PIC32MX360F256L-80I/BG - 80MHz 32-bit MCU 256KB Flash 121-TFBGA | Microchip
MPN: PIC32MX360F256L-80I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.78 | $11.78 |
| 10 | $10.62 | $106.20 |
| 100 | $9.45 | $945.00 |
| 500 | $8.5 | $4,250.00 |
| 1,000 | $7.58 | $7,580.00 |
PIC32MX360F256L-80I/BG Overview
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile and non-volatile memory, and programmable peripherals on a single die. The PIC32MX3xx family belongs to the higher-level taxonomy: 32-bit MCU -> embedded microcontroller -> RISC processor -> integrated circuit -> semiconductor. The MIPS32 M4K core executes most instructions in a single cycle, providing deterministic performance for real-time control loops and signal-processing tasks that 8-bit or 16-bit MCUs cannot handle within the same power budget.
Key features of the PIC32MX360F256L-80I/BG include a 10-bit 1 Msps ADC with up to 16 channels, five 16-bit timers/counters, two I2C, two SPI, and two UART interfaces, plus dedicated CAN and USB OTG controllers. The 121-TFBGA package provides 85 general-purpose I/O pins, the highest pin count in the PIC32MX3xx family, enabling complex designs that need parallel buses, multiple UART bridges, and large pin-count glue logic on a single die. The internal 8 MHz Fast RC oscillator with PLL delivers the 80 MHz system clock without an external crystal, simplifying BOM.
Typical applications include industrial control panels, USB peripherals (HID, CDC, mass storage), CAN-based automotive body controllers, multi-channel data loggers, and graphical user-interface boards. The wide -40C to +85C industrial temperature range and 2.3V-3.6V operating voltage suit battery-powered and industrial 3.3V rails alike. The 80 MHz core plus DMA controller supports small embedded TCP/IP stacks and USB audio class implementations without an external PHY.
When designing with this MCU, ensure the USB VBUS pin has a 5V-tolerant protection scheme and the CAN bus uses a proper transceiver (e.g., MCP2551). The 121-ball BGA requires 0.8 mm pitch routing with via-in-pad or laser-drilled microvias; PCB manufacturing cost is higher than QFP equivalents. Decouple each VDD/AVDD pair with 100 nF plus 4.7 uF bulk capacitors placed within 5 mm of the balls. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet.
Drop-in alternatives for PIC32MX360F256L-80I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX360F256L-80I/BG (same form factor and footprint) — differing in ADC, Package, Core Architecture, DMA Channels, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX360F256LT-80I/BG
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →PIC32MX340F128L-80I/BG
✅ Drop-In✓ In Stock
$5.48 / Unit
View Datasheet →PIC32MX460F256L-80I/BG
✅ Drop-In✓ In Stock
$5.55 / Unit
View Datasheet →PIC32MX320F128L-80V/BG
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →PIC32MX675F256L-80I/BG
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →PIC32MX360F256L-80I/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Size | 32-bit |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data SRAM | 32 KB |
| Package | 121-TFBGA (10x10 mm) |
| Operating Voltage | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) |
| I/O Pins | 85 |
| ADC | 10-bit, 1 Msps, up to 16 channels |
| Timers | 5 x 16-bit |
| UART | 2 |
| SPI | 2 |
| I2C | 2 |
| CAN | 1 |
| USB | USB 2.0 Full-Speed OTG |
| DMA Channels | 8 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 |
PIC32MX360F256L-80I/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for PIC32MX360F256L-80I/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX360F256L-80I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX360F256L-80I/BG is suitable for 6 applications: Industrial Control Panels, USB Peripherals (HID/CDC/MSD), CAN-Based Automotive Body Controllers, Multi-Channel Data Loggers, Graphical User Interface Boards, Embedded TCP/IP Connected Devices.
Industrial Control Panels
The PIC32MX360F256L-80I/BG is well-suited for industrial control panels requiring USB connectivity for HMI configuration plus CAN bus for machine networking. Its 80 MHz MIPS32 M4K core executes control loops and Modbus/CANopen stacks simultaneously, while the 256 KB Flash holds GUI assets and bootloader code. The 121-TFBGA package provides 85 GPIO for keypad scanning, LED matrix driving, and parallel LCD interfaces. With -40C to +85C industrial range, it survives factory floor thermal stress without derating.
Recommended
USB Peripherals (HID/CDC/MSD)
The integrated USB 2.0 Full-Speed OTG controller on the PIC32MX360F256L-80I/BG enables plug-and-play HID, CDC, and Mass Storage Device implementations without external PHY. The 80 MHz core and 32 KB SRAM handle USB stacks plus application code, while the DMA controller offloads endpoint transfers to free CPU cycles. The 256 KB Flash holds USB descriptors, bootloader, and application firmware. Per Microchip datasheet DS61143H, the USB module supports Host, Device, and Dual-Role OTG modes with integrated pull-up/pull-down resistors.
Recommended
CAN-Based Automotive Body Controllers
The PIC32MX360F256L-80I/BG's hardware CAN 2.0B controller plus 80 MHz processing speed enables automotive body control modules (BCM) that manage lighting, mirrors, and door locks. With 256 KB Flash and 32 KB SRAM, it accommodates CANopen or J1939 stacks plus application logic. The 121-TFBGA package supports compact BCM PCB layouts. While the industrial -40C to +85C range covers most under-hood zones, AEC-Q100 qualification requires the PIC32MX360F256L-80I/BG automotive-grade equivalent per Microchip family datasheet DS61143H.
Recommended
Multi-Channel Data Loggers
For multi-channel data logging applications, the PIC32MX360F256L-80I/BG provides a 10-bit 1 Msps ADC with up to 16 channels plus 8 DMA channels for background memory transfers. The 256 KB Flash holds logging firmware while the 32 KB SRAM buffers acquired samples before SD card flush. The 80 MHz core sustains 100 ksample/s aggregate throughput. The 2.3V-3.6V operating range suits battery-powered field loggers, and the USB OTG port enables direct file transfer to a host PC without external bridge chips.
Recommended
Graphical User Interface Boards
The PIC32MX360F256L-80I/BG drives small TFT LCDs and touch panels through its 85 GPIO pins with parallel 8080/6800 interface support. The 80 MHz core and DMA controller handle frame buffer updates at 30+ FPS for QVGA (320x240) panels. With 256 KB Flash, the firmware holds graphics libraries, fonts, and UI assets; 32 KB SRAM serves as a partial frame buffer. Per Microchip datasheet DS61143H, the PMP (Parallel Master Port) module directly interfaces to most TFT controllers without external glue logic.
Recommended
Embedded TCP/IP Connected Devices
The PIC32MX360F256L-80I/BG runs the Microchip Harmony TCP/IP stack with HTTP, SNMP, and SNTP protocols when paired with an external ENC28J60 or ENC624J600 Ethernet controller over SPI. The 80 MHz core handles TCP/IP state machines plus application logic, while the 256 KB Flash holds the full Harmony stack with TLS client libraries. The 32 KB SRAM supports several concurrent TCP sockets. USB OTG enables Wi-Fi dongle connectivity, providing flexible network attachment without rewrites per Microchip datasheet DS61143H.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX360F256L-80I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX360F256LT-80I/BG | PIC32MX340F128L-80I/BG | PIC32MX460F256L-80I/BG | PIC32MX675F256L-80I/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB (+100%) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS Host + Device |
| Ethernet | No | No | No | No | Yes (10/100 MAC) |
| Operating Voltage | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Key Differentiators
- Highest GPIO count in PIC32MX3xx family at 85 pins (vs PIC32MX360F256L-80I/PT)
- 256 KB Flash at 80 MHz without external memory bus (vs PIC32MX340F128L-80I/BG)
- Integrated USB OTG without external PHY (vs PIC32MX675F256L-80I/BG)
Design Notes
The 121-ball TFBGA package requires 0.8 mm pitch routing with via-in-pad or laser-drilled microvias on a 4-layer PCB minimum. Estimated: ball-to-pad tolerance is +/- 0.05 mm; use NSMD (Non-Solder Mask Defined) pads with 0.4 mm diameter for reliable assembly. Place 100 nF plus 4.7 uF decoupling capacitors within 5 mm of each VDD/AVDD ball pair, and route ground returns directly to the internal ground plane without splitting. Per Microchip datasheet DS61143H, all unused I/O balls should be left floating or configured as outputs driven low to minimize current leakage.
The PIC32MX360F256L-80I/BG core operates from 2.3V to 3.6V with separate analog AVDD and digital VDD rails that should be tied together at a single point near the MCU with ferrite-bead isolation. Estimated: typical active current at 80 MHz is 65-70 mA per core plus 10 mA per active peripheral. Use a 3.3V LDO such as MCP1700 (250 mA) for low-Iq battery applications, or a switching regulator like MCP16311 for higher efficiency. Add bulk 10 uF tantalum at the regulator output and 100 nF ceramic at each supply pin to suppress switching ripple per Microchip datasheet DS61143H power-supply design guidelines.
Do not apply 5V signals to any GPIO pin on the PIC32MX360F256L-80I/BG except the USB D+/D- pins; all digital I/O are 3.3V absolute maximum per Microchip datasheet DS61143H. For 5V systems, use MCP23008/MCP23S17 I/O expanders or voltage-level translators. Estimated: typical GPIO sink/source is 4-8 mA, insufficient for direct LED driving beyond indicator brightness; add a MOSFET driver for high-current loads. The USB VBUS pin must be protected with USBLC6-2SC6 or equivalent TVS array to survive IEC 61000-4-2 ESD events.
The 80 MHz system clock generates harmonics up to 400 MHz (5th harmonic), which can couple into adjacent analog traces. Keep ADC input traces away from clock and switching power traces; use a grounded guard ring around AVss pins per Microchip datasheet DS61143H layout guidelines. The ADC reference voltage (Vref+) should be bypassed with 100 nF plus 10 uF; do not share Vref+ with digital VDD. Estimated: enable the ADC RC anti-aliasing filter on channels sampling signals above 100 kHz to avoid folding artifacts into the baseband.
Compliance Information
RoHS and REACH compliant per Microchip product page; lead-free and halogen-free BGA balls. Not AEC-Q100 qualified - choose PIC32MX automotive-grade variants for under-hood applications. Conflict-mineral statement available on Microchip corporate responsibility page.
