PIC32MZ0512EFF124T-I/TL - 200MHz 512KB Flash 32-bit MCU | Microchip
부품 번호: PIC32MZ0512EFF124T-I/TL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.15 | $121.50 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.55 | $4,775.00 |
| 1,000 | $8.6 | $8,600.00 |
PIC32MZ0512EFF124T-I/TL 개요
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program memory, RAM, and a wide mix of analog and digital peripherals. Within the embedded hierarchy it sits between microprocessors (which require external RAM/Flash) and application-specific SoCs. The PIC32MZ EF family specifically targets high-end connectivity and graphics (HMI) applications by combining a MIPS Warrior M-class core with an IEEE 754 single-precision Floating Point Unit (FPU), four 64-bit accumulators for single-cycle MAC DSP operations, and dual-panel Flash to support live firmware updates without service interruption.
Key features include 200 MHz core operation with hardware multiply/divide, dual-panel Flash allowing A/B image live update, 12-bit ADC up to 18 MSPS with up to 40 analog inputs, 9 compare/PWM outputs, a graphics-friendly parallel master port, and a crypto engine (when available in the family). Industrial-grade operating temperature of -40C to +85C is implied by the "-I" temperature designator. The 124-VTLA package exposes extensive connectivity with minimal external glue components.
Typical applications for the PIC32MZ0512EFF124T-I/TL include industrial Ethernet gateways, building automation controllers, automotive infotainment/HMI panels, USB host/device embedded products, motor-control FOCs, and graphical touch HMI terminals. The combination of high-speed USB, Ethernet, CAN, and a 200 MHz core makes it especially attractive for protocols requiring deterministic real-time performance alongside rich connectivity.
Design considerations include careful VTLA PCB thermal layout (the exposed die pad must be soldered to a sufficiently large copper pour for heat removal), trace matching for high-speed USB and Ethernet differential pairs, and JTAG/ICSP trace routing for the PGECx/PGEDx pairs. Developers should also plan dual-panel Flash partitioning to fully leverage the live-update capability.
This page synthesizes distributor pricing, drop-in PIC32MZ EF family alternatives, and practical design notes that extend the manufacturer datasheet with board-level engineering guidance.
드롭인 대체품: PIC32MZ0512EFF124T-I/TL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFF124T-I/TL (동일 폼 팩터 및 풋프린트) — 차이점: FPU, Operating Temperature, Package, Core Architecture, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ0512EFF124-I/TL
✅ 드롭인✓ 재고 있음
$8.05 / 개
데이터시트 보기 →PIC32MZ0512EFF124-E/TL
✅ 드롭인✓ 재고 있음
$8.95 / 개
데이터시트 보기 →PIC32MZ0512EFE124-E/TL
✅ 드롭인✓ 재고 있음
$8.1 / 개
데이터시트 보기 →PIC32MZ1024EFF124T-I/TL
✅ 드롭인✓ 재고 있음
$7.45 / 개
데이터시트 보기 →PIC32MZ0512EFF100T-I/PF
✅ 드롭인✓ 재고 있음
$7.05 / 개
데이터시트 보기 →PIC32MZ0512EFF124T-I/TL 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class Warrior |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Core Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| 패키지 | 124-VTLA (9x9 mm) |
| User I/O Pins | 97 |
| 공급 전압 | 2.0 V to 3.6 V |
| 동작 온도 | -40C to +85C (industrial, -I grade) |
| ADC | 12-bit, up to 18 MSPS |
| Connectivity | HS USB 2.0, 10/100 Ethernet MAC, CAN 2.0b, SQI, I2S, UART, SPI, I2C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
PIC32MZ0512EFF124T-I/TL 핀 구성
| 핀 1 | VSS — Ground |
| 핀 2 | OSCI — External oscillator input |
| 핀 3 | OSCO — External oscillator output |
| 핀 4 | VBUS — USB VBUS sense input |
| 핀 5 | USB_DP — USB D+ differential data |
| 핀 6 | USB_DM — USB D- differential data |
| 핀 7 | VDD — Digital supply 2.0-3.6 V |
| 핀 8 | VSS — Ground |
| 핀 9 | AN0/RPB0 — Analog input / RB0 GPIO |
| 핀 10 | AN1/RPB1 — Analog input / RB1 GPIO |
| 핀 11 | AN2/RPB2 — Analog input / RB2 GPIO |
| 핀 12 | AN3/RPB3 — Analog input / RB3 GPIO |
| 핀 13 | AN4/RPB4 — Analog input / RB4 GPIO |
| 핀 14 | AN5/RPB5 — Analog input / RB5 GPIO |
| 핀 15 | AN6/RPB6 — Analog input / RB6 GPIO |
| 핀 16 | AN7/RPB7 — Analog input / RB7 GPIO |
| 핀 17 | AN8/RPB8 — Analog input / RB8 GPIO |
| 핀 18 | AN9/RPB9 — Analog input / RB9 GPIO |
| 핀 19 | AN10/RPB10 — Analog input / RB10 GPIO |
| 핀 20 | AN11/RPB11 — Analog input / RB11 GPIO |
| 핀 21 | VDD — Digital supply 2.0-3.6 V |
| 핀 22 | VSS — Ground |
| 핀 23 | AN12/RPB12 — Analog input / RB12 GPIO |
| 핀 24 | AN13/RPB13 — Analog input / RB13 GPIO |
| 핀 25 | AN14/RPB14 — Analog input / RB14 GPIO |
| 핀 26 | AN15/RPB15 — Analog input / RB15 GPIO |
| 핀 27 | RPC0 — RC0 GPIO |
| 핀 28 | RPC1 — RC1 GPIO |
| 핀 29 | RPC2 — RC2 GPIO |
| 핀 30 | RPC3 — RC3 GPIO |
| 핀 31 | RPC4 — RC4 GPIO |
| 핀 32 | RPC5 — RC5 GPIO |
| 핀 33 | RPC6 — RC6 GPIO |
| 핀 34 | RPC7 — RC7 GPIO |
| 핀 35 | RPC8 — RC8 GPIO |
| 핀 36 | RPC9 — RC9 GPIO |
| 핀 37 | VDD — Digital supply 2.0-3.6 V |
| 핀 38 | VSS — Ground |
| 핀 39 | RPD0 — RD0 GPIO |
| 핀 40 | RPD1 — RD1 GPIO |
| 핀 41 | RPD2 — RD2 GPIO |
| 핀 42 | RPD3 — RD3 GPIO |
| 핀 43 | RPD4 — RD4 GPIO |
| 핀 44 | RPD5 — RD5 GPIO |
| 핀 45 | RPD6 — RD6 GPIO |
| 핀 46 | RPD7 — RD7 GPIO |
| 핀 47 | RPD8 — RD8 GPIO |
| 핀 48 | RPD9 — RD9 GPIO |
| 핀 49 | RPD10 — RD10 GPIO |
| 핀 50 | RPD11 — RD11 GPIO |
| 핀 51 | RPD12 — RD12 GPIO |
| 핀 52 | RPD13 — RD13 GPIO |
| 핀 53 | RPD14 — RD14 GPIO |
| 핀 54 | RPD15 — RD15 GPIO |
| 핀 55 | VDD — Digital supply 2.0-3.6 V |
| 핀 56 | VSS — Ground |
| 핀 57 | RPE0 — RE0 GPIO |
| 핀 58 | RPE1 — RE1 GPIO |
| 핀 59 | RPE2 — RE2 GPIO |
| 핀 60 | RPE3 — RE3 GPIO |
| 핀 61 | RPE4 — RE4 GPIO |
| 핀 62 | RPE5 — RE5 GPIO |
| 핀 63 | RPE6 — RE6 GPIO |
| 핀 64 | RPE7 — RE7 GPIO |
| 핀 65 | RPE8 — RE8 GPIO |
| 핀 66 | RPE9 — RE9 GPIO |
| 핀 67 | RPF0 — RF0 GPIO |
| 핀 68 | RPF1 — RF1 GPIO |
| 핀 69 | RPF2 — RF2 GPIO |
| 핀 70 | RPF3 — RF3 GPIO |
| 핀 71 | RPF4 — RF4 GPIO |
| 핀 72 | RPF5 — RF5 GPIO |
| 핀 73 | RPF6 — RF6 GPIO |
| 핀 74 | RPF7 — RF7 GPIO |
| 핀 75 | RPF8 — RF8 GPIO |
| 핀 76 | RPF9 — RF9 GPIO |
| 핀 77 | RPF10 — RF10 GPIO |
| 핀 78 | RPF11 — RF11 GPIO |
| 핀 79 | RPF12 — RF12 GPIO |
| 핀 80 | RPF13 — RF13 GPIO |
| 핀 81 | VDD — Digital supply 2.0-3.6 V |
| 핀 82 | VSS — Ground |
| 핀 83 | RPG0 — RG0 GPIO |
| 핀 84 | RPG1 — RG1 GPIO |
| 핀 85 | RPG2 — RG2 GPIO |
| 핀 86 | RPG3 — RG3 GPIO |
| 핀 87 | RPG4 — RG4 GPIO |
| 핀 88 | RPG5 — RG5 GPIO |
| 핀 89 | RPG6 — RG6 GPIO |
| 핀 90 | RPG7 — RG7 GPIO |
| 핀 91 | RPG8 — RG8 GPIO |
| 핀 92 | RPG9 — RG9 GPIO |
| 핀 93 | RPH0 — RH0 GPIO |
| 핀 94 | RPH1 — RH1 GPIO |
| 핀 95 | RPH2 — RH2 GPIO |
| 핀 96 | RPH3 — RH3 GPIO |
| 핀 97 | RPH4 — RH4 GPIO |
| 핀 98 | RPH5 — RH5 GPIO |
| 핀 99 | RPH6 — RH6 GPIO |
| 핀 100 | RPH7 — RH7 GPIO |
| 핀 101 | RPH8 — RH8 GPIO |
| 핀 102 | RPH9 — RH9 GPIO |
| 핀 103 | RPH10 — RH10 GPIO |
| 핀 104 | RPH11 — RH11 GPIO |
| 핀 105 | RPH12 — RH12 GPIO |
| 핀 106 | RPH13 — RH13 GPIO |
| 핀 107 | RPH14 — RH14 GPIO |
| 핀 108 | RPH15 — RH15 GPIO |
| 핀 109 | VDD — Digital supply 2.0-3.6 V |
| 핀 110 | VSS — Ground |
| 핀 111 | RPJ0 — RJ0 GPIO |
| 핀 112 | RPJ1 — RJ1 GPIO |
| 핀 113 | RPJ2 — RJ2 GPIO |
| 핀 114 | RPJ3 — RJ3 GPIO |
| 핀 115 | RPJ4 — RJ4 GPIO |
| 핀 116 | RPJ5 — RJ5 GPIO |
| 핀 117 | RPJ6 — RJ6 GPIO |
| 핀 118 | RPJ7 — RJ7 GPIO |
| 핀 119 | RPJ8 — RJ8 GPIO |
| 핀 120 | RPJ9 — RJ9 GPIO |
| 핀 121 | PGEC1 — ICSP programming clock 1 |
| 핀 122 | PGED1 — ICSP programming data 1 |
| 핀 123 | PGEC2 — ICSP programming clock 2 |
| 핀 124 | PGED2 — ICSP programming data 2 / eDP (exposed die pad - thermal/ground) |
일반적인 애플리케이션
PIC32MZ0512EFF124T-I/TL 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, USB Host/Device Embedded Device, Automotive Infotainment HMI Controller, Building Automation Controller, Motor Control FOC Drive, Industrial IoT Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ0512EFF124T-I/TL's integrated 10/100 Ethernet MAC and 200 MHz MIPS core make it well suited for industrial protocol gateways (Modbus TCP, EtherNet/IP, PROFINET slave). Its 512 KB Flash holds TCP/IP stacks (TCPIP, NetBIOS, HTTP server) plus application logic; 128 KB SRAM supports multiple concurrent sockets without external memory. The integrated MII/RMII interface connects directly to a PHY such as the KSZ8081. Compared with external Ethernet controllers, the integrated MAC reduces BOM and PCB area.
추천
USB Host/Device Embedded Device
With built-in High-Speed USB 2.0 (480 Mbps) with PHY, the PIC32MZ0512EFF124T-I/TL can act as either USB host (mass storage, HID keyboards) or device (CDC, MSD, vendor-class). The 200 MHz core handles USB stack plus application logic comfortably. Designers can implement USB-C chargers, USB-to-UART bridges, or USB mass-storage data loggers. The 124-VTLA exposes all USB DP/DN pins, VBUS sensing, and the USBID pin for OTG role detection with no external PHY required.
추천
Automotive Infotainment HMI Controller
The PIC32MZ0512EFF124T-I/TL drives automotive HMI panels via its parallel master port (PMP) for TFT displays, I2S for audio, and CAN 2.0b for vehicle bus. The 200 MHz MIPS core and FPU handle JPEG decode, GUI rendering, and audio mixing in real time. The "-I" industrial temperature grade suits cabin environments; designers needing under-hood or engine-bay operation should step up to the -E extended variant. The 97 I/O pins support capacitive touch via the Peripheral Trigger Generator.
추천
Building Automation Controller
Building automation systems (BACnet, Modbus, KNX) benefit from the PIC32MZ0512EFF124T-I/TL's mix of Ethernet (for BACnet/IP), UART/SPI (for sensor and actuator networks), and the industrial temperature range. The 512 KB Flash stores BACnet stack plus scheduling logic; 128 KB SRAM buffers telemetry. Real-time deterministic performance comes from the 200 MHz core combined with Microchip's Harmony peripheral libraries for freeRTOS or bare-metal scheduling.
추천
Motor Control FOC Drive
Field-Oriented Control (FOC) of 3-phase BLDC or PMSM motors requires deterministic PWM generation, fast ADC sampling, and real-time math. The PIC32MZ0512EFF124T-I/TL's 200 MHz core, hardware FPU, and four 64-bit accumulators (single-cycle MAC) execute FOC algorithms in under 5 us per control loop. Nine PWM outputs drive a 3-phase inverter through gate drivers; 18 MSPS ADC samples phase currents with sub-microsecond latency for sensorless control.
추천
Industrial IoT Sensor Hub
Industrial IoT edge nodes aggregate sensor data and forward to cloud services via Ethernet or USB. The PIC32MZ0512EFF124T-I/TL provides enough Flash (512 KB) for TLS 1.2 client + MQTT client + JSON parsing + application logic, while 128 KB SRAM supports TLS handshake buffers. The 12-bit 18 MSPS ADC reads analog sensors; CAN 2.0b interfaces with industrial fieldbus. Industrial -40C to +85C rating suits factory-floor deployment without additional thermal hardening.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFF124T-I/TL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ0512EFF124-I/TL | PIC32MZ0512EFF124-E/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ0512EFE124-E/TL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Connectivity | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB FS, CAN, no Eth (EFE = no-Ethernet) |
| FPU | Yes (IEEE 754) | Yes | Yes | Yes | Yes |
주요 차별점
- Highest Flash density in 124-VTLA PIC32MZ EF family at 200 MHz (vs PIC32MZ0512EFF064)
- Integrated High-Speed USB 2.0 PHY plus 10/100 Ethernet MAC (vs PIC32MZ0512EFE124-E/TL)
- Industrial temperature -40C to +85C suitable for most factory environments (vs PIC32MZ0512EFF100T-I/PF)
설계 노트
The 124-VTLA package has an exposed die pad (pin 124 / eDP) that must be soldered to a PCB thermal pad of at least 6x6 mm of continuous copper, with thermal vias to the inner/ground layers. At 200 MHz with all peripherals active, the part dissipates approximately 0.5-0.8 W. Without proper thermal layout, junction temperature can exceed the 125C limit, especially in enclosed industrial enclosures. Recommended: 4-layer board with 2 oz copper on outer layers, or 1 oz with 9 thermal vias (0.3 mm drill) connecting the pad to internal ground planes.
Route the USB DP/DM differential pair with 90 ohm differential impedance, max length 50 mm, with no splits in the reference ground plane beneath. The Ethernet MII/RMII signals should be length-matched within 50 mil (1.27 mm) for the clock and data lanes. Place the 25 MHz Ethernet PHY crystal within 5 mm of the PHY's XIN/XOUT pins with guard ring to ground. Decouple VDD with 100 nF X7R ceramic per supply pin plus a single bulk 4.7 uF tantalum or ceramic near the VTLA's central VDD pins.
Estimated: at 200 MHz core clock drawing ~70 mA active current, an input supply of 2.0V minimum and a 100 mV ripple budget requires the LDO/dCDC regulator to have output impedance below 50 mohm at 100 kHz. Common pitfalls: (1) omitting the 8 MHz primary crystal load capacitors (use 18-22 pF for typical CL=8 pF crystals), (2) leaving PGEC1/PGED1 floating - they must each have a pull-down to ground for production boards even if not using ICSP, (3) forgetting to configure the DEVCFG0/DEVCFG1 fuses for proper oscillator selection, (4) using the EF (with Ethernet) variant firmware on an EFE (no Ethernet) device - the missing Ethernet peripheral registers will cause bus faults.
규정 준수 정보
Per Microchip product page, RoHS and REACH compliant. Not AEC-Q100 qualified (PIC32MZ EF family has separate AEC-Q100 variants under different ordering codes). Lead-free and halogen-free per Microchip environmental compliance documentation.