256H-I/MR integrates a Full-Speed USB 2.0 controller with on-chip transceiver, internal pull-up/down resistors, and DMA channels. This eliminates the need for external USB PHY chips in HID, CDC, MSD, and vendor-class device designs. With 256 KB Flash and 32 KB SRAM, it implements full USB stacks including HID composite devices, MIDI peripherals, and CDC+MSD composite. The 50 MHz core handles USB protocol plus application logic simultaneously. The Microchip USB stack in MPLAB Harmony provides certified class drivers, shortening USB development time substantially.
Recommended
CAN-Connected Industrial Nodes
The PIC32MX250F256H-I/MR integrates a CAN 2.0B controller (on select variants) for industrial networking. With 50 MHz MIPS it handles CANopen, DeviceNet, and J1939 stacks while running application logic. The 256 KB Flash stores full CANopen object dictionaries and protocol stacks, and 32 KB SRAM handles PDO/RDO buffers. The 64-QFN exposed-pad package provides good thermal performance for sealed industrial enclosures. Combined with the 2.3V-3.6V supply range and -40C to +85C industrial grade, the part suits factory automation nodes, motor controllers, and sensor hubs where CAN communication is required alongside local HMI.
Recommended
General-Purpose Embedded Controllers
For general embedded control tasks above 16-bit MCU capability but below full Linux SBC territory, the PIC32MX250F256H-I/MR is a strong fit. Its 50 MHz MIPS32 M4K core with 83 DMIPS handles state machines, sensor fusion, motor control loops, and protocol stacks. The 256 KB Flash accommodates full TCP/IP or proprietary wireless stacks when paired with an external ENC28J60 or MRF24WG0MA module. 32 KB SRAM supports RTOS use (FreeRTOS port available), and the 53 I/O pins cover most GPIO expansion needs. Industrial temperature range and 5V-tolerant I/O on select pins ease integration into legacy 5V subsystems.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX250F256H-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX250F256H-50I/MR | PIC32MX250F256H-V/MR | PIC32MX150F256H-I/MR | PIC32MX130F128H-I/MR | PIC32MX230F128H-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 128 KB (-50%) |
| SRAM | 32 KB | 32 KB | 32 KB | 8 KB (-75%) | 16 KB (-50%) | 16 KB (-50%) |
| Max CPU Clock | 50 MHz (83 DMIPS) | 50 MHz (83 DMIPS) | 50 MHz (83 DMIPS) | 50 MHz (83 DMIPS) | 50 MHz (83 DMIPS) | 40 MHz |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | No | No | No |
| USB | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C |
| Qty-1 Price (USD, as of 2026-10-02) | 6.95 | ~7.50 | ~7.20 | ~5.40 | ~4.85 | ~4.60 |
Key Differentiators
- On-chip CTMU for hardware capacitive touch (vs PIC32MX150F256H-I/MR)
- Larger SRAM for audio and graphics buffers (vs PIC32MX150F256H-I/MR)
- Same 64-QFN footprint across full upgrade path (vs PIC32MX170F256D-I/PT)
- Integrated Full-Speed USB with on-chip transceiver (vs PIC32MX230F128H-I/MR)
Design Notes
The PIC32MX250F256H-I/MR operates from a single 2.3V-3.6V rail. Per the Microchip PIC32MX1XX/2XX/5XX datasheet, place a 10uF bulk tantalum or ceramic capacitor at the regulator output, and a 0.1uF ceramic + 1uF ceramic pair adjacent to every VDD/AVDD pin. The AVDD rail (analog supply) should be tied to the same 3.3V rail through an LC or ferrite-bead filter to isolate ADC reference noise from digital switching. Power-on reset (POR) is built-in, but designers should still include a manual reset pushbutton to VSS via a 10k pull-up for debug convenience.
Estimated: At maximum 50 MHz core speed with all peripherals active at 3.3V, core current draw is approximately 30 mA, yielding ~0.1W dissipation - well within the 64-QFN thermal envelope (theta_JA ~25 C/W on a 4-layer JEDEC test board). For production layouts, tie the exposed thermal pad (EP) of the QFN to a continuous ground copper pour of at least 1 square inch, stitched with thermal vias to inner ground planes. Avoid cutting the thermal pad with signal traces - this degrades heat flow and can cause 10-15 C junction rise during heavy DSP or PMP graphics operations.
Per Microchip's QFN PCB layout guide, the 64-QFN (MR) 9x9 mm package requires a 0.5 mm pitch land pattern with NSMD (non-solder-mask defined) pads for reliable paste release during reflow. Stencil aperture should be approximately 1:1 to pad size with 0.1-0.125 mm reduction for fine-pitch perimeter pads. The exposed pad (pin 65) on the package bottom should receive a single large stencil aperture (typically 5x5 to 6x6 mm) to ensure proper solder voiding below 10%. Place four to eight thermal vias (0.3 mm drill, 0.5 mm pitch) inside the EP to inner ground plane for both thermal and electrical connection.
Do NOT tie unused I/O pins directly to VDD - configure them as outputs driving low or as inputs with internal pull-downs enabled. Unused ADC inputs should still be tied to AVSS through 10k resistors to prevent floating-channel ADC noise. The Peripheral Pin Select (PPS) registers must be configured at startup - I/O functions are NOT mapped by default, so a missing PPS unlock sequence will leave peripherals silent. When using the CTMU, calibrate the current source at least once per power cycle to maintain touch accuracy across temperature variations.
Keep USB D+/D- traces at 90 ohm differential impedance, matched within 0.15 mm, and as short as possible (under 50 mm). Place the 27 pF USB clock-out capacitor adjacent to the MCU USB pins. Route the 48 MHz PLL reference crystal traces symmetrically with ground guards, and keep the trace length under 5 mm to avoid phase-noise degradation. For capacitive touch, route touch electrode traces as direct, short traces with a guard ring (grounded trace) on the same PCB layer to suppress moisture-induced false triggers.
Compliance Information
RoHS and REACH compliant per Microchip product page. The -I grade is industrial (-40C to +85C), not AEC-Q100 qualified; for AEC-Q100 automotive applications, consult Microchip automotive-grade PIC32MX2xx variants. Lead-free and halogen-free per Microchip environmental certification.