S25FL256SAGNFI003 - 256Mb Quad SPI NOR Flash, 133MHz | Infineon
MPN: S25FL256SAGNFI003 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.32 | $3.32 |
| 10 | $2.95 | $29.50 |
| 100 | $2.48 | $248.00 |
| 500 | $2.18 | $1,090.00 |
| 1,000 | $1.92 | $1,920.00 |
| 3,000 | $1.65 | $4,950.00 |
S25FL256SAGNFI003 Overview
A NOR Flash memory is a type of non-volatile storage that allows random byte-level read access, similar to a ROM, while also supporting in-system program and erase operations. Unlike NAND Flash, which is optimized for sequential high-density block storage, NOR Flash offers faster read access times and execute-in-place (XIP) capability, allowing microcontrollers to run code directly from the flash array. The SPI (Serial Peripheral Interface) bus reduces pin count from the parallel NOR alternative, with Quad SPI extending throughput to four bits per clock cycle for bandwidth-intensive boot and data-logging workloads.
Key features include 2.7V to 3.6V single supply operation, 8 ns initial access time, hardware and software write protection, a 256-byte page programming buffer, and a 4 KB sector erase granularity with uniform 64 KB block erase support. The part supports JEDEC-standard 3-byte addressing (extendable to 4-byte via command), standard SPI (1-1-1), Dual SPI (1-1-2, 1-2-2), and Quad SPI (1-1-4, 1-4-4) modes for flexible throughput scaling. An integrated ECC engine corrects single-bit errors during page programming, raising effective yield for long-lifecycle deployments.
The S25FL256SAGNFI003 is qualified across the -40C to +85C industrial temperature range and complies with MSL-3 (168-hour) moisture sensitivity, suitable for standard SMT reflow assembly. Its WSON-8 (6x8) EP package with thermal pad provides a low-profile footprint for space-constrained designs and excellent thermal dissipation for in-system reprogramming workloads.
Typical applications include firmware boot storage for ARM Cortex-M/R/A microcontrollers, IoT sensor data logging, automotive infotainment (non-safety), industrial HMI panels, set-top box firmware, and wireless module configuration. The wide Quad SPI bandwidth makes it well-suited for systems requiring fast XIP code execution or rapid OTA update buffering.
When designing with this device, observe the 4 KB sector erase alignment for parameter storage and use 64 KB block erase for bulk firmware updates. Place a 1uF decoupling capacitor close to VCC and follow JEDEC JESD22-A114 ESD handling protocols during board assembly.
This page synthesizes distributor pricing from DigiKey, Mouser, LCSC, and Newark, plus drop-in S25FL family alternatives and practical PCB design guidance that complements the manufacturer datasheet.
Drop-in alternatives for S25FL256SAGNFI003 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S25FL256SAGNFI000
✅ Drop-In📋 Reference alternative (not in catalog)
S25FL256SAGNFI001
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S25FL256SAGMFI003
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W25Q256JVEIQ
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MX25L25673G
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IS25LP256D
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S25FL256SAGNFI003 Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash (Serial SPI) |
| Memory Size | 256 Mbit (32 MB) |
| Interface | SPI, Dual SPI, Quad SPI |
| Maximum Clock Frequency | 133 MHz |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Initial Access Time | 8 ns |
| Page Programming Buffer | 256 bytes |
| Sector Erase Size | 4 KB (uniform) |
| Block Erase Size | 64 KB |
| Program/Erase Endurance | 100,000 cycles per sector |
| Data Retention | 20 years |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 8-WSON (6x8 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| ECC Support | Single-bit correction |
| Write Protection | Hardware (WP#) and Software |
| RoHS Status | Compliant |
S25FL256SAGNFI003 Pin Configuration
| Pin 1 | CS# — Chip Select (active low) |
| Pin 2 | SO/IO1 — Serial Data Out / IO1 (Quad SPI data) |
| Pin 3 | WP#/IO2 — Write Protect (active low) / IO2 |
| Pin 4 | GND — Ground |
| Pin 5 | SI/IO0 — Serial Data In / IO0 |
| Pin 6 | SCK — Serial Clock |
| Pin 7 | HOLD#/IO3 — Hold (active low) / IO3 |
| Pin 8 | VCC — Power Supply (2.7V to 3.6V) |
Typical Applications
S25FL256SAGNFI003 is suitable for 6 applications: ARM Cortex-M Firmware Boot Flash, IoT Sensor Data Logger, Industrial HMI Panel Storage, Set-Top Box Firmware Storage, Wireless Module Configuration Memory, Consumer Appliance User Interface Storage.
ARM Cortex-M Firmware Boot Flash
The S25FL256SAGNFI003 is a natural fit as the primary boot Flash for ARM Cortex-M4/M7 microcontrollers in industrial and IoT designs. With 256 Mbit (32 MB) of storage it comfortably holds a secure bootloader, the main application image, and a secondary OTA staging partition. At 133 MHz Quad SPI the device delivers up to 66 MB/s read bandwidth, sufficient for execute-in-place (XIP) operation so the MCU can run code directly from Flash without copying to RAM. The 2.7V-3.6V single-rail supply matches typical MCU VCCIO domains and the 8-WSON (6x8) footprint keeps the BOM small. Designers typically pair it with STM32, NXP i.MX RT, or Renesas RA Cortex-M parts for compact industrial control boards.
Recommended
IoT Sensor Data Logger
In IoT endpoint nodes that periodically log environmental or vibration data, the S25FL256SAGNFI003 provides 32 MB of non-volatile storage for months of timestamped samples. Its 100,000 P/E cycle endurance and 20-year data retention allow long deployment lifetimes even with frequent writes to a wear-leveled file system. Quad SPI bandwidth at 133 MHz lets the host MCU read back historical data quickly over the air during maintenance windows, while the small 8-WSON (6x8 mm) footprint fits inside sensor housing PCBs. The 4 KB sector erase granularity suits small packet writes, and the built-in ECC engine corrects single-bit errors that might otherwise corrupt long-term log entries.
Recommended
Industrial HMI Panel Storage
Industrial human-machine interface (HMI) panels use the S25FL256SAGNFI003 to store the LVGL/embedded-Wizard graphical assets, fonts, and multilingual strings that drive the touchscreen UI. At 256 Mbit the device can hold a full set of UI bitmaps for multiple languages plus configuration data. Quad SPI enables fast screen-redraw cycles by streaming compressed graphics assets on demand, while the -40C to +85C industrial temperature rating supports factory-floor and outdoor cabinet installations. The hardware WP# pin allows the integrator to lock down calibration parameters at production time without firmware intervention.
Recommended
Set-Top Box Firmware Storage
Set-top boxes and home gateways use the S25FL256SAGNFI003 to store the bootloader, kernel image, root file system, and user configuration data for Linux-based SoCs. The 32 MB capacity supports a compact Linux distribution plus an A/B OTA partition scheme for fail-safe firmware updates. Quad SPI bandwidth at 133 MHz keeps boot time short even with full system images, and the WSON-8 (6x8) EP package provides a robust thermal path for in-system programming during factory provisioning. The hardware HOLD#/IO3 pin allows the host SoC to pause serial transactions cleanly when servicing higher-priority interrupts.
Recommended
Wireless Module Configuration Memory
Wi-Fi, Bluetooth, and LoRa wireless modules frequently use the S25FL256SAGNFI003 as a configuration and firmware host for the on-module radio SoC. The 256 Mbit density holds MAC address tables, regulatory certificates, and OTA update staging areas that are too large for the radio's internal Flash. Quad SPI at 133 MHz keeps firmware load times minimal during module power-up, and the industrial temperature grade suits outdoor and industrial deployments. The 8-WSON package aligns with the compact module form factors used in Matter, Thread, and Wi-Fi 6 modules.
Recommended
Consumer Appliance User Interface Storage
White goods, smart thermostats, and connected appliances use the S25FL256SAGNFI003 to store user preferences, scheduling rules, and firmware images that must survive power cycles for the lifetime of the product. The 20-year data retention and 100,000 P/E cycle endurance guarantee long service life even when the user frequently changes schedules. The 8-WSON package fits inside compact appliance control boards, and Quad SPI lets the appliance UI respond quickly when the user adjusts settings. Designers benefit from the JEDEC-standard SFDP discovery registers that allow the host MCU to auto-detect part parameters at boot, simplifying firmware portability across appliance models.
Recommended
Recommended Products Summary
Engineering reference data for S25FL256SAGNFI003 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S25FL256SAGNFI000 | S25FL256SAGMFI003 | W25Q256JVEIQ | MX25L25673G | IS25LP256D |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Winbond | Macronix | ISSI |
| Package | 8-WSON (6x8 mm) EP | 8-WSON (6x8 mm) EP - same | 8-WSON (6x8 mm) EP - same | 8-WSON (6x8 mm) - same | 8-WSON (6x8 mm) - same | 8-WSON (6x8 mm) - same |
| Memory Density | 256 Mbit (32 MB) | 256 Mbit (32 MB) | 256 Mbit (32 MB) | 256 Mbit (32 MB) | 256 Mbit (32 MB) | 256 Mbit (32 MB) |
| Interface | Quad SPI (1-1-4, 1-4-4) | Quad SPI | Quad SPI | Quad SPI | Quad SPI | Quad SPI |
| Max Clock Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Supply Voltage | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V |
| Endurance (P/E Cycles) | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Data Retention | 20 years | 20 years | 20 years | 20 years | 20 years | 20 years |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Key Differentiators
- Infineon MirrorBit process with single-bit ECC engine (vs W25Q256JVEIQ (Winbond))
- Industrial -40 C to +85 C qualification across full density (vs MX25L25673G (Macronix))
- JEDEC SFDP auto-discovery registers simplify firmware portability (vs IS25LP256D (ISSI))
Design Notes
Place a 0.1uF X7R ceramic decoupling capacitor as close as possible to the VCC pin (pin 8) of the S25FL256SAGNFI003, with the trace to the capacitor kept under 2 mm to minimize parasitic inductance. The exposed thermal pad on the underside of the WSON package must be soldered to a continuous PCB ground plane, both for mechanical reliability and to provide a low-impedance return path for the high-speed Quad SPI signals. Keep SPI traces short and length-matched within 5 mm to preserve signal integrity at 133 MHz; use a 50 ohm characteristic impedance if the bus length exceeds 25 mm.
Do not attempt Quad SPI read commands (such as the 0x6B fast-read quad output) on the S25FL256SAGNFI003 before driving CS# low and clocking the required number of dummy cycles per the SFDP table; failing to honor dummy cycles yields corrupted reads. Also ensure WP# and HOLD# are tied high through a 10 kohm pull-up if unused, since leaving them floating can latch the part into a held or write-protected state during reset. Always issue a 0x06 Write Enable command before any program or erase sequence.
Route the S25FL256SAGNFI003 SPI bus on an inner PCB layer sandwiched between ground planes to reduce EMI emissions at 133 MHz. Place a 22-33 ohm series resistor near the SCK source to dampen ringing on long traces, and avoid routing SPI traces adjacent to switching power converter nodes to prevent injected noise from corrupting read commands. Keep the CS# trace short and free of vias for reliable chip-select timing at high clock rates.
Compliance Information
RoHS and REACH compliant per Infineon product page. The industrial-grade S25FL256SAGNFI003 is not AEC-Q100 qualified; Infineon offers AEC-Q100 variants in the same family (S25FL256SAGNFI003A/S25FL256SAGNFI003M) for automotive designs.
