PIC32MX675F512LT-80I/BG - 80MHz 512KB Flash 32-bit MCU | Microchip
MPN: PIC32MX675F512LT-80I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.21 | $4.21 |
| 10 | $3.94 | $39.40 |
| 100 | $3.59 | $359.00 |
| 500 | $3.32 | $1,660.00 |
| 1,000 | $3.05 | $3,050.00 |
PIC32MX675F512LT-80I/BG Overview
A 32-bit microcontroller (MCU) is a microprocessor that integrates a CPU core, Flash program memory, RAM, and multiple peripherals on a single die, enabling compact embedded designs that previously required separate processor and glue logic. The PIC32 architecture uses a MIPS M4K core with 5-stage pipeline, full 32-bit datapath and single-cycle hardware multiply, positioning it between ARM Cortex-M3 and Cortex-M4 parts in raw integer throughput per MHz.
Key features of this part include 512 KB single-cycle Flash with prefetch, 64 KB SRAM, 53 user I/O, four 16-bit timers, two I2C, two SPI, two UART channels, an Ethernet MAC with MII/RMII interface, USB 2.0 Full-Speed OTG, two CAN 2.0b controllers, a 10-bit 1 Msps ADC with up to 16 channels, a parallel master port (PMP), and a JTAG/ICSP debug interface. The 121-ball TFBGA package provides the largest pin count in the family and enables full peripheral availability with maximum I/O count.
The architecture uses M4K Harvard bus with separate Flash and RAM paths, hardware multiply/divide in 1-2 cycles, prefetch module for Flash, and a 5-stage pipeline. DMA engine offloads peripheral-to-memory transfers, freeing the CPU for application code.
Typical applications include industrial Ethernet gateways, USB to Ethernet bridges, building automation controllers, CAN-based automotive/industrial node interfaces, and connected IoT edge nodes. The integrated Ethernet and USB also suit POS terminals, remote sensor hubs, and HMIs.
When designing with this part, route USB DP/DN as a 90 ohm differential pair, place the 121-ball BGA on inner escape layers, and use the MPLAB Harmony framework to integrate the Ethernet, USB, and CAN stacks. Consider a heatsink or thermal vias under the TFBGA pad for high-activity designs.
This page combines distributor pricing, cross-brand drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet summary to support faster component selection.
Drop-in alternatives for PIC32MX675F512LT-80I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX675F512LT-80I/BG (same form factor and footprint) — differing in Package, ADC, Ethernet MAC, USB, DMA Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX675F512L-80I/BG
✅ Drop-In✓ In Stock
$8.2 / Unit
View Datasheet →PIC32MX675F512LT-80I/PF
✅ Drop-In✓ In Stock
$6.05 / Unit
View Datasheet →PIC32MX675F512L-80V/BG
✅ Drop-In✓ In Stock
$7.1 / Unit
View Datasheet →PIC32MX675F512HT-80I/MR
✅ Drop-In✓ In Stock
$6.45 / Unit
View Datasheet →PIC32MX675F256LT-80I/BG
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →PIC32MX675F256L-80I/BG
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →PIC32MX675F512LT-80I/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Speed | 80 MHz |
| Program Memory Size | 512 KB (512K x 8) Flash |
| SRAM Size | 64 KB |
| User I/O Count | 53 |
| Supply Voltage Range | 2.3 V to 3.6 V |
| Operating Temperature Range | -40C to +85C (industrial) |
| Package | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount |
| Integrated Ethernet MAC | 10/100 Mbit (MII/RMII) |
| USB Controller | USB 2.0 Full-Speed OTG |
| CAN Controller | CAN 2.0b x2 |
| ADC | 10-bit, 1 Msps, up to 16 channels |
| RoHS Status | Compliant |
PIC32MX675F512LT-80I/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for PIC32MX675F512LT-80I/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX675F512LT-80I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX675F512LT-80I/BG is suitable for 6 applications: Industrial Ethernet Gateway, USB to Ethernet Bridge, Building Automation Controller, CAN-Based Industrial Node, Connected IoT Edge Node, POS Terminal / HMI Controller.
Industrial Ethernet Gateway
The PIC32MX675F512LT-80I/BG is purpose-built for industrial Ethernet gateway designs where multi-protocol conversion and deterministic TCP/IP throughput matter. The integrated 10/100 Ethernet MAC with MII/RMII directly interfaces to PHYs like the LAN8720A or KSZ8041, while the 80 MHz MIPS M4K core at 1.56 DMIPS/MHz runs Microchip Harmony's TCP/IP stack at line rate. The 64 KB SRAM is sufficient for TCP segment buffering, and the 512 KB Flash accommodates the Harmony TCP/IP stack plus Modbus/Profibus gateway code. The 121-ball TFBGA exposes 53 GPIO for RS-485, RS-232, and status LED routing on the same PCB. Performance trade-off: choose a PHY with low latency if real-time industrial Ethernet is required.
Recommended
USB to Ethernet Bridge
The PIC32MX675F512LT-80I/BG is well-suited for USB-to-Ethernet bridge dongles and embedded network adapters. The USB 2.0 Full-Speed OTG controller and the 10/100 Ethernet MAC are both integrated, eliminating the need for an external bridge chip. The 80 MHz CPU handles RNDIS or CDC-ECM USB networking stacks while driving Ethernet frames, with the 64 KB SRAM providing adequate buffer space for simultaneous USB and Ethernet traffic. The 121-ball BGA footprint is compact enough for dongle form factors. The main trade-off vs an external dedicated bridge is software complexity - the firmware must implement both USB host/device and Ethernet stacks.
Recommended
Building Automation Controller
The PIC32MX675F512LT-80I/BG fits building automation hub designs that need Ethernet for cloud connectivity and CAN or RS-485 for fieldbus aggregation. The two CAN 2.0b controllers support BACnet or CANopen fieldbus networks common in HVAC controllers, while Ethernet provides IP-based upstream connectivity. The 53 GPIO count handles multiple relay outputs, sensor inputs, and keypad/display interfaces on a single PCB. The industrial -40C to +85C temperature range supports unheated equipment rooms. Performance consideration: the 80 MHz MIPS core can simultaneously drive an Ethernet TCP/IP stack, a CAN fieldbus stack, and a real-time control loop at sub-10 ms cycle times.
Recommended
CAN-Based Industrial Node
The PIC32MX675F512LT-80I/BG suits CAN-based industrial nodes where dual CAN controllers and Ethernet connectivity are both required. The two CAN 2.0b interfaces support redundant CAN networks used in industrial machinery and elevator controllers, while Ethernet provides diagnostics and firmware update channels. The 512 KB Flash accommodates CANopen or J1939 stack plus application code, and the 64 KB SRAM is sufficient for CAN message buffering. The 121-ball BGA also exposes the parallel master port (PMP) for connecting external LCD or FPGA co-processors. Trade-off: dual-CAN designs require two external MCP2562 transceivers.
Recommended
Connected IoT Edge Node
The PIC32MX675F512LT-80I/BG works in connected IoT edge nodes that aggregate sensor data and forward to the cloud over Ethernet. The 10-bit 1 Msps ADC with up to 16 channels handles multi-sensor analog sampling, while Ethernet provides reliable cloud uplink. The 80 MHz MIPS core runs MQTT or HTTP client code with TLS handshake in software, and the 512 KB Flash is large enough to embed a full TLS library. The 121-ball BGA package supports compact edge devices. Performance trade-off: hardware TLS acceleration is absent, so handshake latency is dominated by software RSA computation.
Recommended
POS Terminal / HMI Controller
The PIC32MX675F512LT-80I/BG is well-suited for POS terminal and HMI controller designs that require Ethernet for payment processing, USB for peripherals like barcode scanners or printers, and parallel GPIO for display and keypad. The parallel master port (PMP) interfaces directly to TFT LCDs, while USB 2.0 Full-Speed OTG connects to HID-class peripherals. The 64 KB SRAM buffers display frame updates, and the 512 KB Flash hosts a graphical UI plus networking stack. The 121-ball BGA exposes 53 GPIO for keypad matrix and LED indicator wiring. Trade-off: complex BOM with PHY, LCD, and USB ESD protection.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX675F512LT-80I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX675F512L-80I/BG | PIC32MX675F512LT-80I/PF | PIC32MX675F512L-80V/BG | PIC32MX675F512HT-80I/MR | PIC32MX675F256LT-80I/BG |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | TQFP-100 | 121-TFBGA (10x10) - same | QFN-64 | 121-TFBGA (10x10) - same |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max Clock Speed | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +105C (Extended) | -40C to +85C | -40C to +85C |
| Integrated Ethernet MAC | Yes (10/100) | Yes | Yes | Yes | Yes | Yes |
| User I/O Count | 53 | 53 | ~53 (TQFP-100 variant) | 53 | ~53 (QFN-64 reduced) | 53 |
Key Differentiators
- Highest pin-count BGA option in the family (vs PIC32MX675F512HT-80I/MR (QFN-64))
- 512 KB Flash for full-stack firmware (vs PIC32MX675F256LT-80I/BG (256 KB))
- Industrial -40C to +85C temperature grade (vs PIC32MX675F512L-80V/BG)
Design Notes
Route USB DP/DN as a 90 ohm differential pair with matched length to within 150 mil. Use a common-mode choke and ESD protection diode (e.g., USBLC6-2SC6) near the USB connector. The 121-ball TFBGA escape requires inner microvia layers; plan a 4-layer stackup with via-in-pad if breakout density is high.
The 121-ball TFBGA dissipates power primarily through the die and ball array. For continuous 80 MHz operation driving all peripherals, expect junction temperature rise of 20-30 C above ambient on a 4-layer PCB with thermal via array under the package center pad. Add a thermal via flood (0.3 mm pitch, 0.2 mm drill) under the BGA center balls to the inner ground plane for industrial designs.
Do not exceed 3.6V on any I/O pin - the 3.3V supply is the design point. The Ethernet MAC requires an external PHY (LAN8720A, KSZ8041); do not assume the MAC connects directly to the RJ45 magnetics. The prefetch module must be enabled when running from Flash at 80 MHz, or instruction fetches will incur wait states.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified (use PIC32MX variants in automotive packages for AEC-Q100).
