PIC32MX360F256LT-80I/BG - 32-bit 80MHz 256KB Flash MCU | Microchip
MPN: PIC32MX360F256LT-80I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.05 | $130.50 |
| 100 | $11.6 | $1,160.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.85 | $9,850.00 |
PIC32MX360F256LT-80I/BG Overview
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals (timers, ADC, communication controllers). The PIC32MX360 series uses the MIPS32 M4K 32-bit RISC core, placing it in the hierarchy: MCU -> 32-bit MCU -> MIPS-based MCU -> Microchip PIC32 family. Compared with 8-bit or 16-bit MCUs, the 32-bit core delivers higher throughput per MHz, larger linear address space, and DSP-class arithmetic useful for signal conditioning, motor control, and graphics.
Key features include a 10-bit ADC with up to 16 channels and 1 Msps conversion rate, multiple UART/SPI/I2C peripherals, USB 2.0 Full-Speed OTG, parallel master port for external memory or graphics, five 16-bit timers/counters, and an input-capture / output-compare / PWM module. The 80 MHz core delivers 1.56 DMIPS/MHz (approximately 100 DMIPS total), supporting floating-point and DSP operations through the MIPS DSP ASE. The 121-pin TFBGA exposes extensive I/O for parallel bus expansion.
Typical applications include USB peripherals (human-interface devices, virtual COM ports, mass storage), industrial control with graphical LCDs (using PMP for parallel graphics), point-of-sale terminals, motor control, and home automation gateways. The combination of large Flash, USB, and a wide peripheral set makes it a strong fit for human-machine interface designs where two previous MCUs would have been needed.
When designing with this part, ensure the 2.5V/3.3V core supply is decoupled with at least 10 uF bulk plus 0.1 uF ceramic at each VDD/VSS pin pair. Boot configuration resistors on TMS/TCK and the on-chip regulator selection must be set per the datasheet before applying power. Migrate to MPLAB X IDE with the XC32 compiler for full C/C++ workflow support.
Drop-in alternatives for PIC32MX360F256LT-80I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX360F256LT-80I/BG (same form factor and footprint) — differing in ADC, Package, Timers, DMA Channels, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX360F256L-80I/BG
✅ Drop-In✓ In Stock
$7.58 / Unit
View Datasheet →PIC32MX460F256LT-80I/BG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX360F256LT-80V/BG
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →PIC32MX360F256L-80V/BG
✅ Drop-In✓ In Stock
$6.4 / Unit
View Datasheet →PIC32MX340F256HT-80I/MR
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View Datasheet →PIC32MX360F256LT-80I/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 2.5 V to 3.3 V |
| Number of I/O Pins | 85 (approx) |
| Package | 121-pin TFBGA (10x10 mm) |
| Temperature Grade | Industrial -40C to +85C |
| ADC | 10-bit, up to 16 channels, 1 Msps |
| USB | USB 2.0 Full-Speed OTG |
| Timers | 5 x 16-bit Timer/Counter |
| Communication Peripherals | UART, SPI, I2C, USB OTG |
| Parallel Master Port (PMP) | Yes (8/16-bit external bus) |
| Packaging | Tape & Reel (TR) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
PIC32MX360F256LT-80I/BG Pin Configuration
| Pin A1 | VSS — Ground reference |
| Pin A2 | PGED1 — Programming/data debugger pin 1 |
| Pin B1 | VDD — Digital supply voltage (2.5V/3.3V) |
| Pin B12 | VBUS — USB VBUS detect input |
| Pin C6 | D+ — USB D+ data line |
| Pin C7 | D- — USB D- data line |
| Pin D11 | OSC1 — External clock/oscillator input |
| Pin D12 | OSC2 — External clock/oscillator output |
| Pin F11 | MCLR — Master clear reset (active low) |
| Pin H6 | AN0 — Analog input 0 / ADC channel 0 |
| Pin K11 | PMPDATA0 — Parallel Master Port data bit 0 |
| Pin L11 | PMPCS1 — Parallel Master Port chip select 1 |
| Pin L12 | VSS — Ground reference |
Typical Applications
PIC32MX360F256LT-80I/BG is suitable for 6 applications: USB Human Interface Devices (HID), Industrial Control with Graphical LCD, Point-of-Sale (POS) Terminals, Motor Control and BLDC Drives, USB-to-UART Bridge / Virtual COM Port, Home Automation Gateway / IoT Hub.
USB Human Interface Devices (HID)
The PIC32MX360F256LT-80I/BG's integrated USB 2.0 Full-Speed On-The-Go controller with on-chip PHY and dedicated DMA channels makes it an ideal host MCU for HID-class peripherals such as keyboards, mice, game controllers, and custom input devices. Designers can implement the full HID stack in firmware using Microchip's free USB stack in MPLAB Harmony, eliminating the need for an external USB interface chip. The 80 MHz MIPS32 M4K core provides ample headroom for HID report parsing, debounce logic, and LED animation, while 256 KB Flash accommodates composite HID devices (keyboard + mouse + media controls) with comfortable firmware growth margin. Typical designs run at 3.3V with a USB-powered 5V-to-3.3V LDO and a few decoupling capacitors; the USB D+/D- lines connect directly to the BGA balls with the recommended 27-ohm series resistors.
Recommended
Industrial Control with Graphical LCD
The PIC32MX360F256LT-80I/BG's Parallel Master Port (PMP) enables direct 8/16-bit parallel connection to graphical LCDs (e.g., TFT 320x240 QVGA modules) without an external graphics controller. The 80 MHz core drives software-rendered UIs with font drawing and touch handling at low CPU load, while the 32 KB SRAM provides frame-buffer and touch-data scratch space. Combined with the 10-bit ADC (1 Msps, 16 channels) for analog sensor inputs (temperature, pressure, flow), the part supports HMI panels in factory automation where USB OTG allows in-field firmware updates via USB stick. Operating at industrial -40C to +85C ensures reliability in unenclosed factory environments.
Recommended
Point-of-Sale (POS) Terminals
The PIC32MX360F256LT-80I/BG's combination of USB OTG, UART (for PIN pads and receipt printers), SPI (for contactless card readers), and I2C (for thermal printer head control) covers all POS connectivity needs on a single chip. The 256 KB Flash stores application logic, USB stack, and crypto routines; 32 KB SRAM holds transaction buffers and parser state. Designers typically pair it with a secure external memory for transaction logs and use the 10-bit ADC for battery monitoring in mobile POS units. The 121-TFBGA footprint keeps PCB area small enough for handheld form factors, while the 80 MHz core supports encrypted communications with payment processors at line speed.
Recommended
Motor Control and BLDC Drives
The PIC32MX360F256LT-80I/BG's 5 x 16-bit timers with PWM output compare support 3-phase BLDC, stepper, and PMSM motor commutation without external hardware. The MIPS32 M4K core runs field-oriented control (FOC) loops at typical 20-40 kHz switching frequency with comfortable margin, while 32 KB SRAM handles PID state and current-sensor arrays. The 10-bit ADC samples motor phase currents synchronously to PWM center for accurate FOC feedback. Application areas include small industrial pumps, fans, and ceiling fans with variable speed control. The industrial temperature grade ensures reliable operation in motor housings where ambient temperatures can exceed 70C.
Recommended
USB-to-UART Bridge / Virtual COM Port
The PIC32MX360F256LT-80I/BG's USB OTG device mode supports CDC class enumeration natively, allowing designs to implement a USB-to-UART bridge with multiple COM ports without external bridge ICs such as FT232. The 80 MHz core handles USB protocol, UART FIFO, and command-set translation (e.g., SCPI for test instruments) in a single chip. The 256 KB Flash stores USB stack and protocol converters; designers add RS-232/RS-485 transceivers externally for legacy industrial bus bridging. This pattern is common in industrial test equipment, PLC programming cables, and embedded debug adapters where a single MCU replaces a separate USB controller.
Recommended
Home Automation Gateway / IoT Hub
The PIC32MX360F256LT-80I/BG's USB OTG, Ethernet-ready peripherals (via SPI/Ethernet MAC peripheral in PIC32MX3XX/4XX family), and 80 MHz core enable low-cost home automation gateways that aggregate Zigbee, Z-Wave, or Wi-Fi sub-modules over UART/SPI and expose them via Ethernet or Wi-Fi. The 256 KB Flash stores gateway firmware, device drivers, and web-server pages; the 32 KB SRAM handles concurrent connection state for multiple sub-modules. Industrial temperature rating allows installation in utility closets and outdoor enclosures with adequate sealing. USB OTG enables local configuration via USB stick or tethered smartphone app.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX360F256LT-80I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX360F256L-80I/BG | PIC32MX460F256LT-80I/BG | PIC32MX360F256LT-80V/BG |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) | 121-TFBGA (10x10) | 121-TFBGA (10x10) |
| Core / Frequency | MIPS32 M4K @ 80 MHz | MIPS32 M4K @ 80 MHz | MIPS32 M4K @ 80 MHz | MIPS32 M4K @ 80 MHz |
| Flash / SRAM | 256 KB / 32 KB | 256 KB / 32 KB | 256 KB / 32 KB | 256 KB / 32 KB |
| Hardware Crypto (AES/DES) | No | No | Yes (AES/DES/Triple-DES) | No |
| CAN 2.0b | No | No | Yes | No |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +105C |
| Packaging Format | Tape & Reel (TR) | Tray | Tape & Reel (TR) | Tape & Reel (TR) |
| USB 2.0 OTG | Yes | Yes | Yes | Yes |
Key Differentiators
- Drop-in 121-TFBGA silicon with identical Flash, SRAM, and peripherals (vs PIC32MX360F256L-80I/BG)
- Optional hardware crypto engine for secure designs (vs PIC32MX460F256LT-80I/BG)
- Extended temperature option in same package (vs PIC32MX360F256LT-80V/BG)
- Integrated USB OTG with on-chip PHY (vs Microcontrollers without USB)
Design Notes
The PIC32MX360F256LT-80I/BG requires a tightly regulated 3.3V supply (2.5V-3.3V nominal). Place a 10 uF bulk tantalum or ceramic capacitor plus a 0.1 uF decoupling capacitor within 5 mm of every VDD/VSS pin pair on the 121-TFBGA layout. For USB applications, use a low-noise LDO such as MCP1700-3302E fed from VBUS to avoid injecting switching noise into the USB analog section. Estimated core current draw at 80 MHz is approximately 60-70 mA; full USB plus peripheral activity can push this to 100 mA, so size the LDO for 150 mA to handle inrush.
In the 121-TFBGA package, thermal dissipation is dominated by conduction through the BGA balls and internal PCB copper planes. For applications drawing more than 80 mA continuously, design at least 4 layers with an unbroken ground plane directly under the BGA to spread heat. The thermal resistance theta_JA is approximately 30 C/W on a 4-layer JEDEC test board; at 100 mA and 3.3V supply the 0.33 W dissipation yields only a 10 C junction rise above ambient, well within industrial temperature limits. Avoid placing the BGA directly above a cutout or near board edges where thermal spreading is poor.
The 121-TFBGA package uses 0.8 mm ball pitch with 10x10 mm body. Per IPC-7351 and Microchip BGA layout guidelines, use NSMD (non-solder-mask defined) pads with 0.4 mm diameter on the board side and via-in-pad with 0.2 mm drill to maximize routing density under the array. Microvia stack-ups (laser-drilled blind/buried vias) are highly recommended for escape routing; 6 mil trace/space rules work but 4 mil/4 mil give better signal integrity for parallel PMP bus lines.
Common design pitfalls with PIC32MX360F256LT-80I/BG: (1) Forgetting the 10 kohm pull-up on MCLR - the part will fail to enter programming mode reliably otherwise. (2) Skipping the bulk capacitor on VBUS for USB applications, causing enumeration failures when the host supplies marginal current. (3) Using the internal RC oscillator instead of a crystal without configuring the PLL correctly, leading to USB timing errors that fail USB-IF compliance. Always reference the PIC32MX3XX/4XX family datasheet (DS61143H) for PLL and configuration bit settings before bringing up a new board.
The USB D+/D- lines on the 121-TFBGA require matched 90-ohm differential impedance with 27-ohm series source terminations at each pin per USB 2.0 specification. Keep D+/D- traces short (< 25 mm) and routed as a guarded differential pair with continuous ground reference on the layer beneath. For PMP bus lines driving external graphics LCDs, add 22-ohm series resistors to dampen ringing from cable/connector reflections when the bus length exceeds 50 mm. Refer to Microchip application note AN1168 for USB layout and AN1356 for PMP signal integrity guidance.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade only; choose 'V' (extended) suffix for automotive/extended temp. Not AEC-Q100 qualified.
