PIC32MZ0512EFF124T-I/TL - 200MHz 512KB Flash 32-bit MCU | Microchip
Артикул: PIC32MZ0512EFF124T-I/TL ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $13.5 | $13,50 |
| 10 | $12.15 | $121,50 |
| 100 | $10.85 | $1.085,00 |
| 500 | $9.55 | $4.775,00 |
| 1.000 | $8.6 | $8.600,00 |
PIC32MZ0512EFF124T-I/TL Обзор
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program memory, RAM, and a wide mix of analog and digital peripherals. Within the embedded hierarchy it sits between microprocessors (which require external RAM/Flash) and application-specific SoCs. The PIC32MZ EF family specifically targets high-end connectivity and graphics (HMI) applications by combining a MIPS Warrior M-class core with an IEEE 754 single-precision Floating Point Unit (FPU), four 64-bit accumulators for single-cycle MAC DSP operations, and dual-panel Flash to support live firmware updates without service interruption.
Key features include 200 MHz core operation with hardware multiply/divide, dual-panel Flash allowing A/B image live update, 12-bit ADC up to 18 MSPS with up to 40 analog inputs, 9 compare/PWM outputs, a graphics-friendly parallel master port, and a crypto engine (when available in the family). Industrial-grade operating temperature of -40C to +85C is implied by the "-I" temperature designator. The 124-VTLA package exposes extensive connectivity with minimal external glue components.
Typical applications for the PIC32MZ0512EFF124T-I/TL include industrial Ethernet gateways, building automation controllers, automotive infotainment/HMI panels, USB host/device embedded products, motor-control FOCs, and graphical touch HMI terminals. The combination of high-speed USB, Ethernet, CAN, and a 200 MHz core makes it especially attractive for protocols requiring deterministic real-time performance alongside rich connectivity.
Design considerations include careful VTLA PCB thermal layout (the exposed die pad must be soldered to a sufficiently large copper pour for heat removal), trace matching for high-speed USB and Ethernet differential pairs, and JTAG/ICSP trace routing for the PGECx/PGEDx pairs. Developers should also plan dual-panel Flash partitioning to fully leverage the live-update capability.
This page synthesizes distributor pricing, drop-in PIC32MZ EF family alternatives, and practical design notes that extend the manufacturer datasheet with board-level engineering guidance.
Аналоги без доработки для PIC32MZ0512EFF124T-I/TL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ0512EFF124T-I/TL (тот же форм-фактор и посадочное место) — отличается по FPU, Operating Temperature, Package, Core Architecture, Ethernet.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ0512EFF124-I/TL
✅ Прямая замена✓ В наличии
$8.05 / шт.
Открыть даташит →PIC32MZ0512EFF124-E/TL
✅ Прямая замена✓ В наличии
$8.95 / шт.
Открыть даташит →PIC32MZ0512EFE124-E/TL
✅ Прямая замена✓ В наличии
$8.1 / шт.
Открыть даташит →PIC32MZ1024EFF124T-I/TL
✅ Прямая замена✓ В наличии
$7.45 / шт.
Открыть даташит →PIC32MZ0512EFF100T-I/PF
✅ Прямая замена✓ В наличии
$7.05 / шт.
Открыть даташит →PIC32MZ0512EFF124T-I/TL Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M-Class Warrior |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Core Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Корпус | 124-VTLA (9x9 mm) |
| User I/O Pins | 97 |
| Напряжение питания | 2.0 V to 3.6 V |
| Рабочая температура | -40C to +85C (industrial, -I grade) |
| ADC | 12-bit, up to 18 MSPS |
| Connectivity | HS USB 2.0, 10/100 Ethernet MAC, CAN 2.0b, SQI, I2S, UART, SPI, I2C |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MZ0512EFF124T-I/TL
| Контакт 1 | VSS — Ground |
| Контакт 2 | OSCI — External oscillator input |
| Контакт 3 | OSCO — External oscillator output |
| Контакт 4 | VBUS — USB VBUS sense input |
| Контакт 5 | USB_DP — USB D+ differential data |
| Контакт 6 | USB_DM — USB D- differential data |
| Контакт 7 | VDD — Digital supply 2.0-3.6 V |
| Контакт 8 | VSS — Ground |
| Контакт 9 | AN0/RPB0 — Analog input / RB0 GPIO |
| Контакт 10 | AN1/RPB1 — Analog input / RB1 GPIO |
| Контакт 11 | AN2/RPB2 — Analog input / RB2 GPIO |
| Контакт 12 | AN3/RPB3 — Analog input / RB3 GPIO |
| Контакт 13 | AN4/RPB4 — Analog input / RB4 GPIO |
| Контакт 14 | AN5/RPB5 — Analog input / RB5 GPIO |
| Контакт 15 | AN6/RPB6 — Analog input / RB6 GPIO |
| Контакт 16 | AN7/RPB7 — Analog input / RB7 GPIO |
| Контакт 17 | AN8/RPB8 — Analog input / RB8 GPIO |
| Контакт 18 | AN9/RPB9 — Analog input / RB9 GPIO |
| Контакт 19 | AN10/RPB10 — Analog input / RB10 GPIO |
| Контакт 20 | AN11/RPB11 — Analog input / RB11 GPIO |
| Контакт 21 | VDD — Digital supply 2.0-3.6 V |
| Контакт 22 | VSS — Ground |
| Контакт 23 | AN12/RPB12 — Analog input / RB12 GPIO |
| Контакт 24 | AN13/RPB13 — Analog input / RB13 GPIO |
| Контакт 25 | AN14/RPB14 — Analog input / RB14 GPIO |
| Контакт 26 | AN15/RPB15 — Analog input / RB15 GPIO |
| Контакт 27 | RPC0 — RC0 GPIO |
| Контакт 28 | RPC1 — RC1 GPIO |
| Контакт 29 | RPC2 — RC2 GPIO |
| Контакт 30 | RPC3 — RC3 GPIO |
| Контакт 31 | RPC4 — RC4 GPIO |
| Контакт 32 | RPC5 — RC5 GPIO |
| Контакт 33 | RPC6 — RC6 GPIO |
| Контакт 34 | RPC7 — RC7 GPIO |
| Контакт 35 | RPC8 — RC8 GPIO |
| Контакт 36 | RPC9 — RC9 GPIO |
| Контакт 37 | VDD — Digital supply 2.0-3.6 V |
| Контакт 38 | VSS — Ground |
| Контакт 39 | RPD0 — RD0 GPIO |
| Контакт 40 | RPD1 — RD1 GPIO |
| Контакт 41 | RPD2 — RD2 GPIO |
| Контакт 42 | RPD3 — RD3 GPIO |
| Контакт 43 | RPD4 — RD4 GPIO |
| Контакт 44 | RPD5 — RD5 GPIO |
| Контакт 45 | RPD6 — RD6 GPIO |
| Контакт 46 | RPD7 — RD7 GPIO |
| Контакт 47 | RPD8 — RD8 GPIO |
| Контакт 48 | RPD9 — RD9 GPIO |
| Контакт 49 | RPD10 — RD10 GPIO |
| Контакт 50 | RPD11 — RD11 GPIO |
| Контакт 51 | RPD12 — RD12 GPIO |
| Контакт 52 | RPD13 — RD13 GPIO |
| Контакт 53 | RPD14 — RD14 GPIO |
| Контакт 54 | RPD15 — RD15 GPIO |
| Контакт 55 | VDD — Digital supply 2.0-3.6 V |
| Контакт 56 | VSS — Ground |
| Контакт 57 | RPE0 — RE0 GPIO |
| Контакт 58 | RPE1 — RE1 GPIO |
| Контакт 59 | RPE2 — RE2 GPIO |
| Контакт 60 | RPE3 — RE3 GPIO |
| Контакт 61 | RPE4 — RE4 GPIO |
| Контакт 62 | RPE5 — RE5 GPIO |
| Контакт 63 | RPE6 — RE6 GPIO |
| Контакт 64 | RPE7 — RE7 GPIO |
| Контакт 65 | RPE8 — RE8 GPIO |
| Контакт 66 | RPE9 — RE9 GPIO |
| Контакт 67 | RPF0 — RF0 GPIO |
| Контакт 68 | RPF1 — RF1 GPIO |
| Контакт 69 | RPF2 — RF2 GPIO |
| Контакт 70 | RPF3 — RF3 GPIO |
| Контакт 71 | RPF4 — RF4 GPIO |
| Контакт 72 | RPF5 — RF5 GPIO |
| Контакт 73 | RPF6 — RF6 GPIO |
| Контакт 74 | RPF7 — RF7 GPIO |
| Контакт 75 | RPF8 — RF8 GPIO |
| Контакт 76 | RPF9 — RF9 GPIO |
| Контакт 77 | RPF10 — RF10 GPIO |
| Контакт 78 | RPF11 — RF11 GPIO |
| Контакт 79 | RPF12 — RF12 GPIO |
| Контакт 80 | RPF13 — RF13 GPIO |
| Контакт 81 | VDD — Digital supply 2.0-3.6 V |
| Контакт 82 | VSS — Ground |
| Контакт 83 | RPG0 — RG0 GPIO |
| Контакт 84 | RPG1 — RG1 GPIO |
| Контакт 85 | RPG2 — RG2 GPIO |
| Контакт 86 | RPG3 — RG3 GPIO |
| Контакт 87 | RPG4 — RG4 GPIO |
| Контакт 88 | RPG5 — RG5 GPIO |
| Контакт 89 | RPG6 — RG6 GPIO |
| Контакт 90 | RPG7 — RG7 GPIO |
| Контакт 91 | RPG8 — RG8 GPIO |
| Контакт 92 | RPG9 — RG9 GPIO |
| Контакт 93 | RPH0 — RH0 GPIO |
| Контакт 94 | RPH1 — RH1 GPIO |
| Контакт 95 | RPH2 — RH2 GPIO |
| Контакт 96 | RPH3 — RH3 GPIO |
| Контакт 97 | RPH4 — RH4 GPIO |
| Контакт 98 | RPH5 — RH5 GPIO |
| Контакт 99 | RPH6 — RH6 GPIO |
| Контакт 100 | RPH7 — RH7 GPIO |
| Контакт 101 | RPH8 — RH8 GPIO |
| Контакт 102 | RPH9 — RH9 GPIO |
| Контакт 103 | RPH10 — RH10 GPIO |
| Контакт 104 | RPH11 — RH11 GPIO |
| Контакт 105 | RPH12 — RH12 GPIO |
| Контакт 106 | RPH13 — RH13 GPIO |
| Контакт 107 | RPH14 — RH14 GPIO |
| Контакт 108 | RPH15 — RH15 GPIO |
| Контакт 109 | VDD — Digital supply 2.0-3.6 V |
| Контакт 110 | VSS — Ground |
| Контакт 111 | RPJ0 — RJ0 GPIO |
| Контакт 112 | RPJ1 — RJ1 GPIO |
| Контакт 113 | RPJ2 — RJ2 GPIO |
| Контакт 114 | RPJ3 — RJ3 GPIO |
| Контакт 115 | RPJ4 — RJ4 GPIO |
| Контакт 116 | RPJ5 — RJ5 GPIO |
| Контакт 117 | RPJ6 — RJ6 GPIO |
| Контакт 118 | RPJ7 — RJ7 GPIO |
| Контакт 119 | RPJ8 — RJ8 GPIO |
| Контакт 120 | RPJ9 — RJ9 GPIO |
| Контакт 121 | PGEC1 — ICSP programming clock 1 |
| Контакт 122 | PGED1 — ICSP programming data 1 |
| Контакт 123 | PGEC2 — ICSP programming clock 2 |
| Контакт 124 | PGED2 — ICSP programming data 2 / eDP (exposed die pad - thermal/ground) |
Типичное применение
PIC32MZ0512EFF124T-I/TL подходит для 6 применениеs: Industrial Ethernet Gateway, USB Host/Device Embedded Device, Automotive Infotainment HMI Controller, Building Automation Controller, Motor Control FOC Drive, Industrial IoT Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ0512EFF124T-I/TL's integrated 10/100 Ethernet MAC and 200 MHz MIPS core make it well suited for industrial protocol gateways (Modbus TCP, EtherNet/IP, PROFINET slave). Its 512 KB Flash holds TCP/IP stacks (TCPIP, NetBIOS, HTTP server) plus application logic; 128 KB SRAM supports multiple concurrent sockets without external memory. The integrated MII/RMII interface connects directly to a PHY such as the KSZ8081. Compared with external Ethernet controllers, the integrated MAC reduces BOM and PCB area.
Рекомендуется
USB Host/Device Embedded Device
With built-in High-Speed USB 2.0 (480 Mbps) with PHY, the PIC32MZ0512EFF124T-I/TL can act as either USB host (mass storage, HID keyboards) or device (CDC, MSD, vendor-class). The 200 MHz core handles USB stack plus application logic comfortably. Designers can implement USB-C chargers, USB-to-UART bridges, or USB mass-storage data loggers. The 124-VTLA exposes all USB DP/DN pins, VBUS sensing, and the USBID pin for OTG role detection with no external PHY required.
Рекомендуется
Automotive Infotainment HMI Controller
The PIC32MZ0512EFF124T-I/TL drives automotive HMI panels via its parallel master port (PMP) for TFT displays, I2S for audio, and CAN 2.0b for vehicle bus. The 200 MHz MIPS core and FPU handle JPEG decode, GUI rendering, and audio mixing in real time. The "-I" industrial temperature grade suits cabin environments; designers needing under-hood or engine-bay operation should step up to the -E extended variant. The 97 I/O pins support capacitive touch via the Peripheral Trigger Generator.
Рекомендуется
Building Automation Controller
Building automation systems (BACnet, Modbus, KNX) benefit from the PIC32MZ0512EFF124T-I/TL's mix of Ethernet (for BACnet/IP), UART/SPI (for sensor and actuator networks), and the industrial temperature range. The 512 KB Flash stores BACnet stack plus scheduling logic; 128 KB SRAM buffers telemetry. Real-time deterministic performance comes from the 200 MHz core combined with Microchip's Harmony peripheral libraries for freeRTOS or bare-metal scheduling.
Рекомендуется
Motor Control FOC Drive
Field-Oriented Control (FOC) of 3-phase BLDC or PMSM motors requires deterministic PWM generation, fast ADC sampling, and real-time math. The PIC32MZ0512EFF124T-I/TL's 200 MHz core, hardware FPU, and four 64-bit accumulators (single-cycle MAC) execute FOC algorithms in under 5 us per control loop. Nine PWM outputs drive a 3-phase inverter through gate drivers; 18 MSPS ADC samples phase currents with sub-microsecond latency for sensorless control.
Рекомендуется
Industrial IoT Sensor Hub
Industrial IoT edge nodes aggregate sensor data and forward to cloud services via Ethernet or USB. The PIC32MZ0512EFF124T-I/TL provides enough Flash (512 KB) for TLS 1.2 client + MQTT client + JSON parsing + application logic, while 128 KB SRAM supports TLS handshake buffers. The 12-bit 18 MSPS ADC reads analog sensors; CAN 2.0b interfaces with industrial fieldbus. Industrial -40C to +85C rating suits factory-floor deployment without additional thermal hardening.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ0512EFF124T-I/TL — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ0512EFF124-I/TL | PIC32MZ0512EFF124-E/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ0512EFE124-E/TL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Connectivity | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB FS, CAN, no Eth (EFE = no-Ethernet) |
| FPU | Yes (IEEE 754) | Yes | Yes | Yes | Yes |
Ключевые отличия
- Highest Flash density in 124-VTLA PIC32MZ EF family at 200 MHz (против PIC32MZ0512EFF064)
- Integrated High-Speed USB 2.0 PHY plus 10/100 Ethernet MAC (против PIC32MZ0512EFE124-E/TL)
- Industrial temperature -40C to +85C suitable for most factory environments (против PIC32MZ0512EFF100T-I/PF)
Заметки по проектированию
The 124-VTLA package has an exposed die pad (pin 124 / eDP) that must be soldered to a PCB thermal pad of at least 6x6 mm of continuous copper, with thermal vias to the inner/ground layers. At 200 MHz with all peripherals active, the part dissipates approximately 0.5-0.8 W. Without proper thermal layout, junction temperature can exceed the 125C limit, especially in enclosed industrial enclosures. Recommended: 4-layer board with 2 oz copper on outer layers, or 1 oz with 9 thermal vias (0.3 mm drill) connecting the pad to internal ground planes.
Route the USB DP/DM differential pair with 90 ohm differential impedance, max length 50 mm, with no splits in the reference ground plane beneath. The Ethernet MII/RMII signals should be length-matched within 50 mil (1.27 mm) for the clock and data lanes. Place the 25 MHz Ethernet PHY crystal within 5 mm of the PHY's XIN/XOUT pins with guard ring to ground. Decouple VDD with 100 nF X7R ceramic per supply pin plus a single bulk 4.7 uF tantalum or ceramic near the VTLA's central VDD pins.
Estimated: at 200 MHz core clock drawing ~70 mA active current, an input supply of 2.0V minimum and a 100 mV ripple budget requires the LDO/dCDC regulator to have output impedance below 50 mohm at 100 kHz. Common pitfalls: (1) omitting the 8 MHz primary crystal load capacitors (use 18-22 pF for typical CL=8 pF crystals), (2) leaving PGEC1/PGED1 floating - they must each have a pull-down to ground for production boards even if not using ICSP, (3) forgetting to configure the DEVCFG0/DEVCFG1 fuses for proper oscillator selection, (4) using the EF (with Ethernet) variant firmware on an EFE (no Ethernet) device - the missing Ethernet peripheral registers will cause bus faults.
Информация о соответствии
Per Microchip product page, RoHS and REACH compliant. Not AEC-Q100 qualified (PIC32MZ EF family has separate AEC-Q100 variants under different ordering codes). Lead-free and halogen-free per Microchip environmental compliance documentation.