DSPIC33EP256GM310-H/BG - 16-bit 70 MIPS DSC 256KB Flash | Microchip
MPN: DSPIC33EP256GM310-H/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.9 | $8.90 |
| 10 | $8.1 | $81.00 |
| 100 | $7.25 | $725.00 |
| 500 | $6.6 | $3,300.00 |
| 1,000 | $5.95 | $5,950.00 |
DSPIC33EP256GM310-H/BG Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP: it executes control loops and DSP math (MAC, multiply-accumulate, DSP engine with accumulator) in a single Harvard-architecture 16-bit core, making it the de facto choice for closed-loop digital power conversion and motor control.
Key features of the GM310 variant include the 70 MIPS dsPIC33E CPU core with integrated DSP engine, 256KB of self-programmable Flash, multiple on-chip op-amps, high-resolution PWM peripherals for motor control, and rich analog and communication peripherals. The -H suffix designates the extended automotive temperature operating range, and the /BG suffix identifies the 121-ball TFBGA ball-grid array package that minimizes board area for high pin-count designs.
Architecturally, the dsPIC33E family pairs the Harvard CPU with a 16-bit x 16-bit hardware multiplier, 32/40-bit accumulators and single-cycle MAC, enabling precision FOC (field-oriented control) and power-conversion algorithms with deterministic cycle counts. Flexible clocking with an internal fast RC oscillator and PLL, plus multiple PGECx/PGEDx pairs for In-Circuit Serial Programming (ICSP) debugging, support both production and development flows.
Typical applications include precision brushless DC and PMSM motor drives, digital power supplies (PFC, LLC), industrial automation and robotics controllers, and automotive auxiliary systems requiring AEC-Q100-grade silicon.
When designing with this device, connect all VDD and VSS ball pairs as required by the datasheet and route ICSP clock/data to a single matched PGECx/PGEDx pair; the 10x10 TFBGA footprint demands careful via-in-pad and fanout planning.
This page synthesizes distributor pricing tiers, verified drop-in alternatives within the same 121-TFBGA footprint, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GM310-H/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM310-H/BG (same form factor and footprint) — differing in Core, Package, Qualification, RoHS Status, Motor Control PWM Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesDSPIC33EP256GM310-H/BG Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC core |
| Core Architecture | dsPIC, Harvard |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| Supply Voltage | 3.3 V |
| Qualification | Automotive, AEC-Q100 |
| Package | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount |
| Data Bus Width | 16 bit |
| On-chip Peripherals | Motor Control PWM, OpAmps |
| Debug/Programming Interface | ICSP (multiple PGECx/PGEDx pairs) |
| Product Series | dsPIC33EP256GM310 |
| Packaging | Tray |
| Temperature Grade | H (extended automotive range) |
DSPIC33EP256GM310-H/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256GM310-H/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM310-H/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM310-H/BG is suitable for 6 applications: Precision Motor Control, Digital Power Conversion, Automotive Auxiliary Control, Industrial Automation and Robotics, Sensor Signal Processing and Data Acquisition, Embedded Control and Connectivity Hubs.
Precision Motor Control
The DSPIC33EP256GM310-H/BG is a flagship choice for precision PMSM and BLDC motor drives: its 70 MIPS DSP core executes field-oriented control (FOC) with deterministic cycle counts, while the motor-control PWM module provides complementary outputs with programmable dead time. On-chip op-amps condition shunt-resistor current feedback directly into the ADC, removing external amplifier stages. Placed at the center of the inverter board, the DSC samples phase currents at PWM frequency and updates duty cycles within one control period, achieving low torque ripple and high efficiency. The 121-TFBGA package keeps the controller footprint compact near gate drivers.
Recommended
Digital Power Conversion
Digital switching power supplies - PFC stages, LLC resonant converters, and DC-DC modules - benefit directly from the DSPIC33EP256GM310-H/BG's 70 MIPS core and DSP engine. The single-cycle MAC and 40-bit accumulator implement compensator equations (PI/PID, resonant controllers) with predictable latency, while high-resolution PWM outputs drive the power switches. The 3.3V logic domain interfaces cleanly with isolated gate-driver ICs via optocouplers or digital isolators. The AEC-Q100 qualification of the -H variant extends its use into on-board charger and auxiliary power designs where automotive-grade silicon is mandatory.
Recommended
Automotive Auxiliary Control
Because the DSPIC33EP256GM310-H/BG carries AEC-Q100 qualification and the extended automotive H temperature grade, it fits non-safety-critical automotive systems such as pumps, fans, HVAC blowers, throttle-by-wire auxiliaries, and lighting control modules. The 256KB Flash accommodates diagnostics, UDS-style service layers, and OTA-style bootloader code alongside the control algorithm. The 121-TFBGA 10x10 mm package suits compact ECUs, and the 3.3V I/O interfaces with standard automotive transceivers (CAN, LIN) through Microchip companion devices. Designers should apply the extended temperature derating guidance from the manufacturer datasheet in under-hood-adjacent zones.
Recommended
Industrial Automation and Robotics
In factory automation, the DSPIC33EP256GM310-H/BG serves as a real-time motion controller and sensor-fusion node: the 70 MIPS core closes servo loops, runs commutation math, and handles encoder feedback simultaneously. Multiple PGECx/PGEDx pairs simplify in-circuit reprogramming of deployed machinery through ICSP without board removal. On-chip op-amps reduce BOM cost in current-sensing front ends, while the 256KB Flash holds protocol stacks for industrial buses. The TFBGA package supports dense multi-axis drive boards where controller area is at a premium, and tray packaging suits production programming workflows.
Recommended
Sensor Signal Processing and Data Acquisition
The integrated DSP engine and on-chip op-amps make the DSPIC33EP256GM310-H/BG an efficient front-end for sensor acquisition: shunt, pressure, or vibration signals are amplified on-chip, digitized by the ADC, and filtered with MAC-based FIR/IIR routines at 70 MIPS throughput. The Harvard architecture keeps data and instruction buses independent, sustaining deterministic sampling intervals needed for spectral analysis and condition-monitoring. The 121-ball footprint supports analog-digital partitioned layouts with short returns. For industrial monitoring nodes requiring AEC-grade reliability in harsh enclosures, the -H automotive qualification adds margin over standard industrial parts.
Recommended
Embedded Control and Connectivity Hubs
General-purpose embedded controllers with DSP workloads - HVAC controllers, chargers, instrumentation, and smart appliances - use the DSPIC33EP256GM310-H/BG as the main system MCU. The 70 MIPS core comfortably runs a real-time kernel plus application logic, the 256KB Flash supports rich feature sets and field upgrades, and the peripheral set (communication, PWM, analog) eliminates external co-processors. The device programs and debugs through standard Microchip ICSP tools (PICkit, ICD, REAL ICE) using any matched PGECx/PGEDx pair, keeping the development flow consistent with the broader dsPIC33E ecosystem and its codebase reuse.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM310-H/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM310T-I/BG | DSPIC33EP256GM310-E/BG | DSPIC33EP256GM310-I/BG | DSPIC33EP512GM310-H/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256KB (85.5K x 24) | 256KB (85.5K x 24) | 256KB (85.5K x 24) | 256KB (85.5K x 24) | 512KB |
| Max CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | H (automotive extended) | I (industrial) | E (extended) | I (industrial) | H (automotive extended) |
Key Differentiators
- Automotive AEC-Q100 qualification with extended H temperature grade (vs DSPIC33EP256GM310T-I/BG)
- Largest family density without changing footprint (vs DSPIC33EP256GM310-E/BG)
- Compact 10x10 mm ball-grid form factor (vs DSPIC33EP256GM310-H/PT)
Design Notes
The 121-ball TFBGA (0.65 mm-class pitch, 10x10 mm body) requires careful fanout planning: use via-in-pad or short dogbone escapes with 4-6 mil trace/space, and dedicate at least two inner layers as ground planes. Plan the ICSP routing early - pick ONE matched PGECx/PGEDx pair (for example PGEC2/PGED2) and bring both to a header; mixing pins from different pairs breaks programming. Keep crystal traces short and guarded by ground return vias.
The device operates from a 3.3V rail with multiple VDD/VSS ball pairs. Estimated: every VDD ball must be connected and locally decoupled - place one 0.1 uF ceramic per VDD/VSS pair within 2 mm of the ball, plus one bulk 10 uF per rail region. Do not share a single decoupling capacitor across pairs, as simultaneous switching of the 70 MIPS core and PWM outputs induces ground bounce that appears as ADC noise in current-sensing loops.
A frequent substitution error is ordering DSPIC33EP256GM310-H/PT (TQFP-100) as a replacement for the /BG part - the packages are NOT footprint interchangeable. Also, the -H suffix denotes the automotive temperature grade; using the industrial -I part in an AEC-Q100-specified build violates quality-system traceability. When migrating from 256KB to the 512KB Flash variant (DSPIC33EP512GM310-H/BG), verify linker script and configuration-word addresses in the updated datasheet.
For motor-control PWM outputs driving gate drivers, keep the TFBGA fanout traces to the gate-driver inputs short and matched in length per half-bridge to minimize dead-time skew. Estimated: at 70 MIPS PWM update rates, even 50 mm of unmatched trace adds noticeable skew at high switching frequencies. Use series resistors (estimated 22-47 ohm, tune by measurement) at PWM pins to damp ringing into long interconnects.
Compliance Information
AEC-Q100 automotive qualification is explicitly stated in Lisleapex and Hotenda product data. RoHS/REACH/lead-free status must be confirmed on the official Microchip product page or datasheet before release.
