PIC32MZ0512EFF124T-I/TL - 200MHz 512KB Flash 32-bit MCU | Microchip
Référence : PIC32MZ0512EFF124T-I/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.5 | $13,50 |
| 10 | $12.15 | $121,50 |
| 100 | $10.85 | $1 085,00 |
| 500 | $9.55 | $4 775,00 |
| 1 000 | $8.6 | $8 600,00 |
PIC32MZ0512EFF124T-I/TL Présentation
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program memory, RAM, and a wide mix of analog and digital peripherals. Within the embedded hierarchy it sits between microprocessors (which require external RAM/Flash) and application-specific SoCs. The PIC32MZ EF family specifically targets high-end connectivity and graphics (HMI) applications by combining a MIPS Warrior M-class core with an IEEE 754 single-precision Floating Point Unit (FPU), four 64-bit accumulators for single-cycle MAC DSP operations, and dual-panel Flash to support live firmware updates without service interruption.
Key features include 200 MHz core operation with hardware multiply/divide, dual-panel Flash allowing A/B image live update, 12-bit ADC up to 18 MSPS with up to 40 analog inputs, 9 compare/PWM outputs, a graphics-friendly parallel master port, and a crypto engine (when available in the family). Industrial-grade operating temperature of -40C to +85C is implied by the "-I" temperature designator. The 124-VTLA package exposes extensive connectivity with minimal external glue components.
Typical applications for the PIC32MZ0512EFF124T-I/TL include industrial Ethernet gateways, building automation controllers, automotive infotainment/HMI panels, USB host/device embedded products, motor-control FOCs, and graphical touch HMI terminals. The combination of high-speed USB, Ethernet, CAN, and a 200 MHz core makes it especially attractive for protocols requiring deterministic real-time performance alongside rich connectivity.
Design considerations include careful VTLA PCB thermal layout (the exposed die pad must be soldered to a sufficiently large copper pour for heat removal), trace matching for high-speed USB and Ethernet differential pairs, and JTAG/ICSP trace routing for the PGECx/PGEDx pairs. Developers should also plan dual-panel Flash partitioning to fully leverage the live-update capability.
This page synthesizes distributor pricing, drop-in PIC32MZ EF family alternatives, and practical design notes that extend the manufacturer datasheet with board-level engineering guidance.
Alternatives de remplacement direct pour PIC32MZ0512EFF124T-I/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFF124T-I/TL (même facteur de forme et même empreinte) — différant par FPU, Operating Temperature, Package, Core Architecture, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFF124-I/TL
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →PIC32MZ0512EFF124-E/TL
✅ Remplacement direct✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MZ0512EFE124-E/TL
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ1024EFF124T-I/TL
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →PIC32MZ0512EFF100T-I/PF
✅ Remplacement direct✓ En stock
$7.05 / unité
Voir la fiche technique →PIC32MZ0512EFF124T-I/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class Warrior |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Core Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Boîtier | 124-VTLA (9x9 mm) |
| User I/O Pins | 97 |
| Tension d'alimentation | 2.0 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (industrial, -I grade) |
| ADC | 12-bit, up to 18 MSPS |
| Connectivity | HS USB 2.0, 10/100 Ethernet MAC, CAN 2.0b, SQI, I2S, UART, SPI, I2C |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ0512EFF124T-I/TL
| Broche 1 | VSS — Ground |
| Broche 2 | OSCI — External oscillator input |
| Broche 3 | OSCO — External oscillator output |
| Broche 4 | VBUS — USB VBUS sense input |
| Broche 5 | USB_DP — USB D+ differential data |
| Broche 6 | USB_DM — USB D- differential data |
| Broche 7 | VDD — Digital supply 2.0-3.6 V |
| Broche 8 | VSS — Ground |
| Broche 9 | AN0/RPB0 — Analog input / RB0 GPIO |
| Broche 10 | AN1/RPB1 — Analog input / RB1 GPIO |
| Broche 11 | AN2/RPB2 — Analog input / RB2 GPIO |
| Broche 12 | AN3/RPB3 — Analog input / RB3 GPIO |
| Broche 13 | AN4/RPB4 — Analog input / RB4 GPIO |
| Broche 14 | AN5/RPB5 — Analog input / RB5 GPIO |
| Broche 15 | AN6/RPB6 — Analog input / RB6 GPIO |
| Broche 16 | AN7/RPB7 — Analog input / RB7 GPIO |
| Broche 17 | AN8/RPB8 — Analog input / RB8 GPIO |
| Broche 18 | AN9/RPB9 — Analog input / RB9 GPIO |
| Broche 19 | AN10/RPB10 — Analog input / RB10 GPIO |
| Broche 20 | AN11/RPB11 — Analog input / RB11 GPIO |
| Broche 21 | VDD — Digital supply 2.0-3.6 V |
| Broche 22 | VSS — Ground |
| Broche 23 | AN12/RPB12 — Analog input / RB12 GPIO |
| Broche 24 | AN13/RPB13 — Analog input / RB13 GPIO |
| Broche 25 | AN14/RPB14 — Analog input / RB14 GPIO |
| Broche 26 | AN15/RPB15 — Analog input / RB15 GPIO |
| Broche 27 | RPC0 — RC0 GPIO |
| Broche 28 | RPC1 — RC1 GPIO |
| Broche 29 | RPC2 — RC2 GPIO |
| Broche 30 | RPC3 — RC3 GPIO |
| Broche 31 | RPC4 — RC4 GPIO |
| Broche 32 | RPC5 — RC5 GPIO |
| Broche 33 | RPC6 — RC6 GPIO |
| Broche 34 | RPC7 — RC7 GPIO |
| Broche 35 | RPC8 — RC8 GPIO |
| Broche 36 | RPC9 — RC9 GPIO |
| Broche 37 | VDD — Digital supply 2.0-3.6 V |
| Broche 38 | VSS — Ground |
| Broche 39 | RPD0 — RD0 GPIO |
| Broche 40 | RPD1 — RD1 GPIO |
| Broche 41 | RPD2 — RD2 GPIO |
| Broche 42 | RPD3 — RD3 GPIO |
| Broche 43 | RPD4 — RD4 GPIO |
| Broche 44 | RPD5 — RD5 GPIO |
| Broche 45 | RPD6 — RD6 GPIO |
| Broche 46 | RPD7 — RD7 GPIO |
| Broche 47 | RPD8 — RD8 GPIO |
| Broche 48 | RPD9 — RD9 GPIO |
| Broche 49 | RPD10 — RD10 GPIO |
| Broche 50 | RPD11 — RD11 GPIO |
| Broche 51 | RPD12 — RD12 GPIO |
| Broche 52 | RPD13 — RD13 GPIO |
| Broche 53 | RPD14 — RD14 GPIO |
| Broche 54 | RPD15 — RD15 GPIO |
| Broche 55 | VDD — Digital supply 2.0-3.6 V |
| Broche 56 | VSS — Ground |
| Broche 57 | RPE0 — RE0 GPIO |
| Broche 58 | RPE1 — RE1 GPIO |
| Broche 59 | RPE2 — RE2 GPIO |
| Broche 60 | RPE3 — RE3 GPIO |
| Broche 61 | RPE4 — RE4 GPIO |
| Broche 62 | RPE5 — RE5 GPIO |
| Broche 63 | RPE6 — RE6 GPIO |
| Broche 64 | RPE7 — RE7 GPIO |
| Broche 65 | RPE8 — RE8 GPIO |
| Broche 66 | RPE9 — RE9 GPIO |
| Broche 67 | RPF0 — RF0 GPIO |
| Broche 68 | RPF1 — RF1 GPIO |
| Broche 69 | RPF2 — RF2 GPIO |
| Broche 70 | RPF3 — RF3 GPIO |
| Broche 71 | RPF4 — RF4 GPIO |
| Broche 72 | RPF5 — RF5 GPIO |
| Broche 73 | RPF6 — RF6 GPIO |
| Broche 74 | RPF7 — RF7 GPIO |
| Broche 75 | RPF8 — RF8 GPIO |
| Broche 76 | RPF9 — RF9 GPIO |
| Broche 77 | RPF10 — RF10 GPIO |
| Broche 78 | RPF11 — RF11 GPIO |
| Broche 79 | RPF12 — RF12 GPIO |
| Broche 80 | RPF13 — RF13 GPIO |
| Broche 81 | VDD — Digital supply 2.0-3.6 V |
| Broche 82 | VSS — Ground |
| Broche 83 | RPG0 — RG0 GPIO |
| Broche 84 | RPG1 — RG1 GPIO |
| Broche 85 | RPG2 — RG2 GPIO |
| Broche 86 | RPG3 — RG3 GPIO |
| Broche 87 | RPG4 — RG4 GPIO |
| Broche 88 | RPG5 — RG5 GPIO |
| Broche 89 | RPG6 — RG6 GPIO |
| Broche 90 | RPG7 — RG7 GPIO |
| Broche 91 | RPG8 — RG8 GPIO |
| Broche 92 | RPG9 — RG9 GPIO |
| Broche 93 | RPH0 — RH0 GPIO |
| Broche 94 | RPH1 — RH1 GPIO |
| Broche 95 | RPH2 — RH2 GPIO |
| Broche 96 | RPH3 — RH3 GPIO |
| Broche 97 | RPH4 — RH4 GPIO |
| Broche 98 | RPH5 — RH5 GPIO |
| Broche 99 | RPH6 — RH6 GPIO |
| Broche 100 | RPH7 — RH7 GPIO |
| Broche 101 | RPH8 — RH8 GPIO |
| Broche 102 | RPH9 — RH9 GPIO |
| Broche 103 | RPH10 — RH10 GPIO |
| Broche 104 | RPH11 — RH11 GPIO |
| Broche 105 | RPH12 — RH12 GPIO |
| Broche 106 | RPH13 — RH13 GPIO |
| Broche 107 | RPH14 — RH14 GPIO |
| Broche 108 | RPH15 — RH15 GPIO |
| Broche 109 | VDD — Digital supply 2.0-3.6 V |
| Broche 110 | VSS — Ground |
| Broche 111 | RPJ0 — RJ0 GPIO |
| Broche 112 | RPJ1 — RJ1 GPIO |
| Broche 113 | RPJ2 — RJ2 GPIO |
| Broche 114 | RPJ3 — RJ3 GPIO |
| Broche 115 | RPJ4 — RJ4 GPIO |
| Broche 116 | RPJ5 — RJ5 GPIO |
| Broche 117 | RPJ6 — RJ6 GPIO |
| Broche 118 | RPJ7 — RJ7 GPIO |
| Broche 119 | RPJ8 — RJ8 GPIO |
| Broche 120 | RPJ9 — RJ9 GPIO |
| Broche 121 | PGEC1 — ICSP programming clock 1 |
| Broche 122 | PGED1 — ICSP programming data 1 |
| Broche 123 | PGEC2 — ICSP programming clock 2 |
| Broche 124 | PGED2 — ICSP programming data 2 / eDP (exposed die pad - thermal/ground) |
Applications typiques
PIC32MZ0512EFF124T-I/TL convient pour 6 applications: Industrial Ethernet Gateway, USB Host/Device Embedded Device, Automotive Infotainment HMI Controller, Building Automation Controller, Motor Control FOC Drive, Industrial IoT Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ0512EFF124T-I/TL's integrated 10/100 Ethernet MAC and 200 MHz MIPS core make it well suited for industrial protocol gateways (Modbus TCP, EtherNet/IP, PROFINET slave). Its 512 KB Flash holds TCP/IP stacks (TCPIP, NetBIOS, HTTP server) plus application logic; 128 KB SRAM supports multiple concurrent sockets without external memory. The integrated MII/RMII interface connects directly to a PHY such as the KSZ8081. Compared with external Ethernet controllers, the integrated MAC reduces BOM and PCB area.
Recommandé
USB Host/Device Embedded Device
With built-in High-Speed USB 2.0 (480 Mbps) with PHY, the PIC32MZ0512EFF124T-I/TL can act as either USB host (mass storage, HID keyboards) or device (CDC, MSD, vendor-class). The 200 MHz core handles USB stack plus application logic comfortably. Designers can implement USB-C chargers, USB-to-UART bridges, or USB mass-storage data loggers. The 124-VTLA exposes all USB DP/DN pins, VBUS sensing, and the USBID pin for OTG role detection with no external PHY required.
Recommandé
Automotive Infotainment HMI Controller
The PIC32MZ0512EFF124T-I/TL drives automotive HMI panels via its parallel master port (PMP) for TFT displays, I2S for audio, and CAN 2.0b for vehicle bus. The 200 MHz MIPS core and FPU handle JPEG decode, GUI rendering, and audio mixing in real time. The "-I" industrial temperature grade suits cabin environments; designers needing under-hood or engine-bay operation should step up to the -E extended variant. The 97 I/O pins support capacitive touch via the Peripheral Trigger Generator.
Recommandé
Building Automation Controller
Building automation systems (BACnet, Modbus, KNX) benefit from the PIC32MZ0512EFF124T-I/TL's mix of Ethernet (for BACnet/IP), UART/SPI (for sensor and actuator networks), and the industrial temperature range. The 512 KB Flash stores BACnet stack plus scheduling logic; 128 KB SRAM buffers telemetry. Real-time deterministic performance comes from the 200 MHz core combined with Microchip's Harmony peripheral libraries for freeRTOS or bare-metal scheduling.
Recommandé
Motor Control FOC Drive
Field-Oriented Control (FOC) of 3-phase BLDC or PMSM motors requires deterministic PWM generation, fast ADC sampling, and real-time math. The PIC32MZ0512EFF124T-I/TL's 200 MHz core, hardware FPU, and four 64-bit accumulators (single-cycle MAC) execute FOC algorithms in under 5 us per control loop. Nine PWM outputs drive a 3-phase inverter through gate drivers; 18 MSPS ADC samples phase currents with sub-microsecond latency for sensorless control.
Recommandé
Industrial IoT Sensor Hub
Industrial IoT edge nodes aggregate sensor data and forward to cloud services via Ethernet or USB. The PIC32MZ0512EFF124T-I/TL provides enough Flash (512 KB) for TLS 1.2 client + MQTT client + JSON parsing + application logic, while 128 KB SRAM supports TLS handshake buffers. The 12-bit 18 MSPS ADC reads analog sensors; CAN 2.0b interfaces with industrial fieldbus. Industrial -40C to +85C rating suits factory-floor deployment without additional thermal hardening.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFF124T-I/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFF124-I/TL | PIC32MZ0512EFF124-E/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ0512EFE124-E/TL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Connectivity | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB FS, CAN, no Eth (EFE = no-Ethernet) |
| FPU | Yes (IEEE 754) | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest Flash density in 124-VTLA PIC32MZ EF family at 200 MHz (vs PIC32MZ0512EFF064)
- Integrated High-Speed USB 2.0 PHY plus 10/100 Ethernet MAC (vs PIC32MZ0512EFE124-E/TL)
- Industrial temperature -40C to +85C suitable for most factory environments (vs PIC32MZ0512EFF100T-I/PF)
Notes de conception
The 124-VTLA package has an exposed die pad (pin 124 / eDP) that must be soldered to a PCB thermal pad of at least 6x6 mm of continuous copper, with thermal vias to the inner/ground layers. At 200 MHz with all peripherals active, the part dissipates approximately 0.5-0.8 W. Without proper thermal layout, junction temperature can exceed the 125C limit, especially in enclosed industrial enclosures. Recommended: 4-layer board with 2 oz copper on outer layers, or 1 oz with 9 thermal vias (0.3 mm drill) connecting the pad to internal ground planes.
Route the USB DP/DM differential pair with 90 ohm differential impedance, max length 50 mm, with no splits in the reference ground plane beneath. The Ethernet MII/RMII signals should be length-matched within 50 mil (1.27 mm) for the clock and data lanes. Place the 25 MHz Ethernet PHY crystal within 5 mm of the PHY's XIN/XOUT pins with guard ring to ground. Decouple VDD with 100 nF X7R ceramic per supply pin plus a single bulk 4.7 uF tantalum or ceramic near the VTLA's central VDD pins.
Estimated: at 200 MHz core clock drawing ~70 mA active current, an input supply of 2.0V minimum and a 100 mV ripple budget requires the LDO/dCDC regulator to have output impedance below 50 mohm at 100 kHz. Common pitfalls: (1) omitting the 8 MHz primary crystal load capacitors (use 18-22 pF for typical CL=8 pF crystals), (2) leaving PGEC1/PGED1 floating - they must each have a pull-down to ground for production boards even if not using ICSP, (3) forgetting to configure the DEVCFG0/DEVCFG1 fuses for proper oscillator selection, (4) using the EF (with Ethernet) variant firmware on an EFE (no Ethernet) device - the missing Ethernet peripheral registers will cause bus faults.
Informations de conformité
Per Microchip product page, RoHS and REACH compliant. Not AEC-Q100 qualified (PIC32MZ EF family has separate AEC-Q100 variants under different ordering codes). Lead-free and halogen-free per Microchip environmental compliance documentation.