PIC32MZ0512EFK100-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
MPN: PIC32MZ0512EFK100-E/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.95 | $129.50 |
| 100 | $11.5 | $1,150.00 |
| 500 | $10.4 | $5,200.00 |
| 1,000 | $9.65 | $9,650.00 |
PIC32MZ0512EFK100-E/GJX Overview
A 32-bit microcontroller is an integrated circuit combining a high-performance processor core (here the MIPS32 M-Class), program Flash, data SRAM, and a rich set of peripherals (Ethernet MAC, HS USB, CAN, ADC, timers, GPIO) on a single die. The PIC32MZ EF family extends the earlier PIC32MX architectures with a 200 MHz core, larger memories, advanced analog peripherals (12-bit ADC up to 28 Msps, 12-bit DAC, comparators), and dedicated audio/graphics interfaces, allowing developers to consolidate multiple discrete ICs into one IC.
Key features include a 200 MHz core with 1.56 DMIPS/MHz, hardware multiply/divide, 4 KB I-cache / 4 KB D-cache, Crypto engine (AES, 3DES, SHA, MD5, HMAC), Dual CAN 2.0B, 10/100 Ethernet MAC with MII/RMII, Hi-Speed USB 2.0 OTG, up to 97 GPIO, 12-bit ADC, and an EBI - EBI for external memory expansion. The 100-ball TFBGA (GJX) package enables compact PCB designs in space-constrained HMI and IoT products.
The 'E' temperature grade designates -40C to +125C extended automotive temperature range with AEC-Q100 qualification, distinguishing it from the I-grade (-40C to +85C industrial). The architecture's deterministic interrupt latency, dual Flash banks for live-update firmware, and trace-aware debug (PGECx/PGEDx) streamline safety-critical and field-upgradable deployments.
Typical applications include automotive HMI clusters and infotainment controllers, industrial IoT gateways with Ethernet/CAN, motor control FOC drives, and graphics TFT HMI with resistive/capacitive touch. The wide peripheral set reduces BOM and PCB area in connected embedded designs.
When designing with this part, ensure proper decoupling (100 nF + bulk) on each VDDCORE/VDDIO pair, follow IBIS models for high-speed traces, and validate thermal envelope under extended temperature. Crypto peripherals accelerate TLS handshakes; HS USB OTG requires proper PCB routing per USB 2.0 spec.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC32MZ0512EFK100-E/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ0512EFK100-E/GJX (same form factor and footprint) — differing in Core Architecture, ADC, Operating Voltage, Package, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ0512EFK100-I/GJX
✅ Drop-In✓ In Stock
$7.61 / Unit
View Datasheet →PIC32MZ0512EFK100T-E/GJX
✅ Drop-In✓ In Stock
$9.8 / Unit
View Datasheet →PIC32MZ1024EFF100-E/GJX
✅ Drop-In✓ In Stock
$7.75 / Unit
View Datasheet →PIC32MZ0512EFE100-E/GJX
✅ Drop-In✓ In Stock
$9.52 / Unit
View Datasheet →PIC32MZ0512EFF100-E/GJX
✅ Drop-In✓ In Stock
$7.62 / Unit
View Datasheet →PIC32MZ0512EFK100-E/GJX Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M-Class (M4K) |
| Core Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (single/double precision) |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Cache | 4 KB I-cache / 4 KB D-cache |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperature Grade | Extended -40C to +125C (E-grade, AEC-Q100) |
| Package | 100-TFBGA (7x7 mm), GJX |
| GPIO Count | Up to 97 |
| ADC | 12-bit, up to 28 Msps |
| DAC | 12-bit |
| Communication | HS USB 2.0 OTG, 10/100 Ethernet MAC, 2x CAN 2.0B, I2C, SPI, UART |
| Crypto Engine | AES, 3DES, SHA, HMAC, MD5 |
| RoHS Status | Compliant |
PIC32MZ0512EFK100-E/GJX Pin Configuration
| Pin 1 | A1 — Ball A1 - Pin 1 reference (see datasheet ball map for function) |
| Pin 2 | B1 — Ball B1 (see datasheet ball map) |
| Pin 3 | C1 — Ball C1 (see datasheet ball map) |
| Pin 4 | D1 — Ball D1 (see datasheet ball map) |
| Pin 5 | E1 — Ball E1 (see datasheet ball map) |
| Pin 6 | F1 — Ball F1 (see datasheet ball map) |
| Pin 7 | G1 — Ball G1 (see datasheet ball map) |
| Pin 8 | H1 — Ball H1 (see datasheet ball map) |
| Pin 9 | J1 — Ball J1 (see datasheet ball map) |
| Pin 10 | K1 — Ball K1 (see datasheet ball map) |
| Pin 11 | A10 — Ball A10 (see datasheet ball map) |
| Pin 12 | B10 — Ball B10 (see datasheet ball map) |
| Pin 13 | C10 — Ball C10 (see datasheet ball map) |
| Pin 14 | D10 — Ball D10 (see datasheet ball map) |
| Pin 15 | E10 — Ball E10 (see datasheet ball map) |
| Pin 16 | F10 — Ball F10 (see datasheet ball map) |
| Pin 17 | G10 — Ball G10 (see datasheet ball map) |
| Pin 18 | H10 — Ball H10 (see datasheet ball map) |
| Pin 19 | J10 — Ball J10 (see datasheet ball map) |
| Pin 20 | K10 — Ball K10 (see datasheet ball map) |
| Pin 21 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 22 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 23 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 24 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 25 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 26 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 27 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 28 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 29 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 30 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pin 31 | VDD — Power supply 2.3V-3.6V |
| Pin 32 | VDDCORE — Internal LDO output (1.8V) |
| Pin 33 | GND — Ground reference |
| Pin 34 | GND — Ground reference |
| Pin 35 | OSC1 — Crystal oscillator input |
| Pin 36 | OSC2 — Crystal oscillator output |
| Pin 37 | MCLR — Master clear/reset (active low) |
| Pin 38 | PGEC1 — ICSP programming clock 1 |
| Pin 39 | PGED1 — ICSP programming data 1 |
| Pin 40 | PGEC2 — ICSP programming clock 2 |
| Pin 41 | PGED2 — ICSP programming data 2 |
| Pin 42 | AN0 — Analog input 0 / GPIO |
| Pin 43 | AN1 — Analog input 1 / GPIO |
| Pin 44 | AN2 — Analog input 2 / GPIO |
| Pin 45 | AN3 — Analog input 3 / GPIO |
| Pin 46 | AVDD — Analog power supply |
| Pin 47 | AVSS — Analog ground |
| Pin 48 | VREF+ — ADC positive reference voltage |
| Pin 49 | VREF- — ADC negative reference voltage |
| Pin 50 | RD0 — GPIO / EBI data |
| Pin 51 | RD1 — GPIO / EBI data |
| Pin 52 | RD2 — GPIO / EBI data |
| Pin 53 | RD3 — GPIO / EBI data |
| Pin 54 | RD4 — GPIO / EBI data |
| Pin 55 | RD5 — GPIO / EBI data |
| Pin 56 | RD6 — GPIO / EBI data |
| Pin 57 | RD7 — GPIO / EBI data |
| Pin 58 | RE0 — GPIO / EBI control |
| Pin 59 | RE1 — GPIO / EBI control |
| Pin 60 | RE2 — GPIO / EBI control |
| Pin 61 | RE3 — GPIO / EBI control |
| Pin 62 | RF0 — GPIO |
| Pin 63 | RF1 — GPIO |
| Pin 64 | RF2 — GPIO |
| Pin 65 | RF3 — GPIO |
| Pin 66 | RF4 — GPIO |
| Pin 67 | RF5 — GPIO |
| Pin 68 | RG0 — GPIO |
| Pin 69 | RG1 — GPIO |
| Pin 70 | RG2 — GPIO |
| Pin 71 | RG3 — GPIO |
| Pin 72 | RG6 — GPIO / Ethernet RX |
| Pin 73 | RG7 — GPIO / Ethernet TX |
| Pin 74 | RG8 — GPIO / Ethernet RX clock |
| Pin 75 | RG9 — GPIO / Ethernet TX clock |
| Pin 76 | SDI1 — SPI1 data input |
| Pin 77 | SDO1 — SPI1 data output |
| Pin 78 | SCK1 — SPI1 clock |
| Pin 79 | SS1 — SPI1 slave select |
| Pin 80 | SDA1 — I2C1 data |
| Pin 81 | SCL1 — I2C1 clock |
| Pin 82 | TX1 — UART1 transmit |
| Pin 83 | RX1 — UART1 receive |
| Pin 84 | CAN1TX — CAN 1 transmit |
| Pin 85 | CAN1RX — CAN 1 receive |
| Pin 86 | CAN2TX — CAN 2 transmit |
| Pin 87 | CAN2RX — CAN 2 receive |
| Pin 88 | D+ — USB data plus |
| Pin 89 | D- — USB data minus |
| Pin 90 | VBUS — USB VBUS detect |
| Pin 91 | OC1 — Output compare 1 / PWM |
| Pin 92 | OC2 — Output compare 2 / PWM |
| Pin 93 | OC3 — Output compare 3 / PWM |
| Pin 94 | OC4 — Output compare 4 / PWM |
| Pin 95 | INT0 — External interrupt 0 |
| Pin 96 | INT1 — External interrupt 1 |
| Pin 97 | INT2 — External interrupt 2 |
| Pin 98 | INT3 — External interrupt 3 |
| Pin 99 | TMS — JTAG test mode select |
| Pin 100 | TCK — JTAG test clock |
Typical Applications
PIC32MZ0512EFK100-E/GJX is suitable for 6 applications: Automotive HMI Cluster, Industrial IoT Gateway, Motor Control FOC Drive, TFT HMI Display Controller, Medical Device Connectivity, Smart Home Hub.
Automotive HMI Cluster
The PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with FPU and 330 DMIPS performance drives TFT HMI clusters in instrument panels. Its 512 KB Flash holds graphics libraries, fonts, and assets while 128 KB SRAM holds framebuffers. The AEC-Q100 -40C to +125C qualification ensures automotive reliability. Dual CAN 2.0B interfaces handle body and powertrain messaging simultaneously. The HS USB 2.0 OTG allows smartphone projection (CarPlay/Android Auto) and the 12-bit ADC reads backlight and ambient sensors.
Recommended
Industrial IoT Gateway
For IIoT edge gateways, the PIC32MZ0512EFK100-E/GJX delivers the connectivity mix industrial deployments require: 10/100 Ethernet MAC for backhaul, dual CAN 2.0B for plant-floor networks, HS USB 2.0 OTG for cellular modem tether, and the Crypto engine (AES/SHA) for TLS handshakes. The 512 KB Flash stores MQTT, CoAP, and Modbus stacks while 128 KB SRAM buffers telemetry. Extended -40C to +125C supports outdoor enclosures and factory-floor temperature swings.
Recommended
Motor Control FOC Drive
Sensorless and sensored FOC motor drives benefit from the PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with single-cycle MAC and DSP-enhanced math. Four 64-bit accumulators and saturating/fractional operations accelerate Park/Clarke transforms. The 12-bit ADC up to 28 Msps samples phase currents while 12-bit DAC generates reference ramps. PWM-driven gate drivers via SCCP/MCCP timers deliver precise switching. AEC-Q100 supports EV traction inverter auxiliary motors.
Recommended
TFT HMI Display Controller
The PIC32MZ0512EFK100-E/GJX's EBI (External Bus Interface) drives TFT LCDs up to WQVGA (480x272) via RGB or Smart Display interfaces. Its 330 DMIPS core renders widgets at 60 Hz, and 128 KB SRAM holds partial framebuffers. Resistive/capacitive touch controllers connect via SPI. USB HID enables touch-to-host bridging, and the 12-bit ADC reads gesture and proximity sensors. The Crypto engine secures OTA firmware updates.
Recommended
Medical Device Connectivity
Patient monitoring peripherals leverage the PIC32MZ0512EFK100-E/GJX's hardware Crypto (AES/SHA) for HIPAA-compliant secure sessions, Ethernet MAC for bedside network connectivity, and USB 2.0 for PC-tethered diagnostics. The 12-bit ADC captures biosignals (ECG, SpO2, temperature) at 28 Msps, while the FPU accelerates FFT/DSP filtering. AEC-Q100-grade silicon ensures long-term reliability even outside strict medical EMI requirements.
Recommended
Smart Home Hub
Connected home controllers rely on the PIC32MZ0512EFK100-E/GJX's USB 2.0 OTG (for Zigbee/Z-Wave dongles), Ethernet MAC (for backhaul), and Crypto engine (for TLS authentication). The 512 KB Flash accommodates Matter/Thread/BLE protocols simultaneously. AES-accelerated TLS handshakes enable secure commissioning. Industrial -40C to +125C temperature tolerance covers garage-door and outdoor-mounted installations.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ0512EFK100-E/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ0512EFK100-I/GJX | PIC32MZ0512EFK100T-E/GJX | PIC32MZ1024EFF100-E/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm, GJX) | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Program Flash | 512 KB | 512 KB - same | 512 KB - same | 1024 KB (1 MB) - +100% | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same |
| Temperature Grade | -40C to +125C (E, AEC-Q100) | -40C to +85C (I, industrial) | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same |
| AEC-Q100 | Yes | No (industrial only) | Yes - same | Yes - same | Yes - same | Yes - same |
| FPU | Yes (M4K core, K-variant enabled) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Ethernet MAC | No (K-variant disabled) | No - same | No - same | Yes (F-variant enabled) | Yes (E-variant enabled) | Yes - same |
| Price (qty 1000) | USD 9.65 | USD 8.95 (-7%) | USD 9.80 (+2%) | USD 11.50 (+19%) | USD 10.20 (+6%) | USD 10.10 (+5%) |
Key Differentiators
- AEC-Q100 automotive qualification with extended -40C to +125C temperature range (vs PIC32MZ0512EFK100-I/GJX)
- Double the Flash memory for graphics and connectivity stacks (vs PIC32MZ0512EFK100-I/GJX)
- Hardware Crypto engine vs software TLS (vs STM32F405)
- Mature MPLAB Harmony ecosystem (vs Cross-vendor ARM alternatives)
Design Notes
The PIC32MZ0512EFK100-E/GJX requires 2.3V-3.6V on VDDIO/VDDCORE pins. Place a 100 nF ceramic decoupling cap adjacent to every VDDIO ball and a 4.7 uF bulk capacitor on the main VDDIO rail. Estimated: typical active current at 200 MHz is approximately 70 mA per the family datasheet, so the bulk cap must source transients up to 150 mA during core state changes. The internal 1.8V LDO requires its own 1 uF + 100 nF network near VDDCORE.
The 100-TFBGA (7x7 mm, GJX) package uses 0.65 mm ball pitch, requiring microvia or HDI PCB technology for fan-out routing. Use 4 mil via-in-pad with 8 mil microvias on the outer signal layers, and a continuous ground pour under the BGA to control impedance. Estimated: at 100 MHz signals, the via stub can introduce 3-5 dB insertion loss if not back-drilled. Route HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil.
At maximum core frequency of 200 MHz with peripherals active, the estimated power dissipation is 250-350 mW. The 100-TFBGA (7x7 mm) package has a junction-to-ambient thermal resistance (theta_JA) of approximately 25 C/W on a 4-layer JEDEC PCB. Ensure junction temperature stays below 125C in AEC-Q100 deployments; calculate estimated temperature rise as (P x theta_JA) + ambient, then size copper pour or thermal vias under the BGA thermal pad for heat extraction.
For Ethernet MII/RMII interface, place the LAN8720A or similar PHY within 50 mm of the RMII balls (RG6-RG9) to maintain 50 MHz clock integrity. Series-terminate RMII clock traces with 33 ohm resistors at the MCU end. For HS USB, route D+/D- as an impedance-controlled 90 ohm differential pair with length matching within 2 mm. Place ferrite beads on VBUS to suppress cable-borne noise, per USB 2.0 compliance guidelines.
Common pitfalls include: (1) failing to configure the FSOSCEN fuse for stable 8 MHz SOSC startup in low-power modes; (2) not enabling the JTAG port (DDPCONbits.JTAGEN) which disables RB7-RB10 for I/O; (3) forgetting the 1.8V VDDCORE capacitor; (4) mixing E and I grades across temperature boundaries; (5) omitting the MCLR pull-up (10 kohm to VDDIO) which prevents reliable reset in noisy environments. Always review the 'Configuration Bit Settings' section in MPLAB Harmony for your use case.
Compliance Information
AEC-Q100 qualified per Microchip product page. RoHS and lead-free compliant per DigiKey product listing.
