PIC32MZ2025DAS176T-I/2J - 200MHz MCU 2MB Flash Graphics | Microchip
MPN: PIC32MZ2025DAS176T-I/2J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.92 | $18.92 |
| 10 | $17.03 | $170.30 |
| 100 | $15.14 | $1,514.00 |
| 500 | $13.62 | $6,810.00 |
| 1,000 | $12.11 | $12,110.00 |
PIC32MZ2025DAS176T-I/2J Overview
What is a PIC32MZ DA microcontroller? The PIC32MZ DA family sits within Microchip's 32-bit MCU portfolio as a high-integration, graphics-capable part aimed at applications that traditionally required an MPU plus external peripherals. It combines the deterministic interrupt behaviour of an MCU with MPU-class peripherals - large stacked DRAM, LCD controller and 2D graphics engine - in a single die. Within the broader taxonomy: PIC32MZ DA belongs to PIC32MZ -> PIC32 -> 32-bit MCU -> microcontroller -> embedded semiconductor.
Key features of the target part include a MIPS32 microAptiv core with hardware multiply/divide and DSP extensions, an L1 cache subsystem, dual Flash panels for live update, a 32 MB on-chip DDR2 interface, up to 120 general-purpose I/O, six UART, six SPI/I2S, six I2C, an HS USB 2.0 OTG controller, two CAN modules, a 12-bit 18 MSPS ADC with up to 45 inputs, six general-purpose timers/output compare, a parallel master port, and an SQI interface. Operating voltage is 1.8 V (core) with 3.3 V-tolerant I/O.
Architecturally the device uses a 5-stage pipeline microAptiv core, dual-bank Flash for run-time reprogramming, a tightly-coupled DDR2 controller feeding a graphics engine that drives TFT panels, and a peripheral bus that supports DMA-driven transfers to the ADC, USB, CAN and SQI blocks. Compared with the larger PIC32MZ2025DAH176 (128 MB DRAM) the DAS variant integrates 32 MB DRAM, lowering BOM cost for screens up to approximately 5 inch WVGA.
Typical applications include HMI/GUI panels on industrial equipment, point-of-sale terminals, medical patient monitors, automotive instrument clusters and cluster displays, IoT edge gateways with local graphics, and home appliances with colour touch displays. The exposed thermal pad aids heat spreading for sustained 200 MHz operation.
Design considerations include providing a low-impedance 1.8 V core supply, sequencing of the DDR2 power rails, programming the EBI configuration for the target panel timing, and reserving sufficient PCB area for the 20 x 20 mm LQFP land pattern plus its thermal pad.
This page synthesises distributor pricing, drop-in variants from the same PIC32MZ DA family, and practical design notes not found in the standalone datasheet.
Drop-in alternatives for PIC32MZ2025DAS176T-I/2J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2025DAS176T-I/2J (same form factor and footprint) — differing in Package, CAN, Graphics Controller, Operating Temperature, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ2025DAH176T-I/2J
✅ Drop-In✓ In Stock
$6.35 / Unit
View Datasheet →PIC32MZ2025DAR176-I/2J
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ2025DAK176-I/2J
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →PIC32MZ2025DAL176-I/2J
✅ Drop-In✓ In Stock
$6.95 / Unit
View Datasheet →PIC32MZ2025DAG176-I/2J
✅ Drop-In✓ In Stock
$11.2 / Unit
View Datasheet →PIC32MZ1025DAS176T-V/2J
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →PIC32MZ2025DAS176T-I/2J Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Core Frequency | 200 MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 256 KB |
| On-chip DRAM | 32 MB DDR2 (stacked) |
| Package | 176-LQFP (20 x 20 mm) with exposed pad |
| Operating Temperature | -40C to +85C (industrial, I-temp) |
| Operating Voltage (Core) | 1.8 V |
| I/O Voltage | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics | Integrated Graphics Controller + Graphics Processor (GPU) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN modules |
| UART / SPI / I2C | 6 / 6 / 6 |
| GPIO | Up to 120 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
PIC32MZ2025DAS176T-I/2J 176-lqfp (20 x 20 mm) with exposed pad Pin Configuration Guide
Pin configuration for PIC32MZ2025DAS176T-I/2J (176-lqfp (20 x 20 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ2025DAS176T-I/2J.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ2025DAS176T-I/2J is suitable for 7 applications: Industrial HMI / Operator Panels, Point-of-Sale Terminals, Medical Patient Monitors, Automotive Instrument Clusters, IoT Edge Gateways with Local Graphics, Home Appliance Touch Displays, Audio Mixing Consoles with Displays.
Industrial HMI / Operator Panels
The PIC32MZ2025DAS176T-I/2J is well-suited to industrial HMI panels driving 4.3 inch to 5 inch WVGA TFTs. The integrated Graphics Controller + GPU offloads blit and alpha-blend, leaving the 200 MHz MIPS32 microAptiv core free to run Modbus/TCP, EtherCAT or PROFINET stacks. The on-chip 32 MB DDR2 frame buffer eliminates external SDRAM, reducing PCB layer count. Designers gain 120 GPIO for keys, encoders and status LEDs, while the 12-bit 18 MSPS ADC supports 4-wire resistive touch sensing with simultaneous analog sensor sampling. The 176-LQFP (20 x 20) footprint and I-temp grade (-40C to +85C) suit sealed cabinet installation.
Recommended
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAS176T-I/2J's combination of HS USB OTG, integrated graphics and 2 MB Flash. The USB OTG port supports peripherals such as barcode scanners and receipt printers, while the 32 MB on-chip DDR2 holds transaction UI frames at full colour depth. The 12-bit ADC scans keypad matrices and battery telemetry. The 256 KB SRAM supports TLS session buffers without external memory. The 176-LQFP (20 x 20) package fits into compact POS mainboards, and the industrial temperature range suits semi-outdoor retail environments. Tape-and-reel packaging supports high-volume SMT assembly.
Recommended
Medical Patient Monitors
Medical patient monitors leverage the PIC32MZ2025DAS176T-I/2J's 12-bit 18 MSPS ADC with 45 analog inputs for multi-channel ECG/SpO2 acquisition while the integrated GPU draws real-time waveforms on a colour TFT. The 2 MB Flash stores waveform UI assets and protocol stacks; the 256 KB SRAM supports rolling buffers. The MIPS32 microAptiv core's deterministic interrupt response ensures sample timing is preserved even during GUI redraws. The 176-LQFP with exposed thermal pad simplifies heat-spreading layouts. Designers should validate IEC 60601-1 compliance at the system level - this MCU alone does not constitute a medical device.
Recommended
Automotive Instrument Clusters
Automotive instrument cluster prototypes use the PIC32MZ2025DAS176T-I/2J to drive dual-display clusters (speedometer + infotainment tile) with the integrated GPU handling needle and icon animations. The dual CAN modules connect to vehicle networks, HS USB supports media/phone projection, and the 12-bit ADC samples fuel and temperature sensors. The 32 MB DDR2 holds full-HD background bitmaps. Designers targeting production should migrate to AEC-Q100 qualified parts; the I/2J industrial temperature variant is suitable for cabin electronics only. The 176-LQFP (20 x 20) footprint matches the cluster mainboard keep-out.
Recommended
IoT Edge Gateways with Local Graphics
IoT edge gateways with a local display use the PIC32MZ2025DAS176T-I/2J to consolidate Wi-Fi/Ethernet telemetry, Modbus polling and a colour status panel into one MCU. The HS USB OTG acts as a device port for commissioning, the six UART/SPI/I2C peripherals connect radios and sensors, and the Graphics Controller draws touch UI without an external GPU. The 2 MB Flash supports OTA staging with dual-bank live update, while the 256 KB SRAM buffers MQTT payloads. The industrial temperature grade and exposed thermal pad support DIN-rail enclosure operation.
Recommended
Home Appliance Touch Displays
Premium home appliances (ovens, refrigerators, washing machines) integrate the PIC32MZ2025DAS176T-I/2J to drive animated colour touch interfaces while the MIPS32 core runs the appliance state machine. The GPU accelerates icon scaling during rotation events, while the 32 MB DDR2 holds multilingual UI assets. The 12-bit ADC scans capacitive touch controllers and NTC temperature sensors. Six I2C buses interface to motor controllers and sensor hubs. The industrial temperature range covers indoor enclosures; the 176-LQFP (20 x 20) footprint allows through-hole or reflow assembly depending on factory capability.
Recommended
Audio Mixing Consoles with Displays
The PIC32MZ2025DAS176T-I/2J fits digital audio mixing consoles where the GPU draws VU meters, FFT spectrograms and fader animations on a colour TFT while the MIPS32 core handles MIDI, USB audio and DSP routing. Six I2S peripherals interface to audio codecs, six UART connect to channel strips, and the 12-bit ADC scans motorized faders and rotary encoders. The 32 MB DDR2 stores spectrum analyser frame history. Tape-and-reel and exposed thermal pad simplify volume SMT assembly and thermal management in densely populated mixer chassis.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2025DAS176T-I/2J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ2025DAH176T-I/2J | PIC32MZ2025DAR176-I/2J | PIC32MZ2025DAK176-I/2J | PIC32MZ2025DAL176-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ1025DAS176T-V/2J |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) - same | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| On-chip DRAM | 32 MB DDR2 | 128 MB DDR2 | 32 MB DDR2 | 32 MB DDR2 | 32 MB DDR2 | 32 MB DDR2 | 32 MB DDR2 |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| ADC | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | V-temp (-40C to +105C) |
Key Differentiators
- Larger DRAM than DAH at lower BOM cost is wrong direction - DAS has 32 MB vs DAH 128 MB (vs PIC32MZ2025DAH176T-I/2J)
- Lower Flash variant in same package for cost-down (vs PIC32MZ1025DAS176T-V/2J)
- Tape-and-reel / non-T&R code variants (vs PIC32MZ2025DAR176-I/2J)
- Integrated GPU removes external graphics controller (vs Generic Cortex-M4 MCU)
Design Notes
The PIC32MZ2025DAS176T-I/2J requires a clean 1.8 V core rail (VddCore) and a 3.3 V I/O rail. Per the PIC32MZ DA datasheet, sequence VddCore before VddIO to avoid latch-up; a Schottky diode or load-switch such as SiP32431 between the rails enforces ordering. Place 100 nF decoupling within 2 mm of every Vdd pin and at least one 4.7 uF bulk capacitor near the exposed thermal pad. The DDR2 PHY rail (1.8 V DDR_VDD) needs its own 4.7 uF bulk to support burst refresh.
At 200 MHz with the GPU continuously rendering, the device dissipates up to ~700 mW internally. Use the exposed thermal pad (EP) as the primary heat path: stitch at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) under the pad to an inner copper pour. Estimate: theta_JA drops from ~40 C/W (no EP copper) to ~22 C/W with a 2 cm^2 EP copper pour, keeping Tj well below the 125 C limit even in sealed enclosures.
The 176-LQFP (20 x 20 mm) has a 0.5 mm pitch. Use 0.25 mm-wide traces between pads with 0.2 mm spacing, and route DDR2 address/command/clock traces with 50 ohm controlled impedance plus length matching to +/-25 mil. The Graphics LCD data bus is 24-bit wide; route on inner layers with ground reference to maintain signal integrity. Keep the 12-bit ADC analog traces away from the DDR2 clock to avoid -3 dB SNR degradation.
Common pitfalls: (1) forgetting to populate the DDR2 termination resistors on the fly-by address/command bus; (2) using the wrong boot configuration pins to select external vs internal Flash; (3) ignoring the errata for the silicon revision - always check the device-specific silicon errata data sheet before signing off firmware; (4) relying on the 32 MB DDR2 as general-purpose RAM without enabling the MMU, which can cause cache aliasing for DMA buffers.
The DDR2 controller runs at up to 200 MHz with on-die termination required. Place the 100 ohm differential termination resistors within 200 mil of the MCU pads for the clock pair. For the parallel TFT bus, use series damping resistors (22-33 ohm) at the source end to suppress ringing on long flat-panel cables. Eye-diagram validation on the DDR2 bus is recommended above 160 MHz operation; check the read/write de-skew per the DDR2 layout checklist.
Compliance Information
I/2J suffix denotes industrial temperature grade (-40C to +85C) per Microchip ordering code. Not AEC-Q100 qualified; for automotive use select a Q-grade variant. RoHS compliant per Microchip product page; halogen-free status not stated in the verified data - mark as unknown.
