PIC32MX360F256LT-80V/BG - 32-bit MCU, 256KB Flash, 80MHz, TFBGA-121 | Microchip
MPN: PIC32MX360F256LT-80V/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.15 | $9.15 |
| 10 | $8.45 | $84.50 |
| 100 | $7.12 | $712.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.45 | $5,450.00 |
PIC32MX360F256LT-80V/BG Overview
A PIC32MX microcontroller combines a MIPS M4K 32-bit core with the peripheral integration of a microcontroller and the deterministic interrupt latency required for real-time control. It belongs to the broader hierarchy 32-bit MCU -> microcontroller -> integrated circuit -> semiconductor. The 80 MHz core delivers 1.56 DMIPS/MHz, equivalent to 125 DMIPS, suitable for DSP/streaming algorithm workloads, USB stacks, and graphics-driven operations.
Key features include 256 KB (256K x 8) Flash program memory, 32 KB SRAM, sixteen 16-bit timers, five 16-bit capture/compare/PWM modules, a 16-channel 10-bit ADC with 1 MSPS conversion, USB 2.0 FS OTG, two I2C, two SPI, and PMP. Industrial-grade 2.5V to 3.6V operation supports battery-powered and USB-powered designs. The 121-ball TFBGA package occupies only 10x10 mm, enabling compact high-pin-count integration.
Architecturally, the M4K core is a five-stage pipeline with hardware multiply/divide and a configurable prefetch cache. The DMA engine supports memory-to-peripheral transfers without CPU intervention, while the peripheral bus matrix maintains deterministic access for time-critical peripherals. The USB OTG controller with integrated PHY eliminates external transceivers.
Typical applications include USB peripherals, audio playback devices with USB streaming, industrial control with DMA-driven sensor acquisition, consumer electronics with graphical displays, and connected embedded systems with Ethernet or WiFi companion modules. The combination of USB OTG, DMA, and DSP performance makes it suited for low-cost multimedia designs.
Design consideration: route USB DP/DM as 90-ohm differential pairs and provide a decoupling network within 5 mm of the TFBGA balls. The 0.8 mm pitch TFBGA requires PCB design rules for microvia and fanout; 4-layer stackup is the practical minimum.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not collated in the manufacturer datasheet.
Drop-in alternatives for PIC32MX360F256LT-80V/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX360F256LT-80V/BG (same form factor and footprint) — differing in ADC, Package, Timers, Core Architecture, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX360F256L-80V/BG
✅ Drop-In✓ In Stock
$6.4 / Unit
View Datasheet →PIC32MX360F256LT-80I/BG
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →PIC32MX360F256L-80I/BG
✅ Drop-In✓ In Stock
$7.58 / Unit
View Datasheet →PIC32MX340F256H-80V/BG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX360F256LT-80V/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Count | Single-Core |
| Data Bus Width | 32-bit |
| Max CPU Clock | 80 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 256 KB (256K x 8) |
| RAM Size | 32 KB |
| ADC | 10-bit, 16 channels, 1 MSPS |
| DMA | Yes |
| Supply Voltage | 2.5 V to 3.6 V |
| Package Type | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount |
| USB Interface | USB 2.0 Full-Speed OTG with integrated PHY |
| Peripherals | PMP, I2C x2, SPI x2, UART x2 |
PIC32MX360F256LT-80V/BG Pin Configuration
| Pin A1 | VSS — Ground reference |
| Pin A2 | RB0 — GPIO/PGD |
| Pin B1 | VDD — Core supply 2.5V-3.6V |
| Pin B2 | RB1 — GPIO/PGC |
| Pin D3 | USB_DP — USB D+ differential pair |
| Pin D4 | USB_DM — USB D- differential pair |
| Pin E5 | VDD_USB — USB transceiver supply |
| Pin F6 | VSS_USB — USB transceiver ground |
| Pin H3 | AN0 — Analog input 0 / RB0 |
| Pin H4 | AN1 — Analog input 1 |
Typical Applications
PIC32MX360F256LT-80V/BG is suitable for 6 applications: USB Audio Streaming Devices, Industrial Control with DMA Sensor Acquisition, Consumer Graphics Display Controller, USB Human Interface Device (HID) Peripherals, Connected Embedded with WiFi Companion Module, Audio Playback with SD Card Reader.
USB Audio Streaming Devices
The PIC32MX360F256LT-80V/BG's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY and 80 MHz MIPS M4K core make it ideal for USB audio streaming peripherals. Its 32 KB SRAM is sufficient for USB stack plus small audio buffers, while the 256 KB Flash accommodates USB class drivers and a lightweight audio processing thread. The 121-TFBGA exposes full peripheral access needed for I2S/SPDIF companion DACs, and the DMA controller offloads sample transfers, leaving CPU headroom for USB enumeration and HID controls.
Recommended
Industrial Control with DMA Sensor Acquisition
The PIC32MX360F256LT-80V/BG's 16-channel 10-bit ADC at 1 MSPS combined with its 8-channel DMA controller make it well-suited for industrial sensor acquisition nodes. Its 121-ball TFBGA exposes up to 101 GPIOs for driving multiplexed analog/digital sensor arrays, while the 32 KB SRAM buffers DMA-driven sample bursts without CPU intervention. The MIPS M4K core at 80 MHz executes 1.56 DMIPS/MHz, handling Modbus, CANopen, or EtherCAT slave pre-processing in deterministic time.
Recommended
Consumer Graphics Display Controller
The PIC32MX360F256LT-80V/BG's Parallel Master Port (PMP) plus SPI and I2C peripherals enable driving small TFT/OLED displays with 256 KB Flash holding graphics framebuffer compression and asset tables. Its 32 KB SRAM is adequate for double-buffered small displays (320x240 16-bit). The 80 MHz core executes 125 DMIPS, sufficient for touch-screen UI rendering and asset decompression at interactive rates, while the 121-TFBGA package keeps the BOM compact for handheld consumer products.
Recommended
USB Human Interface Device (HID) Peripherals
The PIC32MX360F256LT-80V/BG with USB OTG and 80 MHz core is ideal for USB HID peripherals such as custom keyboards, control surfaces, and gaming input controllers. Its 32 KB SRAM fits USB HID stacks plus a small state machine, while the 256 KB Flash holds composite HID descriptors and application logic. DMA offloads report streaming; the 121-TFBGA exposes the GPIO count needed for multi-axis analog inputs and switch matrices typical of custom peripherals.
Recommended
Connected Embedded with WiFi Companion Module
The PIC32MX360F256LT-80V/BG paired with a WiFi companion module (e.g. Microchip MRF24WN0MA or ATWINC1500) creates a low-cost IoT bridge. Its two UART, two SPI, and two I2C ports drive the companion cleanly. The 256 KB Flash fits TLS/DTLS client stacks plus application logic, while the 32 KB SRAM buffers TLS handshake. The 121-TFBGA package supports small-form-factor IoT gateways with full peripheral expansion.
Recommended
Audio Playback with SD Card Reader
The PIC32MX360F256LT-80V/BG's PMP plus SPI can drive an SD card reader for audio file playback in standalone devices. Its 32 KB SRAM fits WAV/MP3 frame decoders, while 256 KB Flash holds the player firmware plus UI. DMA-driven SPI sample streaming leaves CPU cycles for display updates and UI input handling. The 121-TFBGA package exposes the necessary pins for SD card, audio DAC I2S, and small display interfaces concurrently.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX360F256LT-80V/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX360F256L-80V/BG | PIC32MX360F256LT-80I/BG | PIC32MX360F256L-80I/BG |
|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| USB OTG | Yes (FS, on-chip PHY) | Yes (FS, on-chip PHY) | Yes (FS, on-chip PHY) | Yes (FS, on-chip PHY) |
| Temperature Grade | V (-40C to +105C) | V (-40C to +105C) | I (-40C to +125C) | I (-40C to +125C) |
Key Differentiators
- USB 2.0 Full-Speed OTG with integrated PHY eliminates external transceiver BOM (vs PIC32MX340F512HT-80V/MR)
- 121-ball TFBGA package exposes full peripheral set including PMP for graphics (vs PIC32MX360F256L-80V/PT)
- Industrial temperature variant available in same package (vs PIC32MX360F256LT-80I/BG)
Design Notes
The 121-ball TFBGA package uses a 0.8 mm ball pitch and requires 4-layer PCB design with microvia fanout. Use a controlled impedance 90-ohm USB DP/DM differential pair routed within 5 mm of the BGA balls with no splits in the reference plane. Per Microchip's PIC32MX3XX4XX datasheet (DS61184), all VDD balls require 0.1 uF decoupling within 5 mm and a bulk 10 uF tantalum within 25 mm.
Do not omit the MCLR pull-up resistor; the MCLR pin is mandatory for in-circuit serial programming. The VDD_USB supply requires a separate filter network - connect via ferrite bead + decoupling capacitor to avoid digital switching noise coupling into the USB PHY. Estimated: at 80 MHz core clock with full peripheral usage, peak core current reaches approximately 65 mA, requiring sufficient VDD decoupling.
Route USB DP/DM as a 90-ohm differential pair with continuous ground reference. Avoid routing over power plane splits. Per the USB 2.0 specification, intra-pair skew should be below 50 ps, which on standard FR-4 means matched length to within 7.5 mm. Place the USB connector within 25 mm of the BGA balls to maintain signal integrity.
Estimated: the 121-TFBGA package has a typical theta_JA of approximately 35 C/W on a 4-layer JEDEC test board. At 80 MHz with full peripheral activity and 3.3V VDD, core power dissipation is approximately 215 mW, giving a 7.5C junction temperature rise above ambient. The TFBGA bottom-side thermal pad (if present in variant) should be soldered to a ground plane copper pour for additional dissipation.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified. Lead-free finish per Microchip packaging specification. Industrial 'I' variants available for extended temperature.
