PIC32MX340F256HT-80I/MR - 80MHz 32-bit MCU 256KB Flash | Microchip
MPN: PIC32MX340F256HT-80I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.52 | $8.52 |
| 10 | $7.65 | $76.50 |
| 100 | $6.81 | $681.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.42 | $5,420.00 |
PIC32MX340F256HT-80I/MR Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and a configurable set of peripherals such as ADC, timers, communication interfaces, and GPIO. The PIC32 family specifically targets MIPS32-based 32-bit processing at low power, sitting between 8/16-bit MCUs and full application processors in the embedded taxonomy (MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32MX family). The "MX340" sub-family emphasizes USB 2.0 Full-Speed, CAN, and motor-control peripherals for industrial and consumer designs.
Key features of this variant include a 10-bit 1 MSPS Analog-to-Digital Converter, multiple UART/SPI/I2C interfaces, USB 2.0 Full-Speed On-The-Go, a DMA controller for offloading CPU data movement, and an operating voltage range of 2.3V to 3.6V. The -80I suffix denotes industrial temperature range (-40C to +85C) and the 80 MHz maximum clock. The "T" in the part number indicates tape-and-reel packaging, and the "MR" suffix designates the 64-pin VQFN package.
The device uses a 5-stage pipeline MIPS32 M4K core with single-cycle multiplication and hardware divide, delivering 80 DMIPS of processing throughput. Integrated peripherals include a parallel master port for external bus interfacing, five 16-bit timers/counters, and a real-time clock calendar, allowing the chip to act as a complete system controller in connected applications.
Typical applications include USB peripherals and HID devices, industrial control and HMI panels, CAN-connected sensor nodes, low-cost graphical user interfaces, and connected IoT appliances. The combination of USB, CAN, and ample RAM makes the part a strong fit for bridging industrial fieldbuses to USB hosts.
When designing with this part, allocate adequate PCB copper area beneath the 9x9 mm QFN exposed pad to meet the 31.7 C/W thermal resistance rating under industrial conditions, and use MPLAB X IDE with the XC32 compiler toolchain. Decouple VDD/VUSB with 100 nF + 10 uF ceramics within 3 mm of the supply pins.
This page synthesizes distributor pricing, drop-in same-package alternatives, application notes, and design guidance not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MX340F256HT-80I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX340F256HT-80I/MR (same form factor and footprint) — differing in Package, ADC, DMA Channels, Operating Temperature, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX340F256H-80I/MR
✅ Drop-In✓ In Stock
$4.35 / Unit
View Datasheet →PIC32MX340F128HT-80I/MR
✅ Drop-In✓ In Stock
$4.12 / Unit
View Datasheet →PIC32MX330F064HT-V/MR
✅ Drop-In✓ In Stock
$4.12 / Unit
View Datasheet →PIC32MX270F512HT-50I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.74 / Unit
View Datasheet →PIC32MX250F256HT-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.35 / Unit
View Datasheet →PIC32MX150F256HT-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.45 / Unit
View Datasheet →PIC32MX340F256HT-80I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum Clock Frequency | 80 MHz |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) |
| ADC | 10-bit, 16-channel, 1 MSPS |
| Package | 64-VQFN (MR) 9x9 mm |
| Mounting Type | Surface Mount |
| USB | USB 2.0 Full-Speed OTG |
| CAN | 1x CAN 2.0B |
| DMA Channels | 8 channels |
| Timers | 5 x 16-bit |
| UART | Yes (multiple) |
| SPI | Yes |
| I2C | Yes |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC32MX340F256HT-80I/MR Pin Configuration
| Pin 1 | RG15 — General purpose I/O / SDA2 |
| Pin 2 | RG12 — General purpose I/O |
| Pin 3 | RA0 — General purpose I/O / AN0 |
| Pin 4 | RA1 — General purpose I/O / AN1 |
| Pin 5 | RA2 — General purpose I/O / AN2 |
| Pin 6 | RA3 — General purpose I/O / AN3 |
| Pin 7 | RA4 — General purpose I/O / AN4 |
| Pin 8 | RA5 — General purpose I/O / AN5 |
| Pin 9 | RA6 — General purpose I/O / AN6 |
| Pin 10 | RA7 — General purpose I/O / AN7 |
| Pin 11 | AVDD — Analog supply voltage |
| Pin 12 | AVSS — Analog ground |
| Pin 13 | RB0 — General purpose I/O / AN8 / PGED1 |
| Pin 14 | RB1 — General purpose I/O / AN9 / PGEC1 |
| Pin 15 | RB2 — General purpose I/O / AN10 |
| Pin 16 | RB3 — General purpose I/O / AN11 |
| Pin 17 | RB4 — General purpose I/O / AN12 |
| Pin 18 | RB5 — General purpose I/O / AN13 |
| Pin 19 | RB6 — General purpose I/O / AN14 / PGED2 |
| Pin 20 | RB7 — General purpose I/O / AN15 / PGEC2 |
| Pin 21 | RC12 — General purpose I/O |
| Pin 22 | RC15 — General purpose I/O |
| Pin 23 | RC13 — General purpose I/O |
| Pin 24 | RC14 — General purpose I/O |
| Pin 25 | VDD — Digital supply voltage |
| Pin 26 | VSS — Digital ground |
| Pin 27 | RF0 — General purpose I/O |
| Pin 28 | RF1 — General purpose I/O |
| Pin 29 | RF4 — General purpose I/O |
| Pin 30 | RF5 — General purpose I/O |
| Pin 31 | RF3 — General purpose I/O |
| Pin 32 | RF2 — General purpose I/O |
| Pin 33 | RF6 — General purpose I/O |
| Pin 34 | RF7 — General purpose I/O |
| Pin 35 | RF8 — General purpose I/O |
| Pin 36 | VDD — Digital supply voltage |
| Pin 37 | VSS — Digital ground |
| Pin 38 | RG0 — General purpose I/O |
| Pin 39 | RG1 — General purpose I/O |
| Pin 40 | RG2 — General purpose I/O / D+ (USB) |
| Pin 41 | RG3 — General purpose I/O / D- (USB) |
| Pin 42 | RG6 — General purpose I/O |
| Pin 43 | RG7 — General purpose I/O |
| Pin 44 | RG8 — General purpose I/O |
| Pin 45 | RG9 — General purpose I/O |
| Pin 46 | VUSB — USB supply voltage |
| Pin 47 | VDD — Digital supply voltage |
| Pin 48 | VSS — Digital ground |
| Pin 49 | RD0 — General purpose I/O |
| Pin 50 | RD1 — General purpose I/O |
| Pin 51 | RD2 — General purpose I/O |
| Pin 52 | RD3 — General purpose I/O |
| Pin 53 | RD4 — General purpose I/O |
| Pin 54 | RD5 — General purpose I/O |
| Pin 55 | RD6 — General purpose I/O |
| Pin 56 | RD7 — General purpose I/O |
| Pin 57 | RC1 — General purpose I/O |
| Pin 58 | RC2 — General purpose I/O |
| Pin 59 | RC3 — General purpose I/O |
| Pin 60 | RC4 — General purpose I/O |
| Pin 61 | OSC1 — Crystal oscillator input |
| Pin 62 | OSC2 — Crystal oscillator output |
| Pin 63 | MCLR — Master clear / reset input |
| Pin 64 | EP — Exposed thermal pad (connect to VSS) |
Typical Applications
PIC32MX340F256HT-80I/MR is suitable for 6 applications: USB HID and CDC Peripherals, CAN Bus Industrial Sensor Nodes, Industrial HMI Control Panels, USB-to-CAN Fieldbus Bridges, Low-Cost Graphical User Interfaces, Connected IoT Appliance Controllers.
USB HID and CDC Peripherals
The PIC32MX340F256HT-80I/MR integrates USB 2.0 Full-Speed On-The-Go with internal transceiver, eliminating external PHY cost. Its 80 MHz MIPS32 core handles USB enumeration and HID report processing within microsecond latency budgets, while the 64 KB RAM buffers HID ring descriptors and CDC line-coding state. With 256 KB Flash the device supports composite USB stacks (HID + CDC + vendor) plus bootloader space below -40C vs +85C.
Recommended
CAN Bus Industrial Sensor Nodes
The on-chip CAN 2.0B controller makes the PIC32MX340F256HT-80I/MR a fit for industrial sensor nodes bridging fieldbuses to higher-level controllers. The 80 MHz core executes CANopen or DeviceNet protocol stacks within tight cycle budgets, while 256 KB Flash accommodates protocol libraries and application firmware. Industrial -40C to +85C temperature range covers factory floor environments reliably.
Recommended
Industrial HMI Control Panels
The 64 KB RAM supports small TFT framebuffers for HMI control panels, while the 16-channel 10-bit ADC reads analog key matrices and potentiometer inputs. The PIC32MX340F256HT-80I/MR runs LittlevGL or emWin graphical stacks at 80 MHz with sub-frame refresh rates. USB and CAN interfaces simultaneously support programming and fieldbus connectivity in factory HMI panels.
Recommended
USB-to-CAN Fieldbus Bridges
Bridges USB host controllers to CAN fieldbus networks using the PIC32MX340F256HT-80I/MR's integrated USB and CAN peripherals. The 80 MHz MIPS32 core handles USB CDC command parsing and CAN frame forwarding concurrently without CPU stalls. The 256 KB Flash hosts both USB CDC and CAN firmware stacks, and the 64-VQFN package's 9x9 mm footprint fits compact industrial converter modules.
Recommended
Low-Cost Graphical User Interfaces
Drives small TFT or OLED displays at human-interface latencies using the PIC32MX340F256HT-80I/MR's DMA controller to offload display refresh from the CPU. The 10-bit ADC reads touch inputs and analog controls, while 5 timers generate PWM backlight dimming and key-debounce timing. Industrial temperature grade ensures reliable outdoor or factory GUI operation.
Recommended
Connected IoT Appliance Controllers
Acts as a USB-attached or CAN-connected controller inside connected consumer appliances such as smart kitchen or HVAC equipment. The PIC32MX340F256HT-80I/MR's USB OTG enables direct smartphone tethering for diagnostics, while the integrated ADC monitors temperature and sensor inputs. Industrial temperature range and RoHS compliance support worldwide appliance certification requirements.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX340F256HT-80I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX340F256H-80I/MR | PIC32MX340F128HT-80I/MR | PIC32MX330F064HT-V/MR | PIC32MX270F512HT-50I/MR | PIC32MX250F256HT-I/MR | PIC32MX150F256HT-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 128 KB | 64 KB | 512 KB | 256 KB | 256 KB |
| RAM | 64 KB | 64 KB | 32 KB | 16 KB | 64 KB | 32 KB | 32 KB |
| Maximum Clock | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C |
| CAN Interface | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | No CAN | No CAN |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Key Differentiators
- Highest Flash density in the MX340 family with USB and CAN (vs PIC32MX340F128HT-80I/MR)
- Faster 80 MHz core compared to MX270/MX250/MX150 family parts (vs PIC32MX250F256HT-I/MR)
- Industrial temperature grade with CAN bus (vs PIC32MX150F256HT-I/MR)
Design Notes
The 64-VQFN package has an exposed thermal pad (EP, pin 64) that must be soldered to a PCB thermal land of at least the same dimensions as the pad (approximately 5x5 mm). A 9x9 mm array of thermal vias (0.3 mm diameter, 0.5 mm pitch) connecting to an internal ground plane is recommended to achieve the datasheet-specified 31.7 C/W thermal resistance. Insufficient thermal land soldering can increase junction temperature by 15-25 C at typical industrial loads, reducing long-term reliability.
Decouple the four VDD/VSS pairs and the AVDD/AVSS pair with 100 nF X7R ceramic capacitors placed within 3 mm of each supply pin, plus one bulk 10 uF ceramic or tantalum capacitor near the package. The VUSB pin (pin 46) requires a separate 100 nF + 4.7 uF decoupling network even when USB is unused, to prevent internal regulator noise from corrupting ADC readings. Bulk capacitor ESR below 50 milliohm is recommended for switching loads.
Keep analog signals (AN0-AN15) routed over a continuous ground plane on an inner PCB layer to minimize noise coupling. Place the analog AVDD/AVSS LDO filter network within 5 mm of the AVDD pin. USB D+/D- traces (RG2, RG3) require 90-character, length-matched routing with a characteristic impedance of 90 ohms differential. Avoid routing digital signals across the analog section.
Do not leave MCLR (pin 63) floating. Tie MCLR through a 10 kohm pull-up to VDD and use a 100 nF cap to ground for noise filtering. Floating MCLR causes spurious resets in electrically noisy environments. Additionally, configure unused I/O pins as outputs driving low (not inputs) to minimize current leakage through the input structure, which can exceed 1 uA per pin in worst case.
The 16-channel 10-bit ADC achieves 1 MSPS only with a 6 MHz or higher peripheral bus clock and an adequate ADC sampling time. Use the PIC32's internal 2.5V bandgap as ADC reference only for low-precision measurements; for industrial 10-bit accuracy provide an external 2.5V or 3.0V reference with output impedance below 10 ohms. Average multiple ADC samples for digital measurements.
Compliance Information
RoHS compliant per Microchip product page; AEC-Q100 not applicable (consumer/industrial part). Halogen-free status not explicitly stated in distributor listings; refer to Microchip environmental compliance documentation for confirmation.
